• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.8 no.4
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• pp.243-248
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• 2015

Since phase noise is one of the most important parameters in the design of microwave oscillators, several methods have been proposed to reduce the phase noise. These methods have focused on improving the quality factor of resonators, which result in low phase noise oscillators. Dielectric resonators have been widely used for low phase noise in microwave oscillators due to their high quality factor. However this cannot be used in MMIC oscillators because they have a 3D structure. In this paper, to overcome this problem a novel resonator using open ring type DGS is proposed for improvement of phase noise characteristics that is weak point of oscillator using planar type microstrip line resonator, and oscillator for 5.8GHz band is designed using proposed DGS resonator. The open ring type DGS resonator is composed of DGS cell etched on ground plane under $50{\Omega}$ microstrip line. At the fundamental frequency of 5.8GHz, 6.1dBm output power and -82.7 dBc@100kHz phase noise have been measured for oscillator with ring type DGS resonator. The phase noise characteristics of oscillator is improved about 96.5dB compared to one using the general ${\lambda}/4$ microstrip resonator.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.8
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• pp.1365-1373
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• 2002

In this paper, we present two types of vision algorithm that mobile robot has CCD camera. for obstacle avoidance. This is simple algorithm that compare with grey level from input images. Also, The mobile robot depend on image processing and move command from PC host. we has been studied self controlled mobile robot system with CCD camera. This system consists of digital signal processor, step motor, RF module and CCD camera. we used wireless RF module for movable command transmitting between robot and host PC. This robot go straight until recognize obstacle from input image that preprocessed by edge detection, converting, thresholding. And it could avoid the obstacle when recognize obstacle by line histogram intensity. Host PC measurement wave from various line histogram each 20 pixel. This histogram is (x, y) value of pixel. For example, first line histogram intensity wave from (0, 0) to (0, 197) and last wave from (280, 0) to (2n, 197. So we find uniform wave region and nonuniform wave region. The period of uniform wave is obstacle region. we guess that algorithm is very useful about moving robot for obstacle avoidance.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.4
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• pp.49-58
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• 2007

Hierarchical Mobile IPv6 (HMIPv6) has been proposed by Internet Engineering Task Force (IETF) to compensate for such problems as handover latency and signaling overhead in employing Mobile IPv6 (MIPv6). HMIPv6 supports micro-mobility within a domain and introduces a new entity, namely mobility anchor point (MAP) as a local home agent. However, HMIPv6 causes load concentration at a particular MAP and longer handover latency when inter-domain handover occurs. In order to solve such problems, this paper establishes a virtual domain (VD) of a higher layer MAP and proposes a MAP changing algorithm in which the routing path changes between mobile node (MN) and correspondent node(CN) according to the mobile position and the direction of the MN before inter-domain handover occurs. The proposed algorithm not only enables complete handover binding-update of the on-link care of address (LCoA) only when inter-domain handover occurs, but concentrated load of a particular MAP is distributed as well. This is because the MNs registered with higher layer MAP and lower layer MAP coexist in the VD. We simulate the performance of the proposed algorithm and compare with HMIPv6.

• The KIPS Transactions:PartD
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• v.13D no.6 s.109
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• pp.839-846
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• 2006

Context-aware adaptive service for overcoming the limitations of wireless devices and maintaining adequate service levels in changing environments is becoming an important issue. However, most existing studies concentrate on an adaptation module on the client, proxy, or server. These existing studies thus suffer from the problem of having the workload concentrated on a single system when the number of users increases md, and as a result, increases the response time to a user's request. Therefore, in this paper the adaptation module is dispersed and arranged over the client, proxy, and server. The module monitors the contort of the system and creates a proposition as to the dispersed adaptation system in which the most adequate system for conducting operations. Through this method faster adaptation work will be made possible even when the numbers of users increase, and more stable system operation is made possible as the workload is divided. In order to evaluate the proposed system, a prototype is constructed and dispersed operations are tested using multimedia based learning content, simulating server overload and compared the response times and system stability with the existing server based adaptation method. The effectiveness of the system is confirmed through this results.

• Journal of Biomedical Engineering Research
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• v.23 no.2
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• pp.109-117
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• 2002

Electrogastrography(EGG) is a noninvasive method for measuring gastric electrical activity on the abdomen resulting from gastric muscle. EGG signals have a very low frequency range (0.0083 ~0.15 Hz) and extremely low amplitude(10~100 uV). Consequently, EGG signal is easily influenced by other noises. Both finite impulse response(FIR) and infinite impulse response (IIR) filters need high orders or have phase distortions for passing very narrow bandwidth of the EGG signal. In this study, we decomposed EGG signals using a wavelet multiresolution method with Daubechies mother wavelet. The EGG signals were decomposed to seven levels. We reconstructed signal by summing the decomposed signals from level four to seven. To evaluate the performance of the wavelet multiresolution filter(WMF) with simulated EGG signal using two kinds of FIR and four kinds of IIR filters., we used two indices; signal to noise ratio(SNR) and reconstruction squared error(RSE). The SNR of WMF had 9.5, 6.9, and 4.7 dB bigger than that of the other filters at different noise levels, respectively. Also, The RSE of WMF had $1.22{\times}10^6, 1.16{\times}10^6, 1.02{\times}10^6$ smaller than that of the other filters at different noise levels, respectively. The WMF performed better in the SNR and RSE than two kinds of FIR and four kinds of IIR filters.

• Journal of the Korean Vacuum Society
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• v.21 no.6
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• pp.348-353
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• 2012

We investigated chemical states of a $Sb_2Te_3$ thin film with the polycrystalline phase by using high-resolution x-ray photoelectron spectroscopy with synchrotron radiation. The $Sb_2Te_3$ thin film was formed by sputtering. The rhombohedral phase was confirmed by x-ray diffraction. To remove the surface oxide, we performed $Ne^+$ ion sputtering for 1 hour with the beam energy of 1 kV and post-annealing at $100^{\circ}C$ for 5 min in ultra-high vacuum. We obtained the Te and Sb 4d core-levels spectra with the peaks at the binding energies of 40.4 and 33.0 eV, respectively. The full-width of half maximum of both the Te and Sb $4d_{5/2}$ core-levels is 0.9 eV. The Te and Sb core-levels only show a single chemical state, and we also confirmed the stoichiometry of approximately 2 : 3.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.701-705
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• 2002

This paper describes implementation of IPv6-IPv4 transition toolbox named as 6TALK(IPv6 TrAansLator of Krv6) and some scenarios using 6TALK which enables IPv6 island to connect other IPv6 island or IPv4 island seamlessly. 6TALK implements some transition mechanisms suggested in NGTrans Working Group of IETF. Those mechanisms are composed of basic mechanism, tunneling, and applied mechanism such as DSTM. 6TALK provides functions which enable IPv6 network at the edge of existing network to communicate with IPv4 network by using these transition mechanisms. As major transition mechanisms in 6TALK we adopt NAT-PT/SIIT and DSTM/DSTM options and as implementation environment we use Linux Kernel 2.4.18 and Netfilter framework. Software modules implemented in Linux kernel was ported to hardware box using Motorola MPC 8260 processor. The transition mechanisms used in 6TALK are the ones predicted to be used in initial transition step to IPv6.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.4A
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• pp.336-344
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• 2005

Discrete Wavelet Transform(DWT) is the oncoming generation of compression technique that has been selected for MPEG4 and JEPG2000, because it has no blocking effects and efficiently determines frequency property of temporary time. In this paper, we propose an efficient bit-serial architecture for the low-power and low-complexity DWT filter, employing two-channel QMF(Qudracture Mirror Filter) PR(Perfect Reconstruction) lattice filter. The filter consists of four lattices(filter length=8) and we determine the quantization bit for the coefficients by the fixed-length PSNR(peak-signal-to-noise ratio) analysis and propose the architecture of the bit-serial multiplier with the fixed coefficient. The CSD encoding for the coefficients is adopted to minimize the number of non-zero bits, thus reduces the hardware complexity. The proposed folded 1D DWT architecture processes the other resolution levels during idle periods by decimations and its efficient scheduling is proposed. The proposed architecture requires only flip-flops and full-adders. The proposed architecture has been designed and verified by VerilogHDL and synthesized by Synopsys Design Compiler with a Hynix 0.35$\mu$m STD cell library. The maximum operating frequency is 200MHz and the throughput is 175Mbps with 16 clock latencies.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.