Browse > Article
http://dx.doi.org/10.5207/JIEIE.2005.19.7.053

A Study on the 2-Dimensional Vision Inspection Algorithm for the Defects Detection of BGA Device  

Kim, Joon-Seek (호서대학교 전자공학과)
Kim, Kee-Soon (호서대학교 전자공학과)
Joo, Hyo-Nam (호서대학교 전자공학과)
Publication Information
Journal of the Korean Institute of Illuminating and Electrical Installation Engineers / v.19, no.7, 2005 , pp. 53-59 More about this Journal
Abstract
In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The reposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within 17[${\mu}m$].
Keywords
BGA; inspection; vision system;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Linda G. Shapiro, George C. Stockman, Computer Vision, Prentice Hall, pp. 388-407, 2001
2 Dong-Hyeok Jang, 'Embodiment of Digital Image Processing', Imformation Gate, pp. 95-102. 2001
3 Edward. Lyvers, Owen Robert Mitchell. 'Subpixel Measurements Using a Moment-Based Edge Operator', Ieee Transactions on Pattern Analysis and Machine Intelligence. Vol.11. No.12. December, 1989
4 Gil-Dong Kim,'The Improved Subpixel Algorithm for Automated Visual Inspection System', Department of Electronics Engineering, The Graduate School Korea University, p.1-3, 1997
5 Zoher Zain Karu,'Fast Subpixel Registration of 3-D Image', Massachusetts Institute of Technology, September, pp, 120-124, 1997
6 Ki-Tae Bae, 'A Research of BGA Automatic Inspection Using Image Information', Department of Electronics Engineering, The Graduate School Chonnam National University, 1999
7 ICOS Vision Systems, 'http://www.icos.be'
8 Samsung semiconductor, 'http://www.samsung.com/Products/Semiconductor/', KM416RD8AC