• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.129-129
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• 2017

열전재료는 열에너지를 전기에너지로 또는 전기에너지를 열에너지로 직접 변환하는데 가장 널리 사용되는 재료이다. $Bi_2Te_3$계 열전 재료는 400K 이하의 비교적 저온 영역에서 높은 성능지수(Dimensionless Figure of merit, ZT($={\alpha}2{\sigma}T/{\kappa}$, ${\alpha}$: 제백계수, ${\sigma}$: 전기전도도, T: 절대온도, ${\kappa}$: 열전도도))를 나타내는 열전재료이며 자동차 시트나 정수기 등에 응용되고 있다. 열전모듈은 제조시 수십 개에서 수백 개 이상의 n형 및 p형 열전소자를 알루미나($Al_2O_3$)와 같은 세라믹 기판(substrate) 상에 접합된 동 전극 위에 전기적으로 서로 직렬로 접합시켜 제조한다. 기존의 열전모듈의 제조방법에는 동 전극 위에 위에 Sn합금 분말과 플럭스(flux)의 혼합물인 솔더페이스트를 스크린 인쇄법을 사용하여 동 전극에 도포한 다음, 그 위에 열전소자를 얹고 약 520K의 열풍을 가하여 솔더를 용융시켜 열전소자와 동 전극을 접합시킨다. 스크린 인쇄법에서는 인쇄 압력이 일정하지 않으면, 솔더페이스트 층의 두께가 균일하지 않게 되어 열전소자 접합부의 불량을 유발시킨다. 그러나 열모듈은 단 하나의 접합 불량이 모듈 전체의 열전변환성능에 심각한 영향을 줄 수 있기 때문에 본 연구에서는 이러한 문제점을 해결하기 위해, 솔더페이스트를 도포하지 않고 열전소자를 직접 동 전극과 접합할 수 있는 방법을 고안하였다. 무전해도금을 이용한 니켈층을 형성시킨 $Bi_2Te_3$계 열전소자 표면에 약 $50{\mu}m$의 주석도금층을 전기도금법을 구사하여 형성시켰다. 그 후, wire cutting을 통하여 $3mm{\times}3mm{\times}3mm$의 크기로 절단한 주석도금된 열전소자를 동 전극에 얹고 1.1KPa의 압력을 가하면서 523K의 핫플레이트 위에서 3분간 방치하여 직접(direct) 열압착 접합을 실시하였다. 접합부의 단면을 SEM을 이용하여 관찰한 결과, 동 전극과 열전소자 사이의 계면에 용융 후 응고된 주석층이 결함없이 균일하게 형성된 양호한 접합부를 관찰할 수 있었다. 따라서, 솔더페이스트를 이용하지 않고, 열전소자 표면에 주석도금을 실시한 후, 동 전극과 직접 열압착 본딩을 실시하는 방법은 균일한 접합계면을 얻을 수 있는 새로운 공정으로 기대된다.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.835-837
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• 2017

In this paper, manufacturing processes of cylindrical composite lattice structures using filament winding method was described. Cylindrical composite lattice structures were manufactured in accordance with four major steps. Silicon mold of lattice shape was installed on mandrel and then continuous fiber was wound on silicon mold. After winding process, in order to ensure the same thickness for all regions, compression process was done for its intersection parts. Finally, the composite lattice structure was demoulded after curing in oven. It was found that the manufactured cylindrical composites lattice structure had 2.4% of dimensional error compared to the design requirements.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.245-249
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• 2009

According to the increase of intelligent vehicles many automotive electric components are installed. The wire harness which connects those also increases. The crimping process for compressing the copper wire bundle into the terminal is a key process to assure the good quality of wire harness. For the case of inadequate forming condition many shape failures such as less-filling, over-filling are happen in the crimping process. Even though the quality of crimping shape is satisfactory the quality check for electrical resistance of wire harness is sometime not satisfied the qualification due to large variation of electrical resistance of wire harness under climate test. This large variation is thought to be related with the malfunction automotive electric system and caused by the internal stress of wire, which occurred during the crimping process. In this paper we develop the 3D-FEM simulation scheme and design methodology of optimum terminal shape. Also the effect of terminal shape on the residual stress is discussed.

• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.32-38
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• 2006

In this study, we used a sericite which is a cheap price antibacterial agent and had excellent results. The particle size of sericite was fixed to $15{\mu}m$. The effect of the peel strength is not affected by several types of adhesives. Peel strength is increased with increasing adhesive content, and satisfied standard value of peel strength when adhesive content is $20g/m^2$. Laundering cotton fabric treated with antibacterial agent, the optimum content satisfying Korean Standard (KS) is 8%. Continuous processing conditions for antibacterial treatment on the footwear cotton fabrics are follows : melting temperature $120^{\circ}C$, cooling time 20 s, pressing temperature $130^{\circ}C$, pressing time 30 s.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.11-18
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• 2011

The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.29-36
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• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• Resources Recycling
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• v.9 no.6
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• pp.53-57
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• 2000

In the present paper, a current technical progress for recycling of used steel can is described. The developed technology was a kind of pre-treatment through an automatic equipment system to increase recycling and melting efficiency of used steel co. The process consisted of several unit processes such as breaking of steel can bale, removing dust, separation of aluminum can, delacquering, and compressing to bale. Also, aluminum powders were recovered as a by-product at the delacquering step. The process was carried out automatically through by use of the developed equipment system. The automatic system could be very available in mass treatment of used steel can.

• Resources Recycling
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• v.7 no.5
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• pp.13-18
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• 1998

This study was carried out to understand the properties of the E.A.F. steel-making dusts for stabilization processing. The properties are related to mincral composition, shape, particle size, magnetism, density, porosity and leaching characteristic. the dust particles, the size of which ranges from sub-micron to tens-micron, were mainly spherical like balls that were agglomerated each other: the large particles were generally Fe-rich and the small particles were spherical like balls that were agglomerated each other: the large particles were franklinite (ZnFe$_{2}O_{4}$), magnetite (Fe$_{3}O_{4}$) and zincite (ZnO) by XRD analysis. When the dusts were sieved by a wet process, the particle fraction over 200 mesh had 1.5 wt.% with magnetite and quartz. The particles in the size range of 200-500 mesh consisted of magnetite, franklinite. The 82 wt.% of the steel-making dusts were occupied by the particles finer than 500 mesh and contained franklinite and zincite as main mineralogical compositions. When the dusts of around 78% porosity compressed under the load of approximately 1 KPa, the porosity decreased to 68% and to 535 under around 13 KPa. When the E.A.F. dusts were leached according to the Korea standard leaching procedure on the waster, the heavy metals exceeding the leaching criteria were cadmium, lead and mercury.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.44 no.4
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• pp.1-7
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• 2012

The increase of OCC solid content after wet pressing will save drying energy greatly. We applied spacers, which used to increase draining rate and bulk in fiber furnishes, to increase the OCC solid contents. MDF fibers (fibers for making medium density fiberboard) and diatomaceous earth were used as spacers, and added 10% by weight to the OCC fiber furnish. Application of high wet pressing pressure to the mixed furnish of spacers and refined OCC did not deteriorate bulk and drainage rate, but their solid contents were increased to 0.5-1.5% without loss of compressive strength when compared to those of unrefined OCC, which is the furnish normally used for mill commercial practice. It is believed that the spacers caused the rate of solid content increase faster in the mixed furnish with OCC at high wet pressing pressure area than the unrefined OCC furnish did. Little amount of starch addition (0.5%) to the spacers helped to keep the strength properties.