• Proceedings of the Korean Society of Computer Information Conference
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• 2016.01a
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• pp.137-139
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• 2016

본 논문에서는 압저항 소재 및 센서 기술과 ICT 응용 기술에 대해 소개한다. 먼저 압저항 소재의 구성 및 작동원리를 소개하고, 한국표준과학연구원에서 개발한 유연한 압저항 센서의 구성과 성능에 대해 기술한다. 또한, 개발된 압저항 센서와 ICT 기술을 융합한 스마트 안전 시스템 및 스마트 창호 침입감지 시스템에 대해 기술한다. 마지막으로, ICT기술을 기반으로 압저항 센서기술이 확장해 나아가야 할 스마트 보안 시스템 개발의 필요성을 기술한다.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.2
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• pp.31-36
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• 2014

In this paper, we developed an intergrated piezoresistive temperature and humidity sensor using nano-technology, and evaluated the properties. In the measuring range from $20^{\circ}C$ to $80^{\circ}C$, output sensitivity of temperature was about 0.75mV/$1^{\circ}C$. Output sensitivity of humidity was about 1.35mV/10%(RH). Therefore, developed sensor suggests that it is possible applicable to the general residential environment.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.2
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• pp.1-8
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• 2012

This paper presents the accelerometer which is a key component of TPMS(Tire Pressure Monitoring System). Generally a piezoresistive accelerometer has characteristics of lower cost, better linearity and better immunity about the environmnet noise than a capacitive one. Three types of piezoresistive accelerometers are degined and simulated using ANSYS program. The best one is a piezoresistive sensor which is supported by four beams located at the center of the edge of the mass after comparing the characteristics of resonant frequency of the three types. Considering the sensor size and a simulated maximum stress and maximum displacement, the length of beams is set as $200{\mu}m$. The size of a piezoresistive accelerometer is $3.0mm{\times}3.0mm{\times}0.4mm$. The sensor output is characterized by measuring the output characteristic depending on angle. As a result the offset voltage of the accelerometer is 43.2 mV and its sensitivity is $42.5{\mu}V/V/g$. The temperature bias drift is measured. The shock durability of the sensor is 1500g and the measuring range is 0 ~ 60 g.

• Journal of Sensor Science and Technology
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• v.10 no.3
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• pp.148-155
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• 2001

A pressure sensor on the tip of a catheter which is utilized to measure the in-vivo pressure in a human body was fabricated and the characteristic of the pressure sensor as measured. To fit into a catheter with 1 mm caliber, samples of $150\;{\mu}m$(thickness) ${\times}$ (600, 700, 800, 900, 1000) ${\mu}m$(width) ${\times}2\;mm$(length) was fabricated. The thicker face with $450\;{\mu}m$ thickness of SDB wafer was made thin to $134\;{\mu}m$ thickness using KOH etchant and it made possible to fabricate sensor cell with the width shorter than 1 mm. Different to the whitstone bridge sensor, we formed one piezoresistor and one reference resistor in sensor. Therefore there are possibilities of reduction of the sensitivity, then by using the simulation tool ANSYS 5.5.1, the location and the type of the piezoresistor was optimized. Another piezoresistor type of sensor which contain one longitudinal and one transverse piezoresistor was fabricated at the same time, but the sensitivity was not improved very much. To get the output versus the pressure, a constant current source and a implementation amplifier was used. As a result, the maximum sensitivity of the sensor with one piezoresistor was $1.6\;{\mu}V/V/mmHg$.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.2
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• pp.83-88
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• 2015

In this paper, $2mm{\times}2mm$ sized piezoresistive accelerometers were designed and fabricated. Two kinds of accelerometers with different spring structure are designed. One is an accelerometer with 4 beam spring located in the center of the mass, the other is an accelerometer with 8 beam spring located in the vertices of the mass. The modal analysis of the accelerometers and the structural analysis were performed using ANSYS program. The former has the superior sensitivity characteristics of $21.38{\mu}V/V/g$ and the lower offset drift of $154.45ppm/^{\circ}C$ than the latter.

• Proceedings of the KOSOMBE Conference
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• v.1990 no.11
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• pp.75-79
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• 1990

반도체 및 전자공업의 급속한 발달에 힘입어 압력센서가 소형, 경량, 대량 생산화됨으로써 의료용으로의 사용이 최근 급속히 늘고 있다. 따라서 본 논문은 현재 가장 활발히 개발되고 있는 압저항형 압력 센서의 원리인 압저항 효과에 대해 이론적인 분석을 상세히 소개하였다. 그리고 기존에 많이 소개된 바 있는 정사각형 모양의 박막모서리 중앙 부분에 위치한 압저항체의 설계 보다 직사각형 박막 중심에 위치한 압저항체의 설계가 우수한 특성을 보일 수 있는 이론적 근거를 설명한다.

• Journal of Sensor Science and Technology
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• v.3 no.1
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• pp.19-25
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• 1994

When etching rectangular convex corners of silicon using anisotropic etchants such as KOH, deformation of the edges always occurs due to undercutting. Therefore, it is necessary to correct the mass pattern for compensation. Experiments for the compensation method to prevent this phenomenon were carried out. In the result, the compensation pattern of a regular square is suitable for acceleration sensors considering space. With this consequence, silicon piezoresistive acceleration sensor with compensated square pillar type of mass has been fabricated using SDB wafer.

• Journal of Sensor Science and Technology
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• v.5 no.6
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• pp.25-34
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• 1996

In this paper, we have designed signal conditioning circuitry for piezoresistive pressure sensor. Signal conditioning circuitry consists of voltage reference circuit for sensor driving voltage and instrument amplifier for sensor signal amplification. Signal conditioning circuitry is simulated using HSPICE in a single poly double metal $1.5\;{\mu}m$ BiCMOS technology. Simulation results of band-gap reference circuit showed that temperature coefficient of $21\;ppm/^{\circ}C$ at the temperature range of $0\;{\sim}\;70^{\circ}C$ and PSRR of 80 dB. Simulation results of BiCMOS amplifier showed that dc voltage gain, offset voltage, CMRR, CMR and PSRR are outperformed to CMOS and Bipolar, but power dissipation and noise voltage were more improved in CMOS than BiCMOS and Bipolar. Designed signal conditioning circuitry showed high input impedance, low offset and good CMRR, therefore, it is possible to apply sensor and instrument signal conditioning circuitry.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.1
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• pp.19-24
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• 2005

In this paper, the fabrication process of Si pressure sensors utilizing piezoresistive effect was optimized. The efficiency(yield) of the fabrication process for Si piezoresistive pressure sensors was improved by conducting Si anisotrophic etching process after processes of piezoresistors and AI circuit patterns. The position and process parameters for piezoresistors were determined by ANSYS and SUPREM simulators, respectively. The measured thickness of p-type Si piezoresistors from the boron depth-profile measurement was in good agreement with the simulated one from SUPREM simulation. The Si anisotrohic etching process for diaphragm was optimized by adding ammonium persulfate(AP) to tetramethyl ammonium hydroxide (TMAH) solution.

• Journal of Sensor Science and Technology
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• v.8 no.5
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• pp.400-406
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• 1999

Piezoresistive flow sensors with four different types of microbeam structures were fabricated using (100), n/$n^+$/n three-layer silicon wafer and their characteristics were investigated. Piezoresistors were formed through boron diffusion and its values were about $1\;k{\Omega}$. Three-dimensional silicon microbeams were constructed by porous silicon micromachining and curled microbeams were fabricated by the difference in the thermal expansion coefficient between silicon and metal. The output response of the fabricated sensor was evaluated through half- bridge. The output voltage increased with increasing length of microbeam at the same flow velocity, while the detectable measurement range extended with decreasing length of microbeam. The output voltage of the fabricated sensors were increased with quotient of 3.2 of the flow rate since the stress of the beam versus the gas flow showed non-linear characteristics.