• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.55-59
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• 2017

An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.861-864
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• 1997

Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.1-9
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• 2001

This paper proposes an inspection algorithm for micro ball grid array ($\mu$BGA) solder balls. This algorithm is motivated by the difficulty of finding defect balls by human visual inspection due to their small dimensions. Specifically, it is developed herein an automated vision-based inspection algorithm for $\mu$BGA's, which can inspect solder balls not only for so-called two dimensional errors, such as missings, positions and sizes, but also for height errors. The inspection algorithm uses two dimensional images of $\mu$BGA obtained through special blue illumination, and processes them with a rotation-invariant sub algorithm. It can also detect height errors when a two-camera system is available. Simulation results show that the proposed algorithm is more efficient in detecting ball defects compared with the conventional algorithms.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.44-56
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.81-87
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• 2012

This paper focuses on three-dimensional measurement system of micro balls on micro Ball-Grid-Array(BGA) packages in-line. Most of visual inspection system still suffers from sophisticate reflection characteristics of micro balls. For accurate shape measurement of them, a specially designed visual sensor system is proposed under the sensing principle of phase shifting moire interferometry. The system consists of a pattern projection system with four projection subsystems and an imaging system. In the projection system, four subsystems have spatially different projection directions to make target objects experience the pattern illuminations with different incident directions. For the phase shifting, each grating pattern of subsystem is regularly moved by PZT actuator. To remove specular noise and shadow area of BGA balls efficiently, a compact multiple-pattern projection and imaging system is implemented and tested. Especially, a sensor fusion algorithm to integrate four information sets, acquired from multiple projections, into one is proposed with the basis of Bayesian sensor fusion theory. To see how the proposed system works, a series of experiments is performed and the results are analyzed in detail.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.35-35
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.61-68
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• 2002

Thermal shock testing was used to evaluate reliability that appeared in the solder joints of electronic devices when they were subjected to thermal cycling. Recently, mobile devices have come smaller and multi-functional, with the increasing need for high-density packaging, BGA or CSP has become the main trend for surface mounting technology, and therefore mechanical stress life for solder joints in BGA/CSP type packages has required. Reliability of BGA/CSP solder joints was evaluated with electric resistivity change of daisy chain pattern and stress-strain curve measured using strain gage attached on the surface of PCB under mechanical impact loading. In this report, applications of PCB Universal Testing Machine we have developed and experimental datum of SONY estimating dynamic behavior of mechanical stress in BGA/CSP solder joints are introduced.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.45-51
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• 2009

Vertical wet equipment was newly developed in stead of horizontal wet equipment which has been widely used for BGA develop process. We intended to eliminate the collision problem between equipment's transferring rollers and fine circuit patterns, which could be achieved by fixing the BGA panel vertically using jig unit. The process characteristics of vertical wet equipment were evaluated by conducting uniformity evaluation, pattern damage evaluation and defect analysis. The process uniformity of the vertical equipment was measured to be the same level as the uniformity of horizontal equipment. And it was measured that $3{\sim}4{\mu}m$ finer circuit pattern could be processed adopting vertical equipment rather than horizontal equipment.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.7
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• pp.53-59
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• 2005

In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The reposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within 17[${\mu}m$].