1 |
Khan, N. and Toh, K. C., 2004, "Pool Boiling Heat Transfer Enhancement by Surface Modification/Micro Structures for Electronics Cooling: a Review," Proc. 6th Electronics Packaging Technology Conference, Toh, K. C. eds., pp. 273-280.
|
2 |
Wei, J. J., Zhao, J., Yuan, M. and Xue, Y., 2009, "Boiling Heat Transfer Enhancement by Using Micro- Pin-Finned Surface for Electronics Cooling," Microgravity Sci. Technol., Vol. 21(Suppl 1), pp. S159-S173.
|
3 |
Klien, G. J. and Westwater, J. W., 1971, "Heat Transfer from multiple spines to boiling liquids," AIChE J., Vol. 17(5), pp. 1050-1056.
DOI
|
4 |
Gulielmini, G., Misale, M. and Schenone, C., 1996, "Experiments on Pool Boiling of a Dielectric Fluid on Extended Surfaces," Int. Comm. Heat Mass Transfer, Vol. 23, pp.451-462.
DOI
ScienceOn
|
5 |
Yu., C. and Lu, D., "Pool Boiling Heat Transfer on Horizontal Rectangular Fin Array in Saturated FC-72," 2007, Int. J. Heat Mass Trans., Vol. 50, pp.3624-3637.
DOI
ScienceOn
|
6 |
Lee, R. C. and Nydahl, J. E., 1989, "Numerical Calculation of Bubble Growth in Nucleate Boiling from Inception through Departure," J. Heat Transfer, Vol. 111, pp. 474-479.
DOI
|
7 |
Welch, S. W. J., 1998, "Direct Simulation of Vapor Bubble Growth," Int. J. Heat Mass Transfer, Vol. 41, pp. 1655-1666.
DOI
ScienceOn
|
8 |
Son, G., Dhir, V. K. and Ramanujapu, N., 1999, "Dynamics and Heat Transfer Associated with a Single Bubble during Nucleate Boiling on a Horizontal Surface," J. Heat Transfer, Vol. 121, pp. 623-631.
DOI
|
9 |
Lee, W. and Son, G., 2010, "Numerical Analysis of Bubble Growth and Departure from a Microcavity," Numer. Heat Transfer B, Vol. 58, pp. 323-342.
DOI
ScienceOn
|
10 |
Lee, W. and Son, G., 2011, "Numerical Simulation of Boiling Enhancement on a Microstructured Surface," Int. Commun. Heat Mass Transfer, Vol. 38, pp. 168-173.
DOI
ScienceOn
|