• Journal of the Korea Institute of Information and Communication Engineering
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• v.5 no.4
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• pp.822-828
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• 2001

In this paper, a high gain microstrip antenna with rectangular cavity backed is designed. A single microstrip patch is basically a low gain radiator As a ga in enhancement method, superstrate loading techniques are applied to the $2\times2$ microstrip array antenna with cavity backed. In antenna design, although the broadside gain increases as the cavity is enlarged, a cavity size of $3\times3$ wavelength is sufficient. The distance between the radiating elements is chosen as 1.5 free-space wavelength. The antenna radiation characteristics are calculated by IE3D software and compared with the experimental results. Experimental results show that the maximum gain is 18.6dBi at the frequency of 9.16GHz, which is good agreement with the calculations.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.39-43
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• 2011

Effects of cavity material on the Q-factor measurement of microwave dielectric materials were studied by HFSS simulation and the measurements using metal cavity. $TE_{01\delta}$ mode resonant frequency was determined from the electric and magnetic field patterns and the loaded Q-factor was calculated from 3dB bandwidth of $S_{21}$ spectrum. When the cavity metal materials were Cu, SUS and Au cavity, the level of Q-factor was similar. However, Q-factor was significantly decreased when the cavity metal material was CuO. The Q-factor measurements of dielectric resonator by network analyzer using various metal cavity exhibits consistent behavior.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.67-73
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• 2020

In this paper, we used FEM technique to perform warpage and von Mises stress analysis on PCB according to the cavity structures of embedded PCB for FCCSP and the types of prepreg material. One-half substrate model and static analysis are applied to the FEM. According to the analysis results of the warpage, as the gap between the cavity and the chip increased, warpage increased and warpage increased when prepreg material with higher modularity and thermal expansion coefficient was applied. The analysis results of the von Mises stress show that the effect of the gap between the cavity and the chip varies depending on prepreg material. In other words, when material whose coefficient of thermal expansion is significantly higher than that of core material, the stress increased as the gap between the cavity and the chip increased. When the prepreg with the coefficient of thermal expansion lower than the core material is applied, the result of stress is opposite. These results indicate that from a reliability perspective, there is a correlation between the structure of the cavity where embedded chips are loaded and prepreg material.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 1993.10a
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• pp.316-320
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• 1993

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.10
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• pp.1089-1095
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• 2011

Numerical simulation is performed for nucleate boiling on a micro-finned surface, which has been widely used to enhance heat transfer, by solving the equations governing the conservation of mass, momentum, and energy in the liquid and vapor phases. The bubble motion is determined by a sharp-interface level-set method, which is modified to include the effect of phase change and to treat the no-slip and contact-angle conditions, as well as the evaporative heat flux from the liquid microlayer on immersed solid surfaces such as micro fins and cavities. The numerical results for bubble formation, growth, and departure on a microstructured surface including fins and cavities show that the bubble behavior during nucleate boiling is significantly influenced by the fin-cavity arrangement and the fin-fin spacing.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.11
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• pp.1183-1189
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• 2012

Organic light-emitting diodes (OLEDs) using microcavity effect have attracted great attention because they can reduce the width of emission spectra from organic materials, and enhance brightness from the same material. We demonstrate the simulation results of the radiation properties from top-emitting organic light-emitting diodes (TE-OLEDs) with microcavity structures based on the general electromagnetic theory. Organic materials such as N,N'-di (naphthalene-1-yl)-N,N'-diphenylbenzidine (NPB) as a hole transport layer and tris (8-hydroxyquinoline) ($Alq_3$) as emitting and electron transporting layer are used to form the OLEDs. The organic materials were sandwiched between anode such as Ni or Au and cathode such as Al, Ag, or Al:Ag. The devices were characterized with electroluminescence phenomenon. We confirmed that the simulation results are consistent with experimental results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.20-21
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• 2009

우리는 전면 발광 소자에서 두께에 따른 발광 스펙트럼을 연구하였다. 소자 구조는 Al(100nm)/TPD(40nm)/Alq3(60nm)/LiF(0.5nm)/Al(2nm)/Ag(30nm)으로 하였다. N,N'-diphenyl-N,N'-di(m-tolyl)-benzidine(TPD)와 tris-(8-hydroxyquinoline) aluminium(Alq3)는 전공 수송층과 발광층으로 각각 사용되었다. 반투명 전극은 Li/Al/Ag로 하였다. 유기물층과 전극은 $2\times10-5$torr의 진공도에서 열 증착하였다. 유기물과 금속의 증착 속도는 $0.5\sim1.0{\AA}/s$과 $0.5\sim5{\AA}/s$로 하였다. 제작된 소자는 두께가 증가할 수록 장파장으로 이동하는 현상을 보였다. 이러한 현상은 마이크로 캐비티 이론으로 설명할 수 있다. 소자는 이론적인 마이크로 캐비티 수식을 이용하여 분석하기 위해 각각의 변수를 이용하여 실험과 이론을 비교하였을 때, 각각의 스펙트럼이 거의 일치하는 것을 확인할 수 있었다.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1513-1514
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• 2011

본 논문에서는 양극을 Ni, Au, Ag 등으로 하여 소자를 만들어 본 후에 가장 효율이 좋은 금속으로 양극을 정하고 유기물 층의 두께에 따른 마이크로 캐비티에 의한 스펙트럼의 이동효과를 시뮬레이션을 통해 살펴보았다. 소자의 기본 구조는 전면 발광 방식으로 양극/NPB/Alq3/LiF/Al이다. 음극을 LiF/Al과 Mg/Ag로 구조로 제작한 후에 기본 구조와 결과를 비교하였다. 실험결과를 시뮬레이션 결과와 비교 검토하였다.

• Proceedings of the Optical Society of Korea Conference
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• 2002.11a
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• pp.80-81
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• 2002

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.67-72
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• 2001

An Effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele-Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The optimization program based on the complex method integrated with flow analysis program has been successfully used to obtain the optimal filling conditions to avoid short shot.