Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 1997.10a
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- Pages.861-864
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- 1997
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- 2005-8446(pISSN)
Ultra-precision Singulation of Micro BGA using Multi Blade
멀티블레이드를 이용한 Micro BGA의 초정밀 싱귤레이션
Abstract
Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.
Keywords