• Journal of Advanced Navigation Technology
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• v.24 no.3
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• pp.192-197
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• 2020

Recently, the technologies related to autonomous drive has studying the goal for safe operation and prevent accidents of vehicles. There is radar and camera technologies has used to detect obstacles in these autonomous vehicle research. Now a day, the method for using LiDAR sensor has considering to detect nearby objects and accurately measure the separation distance in the autonomous navigation. It is calculates the distance by recognizing the time differences between the reflected beams and it allows precise distance measurements. But it also has the disadvantage that the recognition rate of object in the atmospheric environment can be reduced. In this paper, point cloud data by triangular functions and Line Regression model are used to implement measurement algorithm, that has improved detecting objects in real time and reduce the error of measuring separation distances based on improved reliability of raw data from LiDAR sensor. It has verified that the range of object detection errors can be improved by using the Python imaging library.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.212-212
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• 2016

2차원 탄소나노재료인 그래핀은 우수한 물성으로 인하여 광범위한 분야로 응용이 가능할 것으로 예상되어 많은 주목을 받아왔다. 이러한 그래핀의 응용가능성을 실현시키기 위해서는 보다 손쉽고 신뢰할 수 있는 합성방법의 개발이 필요한 실정이다. 그래핀의 합성 방법들로 흑연을 물리적 및 화학적으로 박리하거나, 특정 결정표면 위에 방향성 성장의 흑연화를 통한 합성, 그리고 열화학기상증착법(Thermal chemical vapor deposition; T-CVD) 등의 합성방법들이 제기되었다. 이중 T-CVD법은 대면적으로 두께의 균일성이 높은 그래핀을 합성하기 위한 가장 적합한 방법으로 알려져 있다. 그러나 일반적으로 T-CVD공정은 원료 가스인 탄화수소가스를 효율적으로 분해하기 위하여 $1000^{\circ}C$부근의 온공정이 요구되며, 이는 산업적인 응용의 측면에서 그래핀의 접근성을 제한한다. 따라서 대면적으로 고품질의 그래핀을 저온합성 할 수 있는 공정의 개발은 필수적이다. 본 연구에서는, 플라즈마를 이용하여 원료가스를 효율적으로 분해함으로써 그래핀의 저온합성을 도모하였다. 퀄츠 튜브로 구성된 수평형 합성장치는 플라즈마 방전영역과 T-CVD 영역으로 구분되며, 방전되는 유도결합 플라즈마는 원료가스를 효율적으로 분해하는 역할을 한다. 합성을 위한 기판과 원료가스로는 각각 전자빔 증착법을 통하여 300nm 두께의 니켈 박막이 증착된 실리콘 웨이퍼와 메탄가스를 이용하였다. 저온합성공정의 변수로는 인가전력과 합성시간으로 설정하였으며, 공정변수의 영향을 확인함으로써 그래핀의 저온합성 메커니즘을 고찰하였다. 연구결과, 인가전력이 증가되고 합성시간이 길어짐에 따라 원료가스의 분해효율과 공급되는 탄소원자의 반응시간이 보장되어 그래핀의 합성온도가 저하가능함을 확인하였으며, $400^{\circ}C$에서 다층 그래핀이 합성됨을 확인하였다. 또한 플라즈마 변수의 보다 정밀한 제어를 통해 합성온도의 저온화와 그래핀의 결정성 향상이 가능할 것으로 예상된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.11
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• pp.734-739
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• 2017

We prepared $SnS_x$ thin films on both soda-lime glass (SLG) and molybdenum(Mo)/SLG substrates by a two-step process using a Sn precursor followed by sulfur reaction in rapid thermal annealing (RTA) at different sulfurization temperatures ($Ts=200^{\circ}C$, $230^{\circ}C$, $250^{\circ}C$, and $300^{\circ}C$) and annealing times ($t_s=10min$ and 30 min). The single SnS phase was dominant for $200^{\circ}C{\leq}T_s$<$250^{\circ}C$, while an additional phase of $SnS_2$ was appeared at $T_s{\geq}250^{\circ}C$ alongside SnS. The SnS grains in all the samples showed strong growth along the preferred [040] direction. The band-gap energy ($E_g$) of the films was estimated to be 1.24 eV.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.391-391
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• 2010

초전도 가속공동기의 소재는 순수 Nb로 제작하는 것이 일반적이다. 그러나 극저온 (2-4.5K)에서 열전도도가 낮아서 순간적인 Normal zone이 발생되면 이를 원활이 냉각되지 못하여 Quench로 발생 가능성이 높다. 초전도 가속공동기는 약 3 mm 두께의 Nb 판을 이용하는데, 500 MHz 공동기의 전자기장의 침투깊이가 불과 수 nm에 불과해서 나머지 부분은 사실상 불필요한 부분이다. 따라서 이 경우 매우 비싼 초전도 공동기 소재의 낭비가 매우 심하다. 또 Nb 판으로 공동기를 제작할 경우 매우 비싸고 시간이 많이 소요되는 전자빔용접을 해야 하고 또 제작 후 표면처리가 매우 번거롭고 장시간을 요한다. 이러한 단점을 보완하기 위해서 구리판으로 성형가공법을 이용하여 공동기를 제작하고, 내부의 RF 표면에 수 ${\mu}m$ 두께의 Nb 코팅을 한 공동기를 개발하여 CERN의 LEP에 설치하여 실용화하였다. 이렇게 하여 소재비용을 포함한 초전도 공동기 제작, 표면처리 비용 절감은 만족할 만한 결과를 얻었다. 구리의 높은 열전도에 의한 고 가속전기장의 기대와 달리 가속전기장이 최고 약 7 MV/m 정도로 제한되었다. 그후 꾸준히 연구개발을 진행하여 현재 약 22 MV/m 까지 기록하고 있으나, 순수 Nb 공동기의 약 50 MV/m에 비하면 현저히 낮은 수준이다. 본 연구는 Nb 코팅법을 이용하여 Nb 코팅 초전도 공동기의 한계를 넓히기 위한 것이다. 본 발표는 "Sputtering 법에 의한 초전도 Nb coating 소재의 RF 한계 극복 연구"의 기초연구 결과를 보고하고자 한다.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.32 no.2
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• pp.103-108
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• 2019

Non-equilibrium molecular dynamics simulation on the thermal boundary resistance(TBR) of an aluminum(Al)/silicon(Si) interface was performed in the present study. The constant heat flux across the Si/Al interface was simulated by adding the kinetic energy in hot Si region and removing the same amount of the energy from the cold Al region. The TBR estimated from the sharp temperature drop at the interface was independent of heat flux and equal to $5.13{\pm}0.17K{\cdot}m^2/GW$ at 300K. The simulation result was experimentally confirmed by the time-domain thermoreflectance technique. A 90nm thick Al film was deposited on a Si(100) wafer using an e-beam evaporator and the TBR on the film/substrate interface was measured using the time-domain thermoreflectance technique based on a femtosecond laser system. A numerical solution of the transient heat conduction equation was obtained using the finite difference method to estimate the TBR value. Experimental results were compared to the prediction and discussions on the nanoscale thermal transport phenomena were made.

• Journal of the Korean Magnetics Society
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• v.14 no.2
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• pp.59-64
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• 2004

We investigated the soft magnetic properties of nanocrystalline Fe-Al-O film as etching the oxide film with ion beam etching method. It is thought that the grain size of Fe-Al-O film increases as the thickness decreases. The coercivity and squareness increase with decreasing thickness. The surface curvature of Am images increases when the etching experiment proceeds. This phenomena could be due to the grain growth which occurs during sputtering. This grain growth could be assisted by the the plasma energy during sputtering. Therefore proper thickness should be searched to acquire the good soft magnetic properties for the nanocrystalline film material. Good soft magnetic properties of Fe-Al-O film was acquired at the thickness of more than 900 nm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.36-43
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• 2000

The sulfur pressure and TRA(rapid thermal annealing) conditions of the fabricated SrS:CuCl TFEL devices were optimized to improve blue color luminance. The thickness of the phosphor layer of SrS:CuCl TFEL devices fabricated by electron beam deposition system was 6000 ~ 8000 ${\AA}$. The fabricated TFEL devices were annealed at 800 $^{\circ}C$ for 3 min. It was shown that the crystallinity of SrS:CuCl phosphor was improved by an increase in RTA temperature and RTA time. Blue color was emitted from the TFEL device with emission peak wavelength of 468 nm and 500 nm. The CIE color coordinates were x = 0.21, y = 0.33. The luminance($L_{40}$) of TFEL device strongly depended on the sulfur pressure of deposition chamber and increased from 262 cd/$m^2$ to 728 cd/m2 as the sulfur pressure increased from $8{\times}10^{-6}$ torr to $2{\times}10^{-5}$ torr.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.20 no.3
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• pp.287-292
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• 2007

In general, the response of bulk material is independent of its size when it comes to considering classical elasticity theory. Because the surface to bulk ratio of the large solids is very small, the influence of surface can be negligible. But the surface effect plays important role as the surface to bulk ratio becomes larger, that is, the contribution of the surface effect must be considered in nano-size elements such as thin film or beam structure. Molecular dynamics computation has been a conventional way to analyze these ultra-thin structures but this method is limited to simulate on the order of $10^6{\sim}10^9$ atoms for a few nanoseconds, and besides, very time consuming. Analysis of structures in submicro to micro range(thin-film, wire etc.) is difficult with classical molecular dynamics due to the restriction of computing resources and time. Therefore, in this paper, the continuum-based method is considered to simulate the overall physical and mechanical properties of the structures in nano-scale, especially, for the thin-film.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.39-46
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• 2003

Sn-Cu eutectic solder bump was fabricated by electroplating for flip chip and its characteristics were studied. A Si-wafer was used as a substrate and the UBM(Under Bump Metallization) of Al(400 nm)/Cu(300 nm)/Ni(400 nm)/Au(20 nm) was coated sequentially from the substrate to the top by an electron beam evaporator. The experimental results showed that the plating ratio of the Sn-Cu increased from 0.25 to 2.7 $\mu\textrm{m}$/min with the current density of 1 to 8 A/d$\m^2$. In this range of current density the plated Sn-Cu maintains its composition nearly constant level as Sn-0.9∼1.4 wt%/Cu. The solder bump of typical mushroom shape with its stem diameter of 120 $\mu\textrm{m}$ was formed through plating at 5 A/d$\m^2$ for 2 hrs. The mushroom bump changed its shape to the spherical type of 140 $\mu\textrm{m}$ diameter by air reflow at $260^{\circ}C$. The homogeneity of chemical composition for the solder bump was examined, and Sn content in the mushroom bump appears to be uneven. However, the Sn distributed more uniformly through an air reflow.

• Journal of the Korean Vacuum Society
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• v.21 no.6
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• pp.348-353
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• 2012

We investigated chemical states of a $Sb_2Te_3$ thin film with the polycrystalline phase by using high-resolution x-ray photoelectron spectroscopy with synchrotron radiation. The $Sb_2Te_3$ thin film was formed by sputtering. The rhombohedral phase was confirmed by x-ray diffraction. To remove the surface oxide, we performed $Ne^+$ ion sputtering for 1 hour with the beam energy of 1 kV and post-annealing at $100^{\circ}C$ for 5 min in ultra-high vacuum. We obtained the Te and Sb 4d core-levels spectra with the peaks at the binding energies of 40.4 and 33.0 eV, respectively. The full-width of half maximum of both the Te and Sb $4d_{5/2}$ core-levels is 0.9 eV. The Te and Sb core-levels only show a single chemical state, and we also confirmed the stoichiometry of approximately 2 : 3.