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http://dx.doi.org/10.6117/kmeps.2013.20.3.053

Solderability and BGA Joint Reliability of Sn-Ag-Cu-In-(Mn, Pd) Pb-free Solders  

Jang, Jae-Won (Advanced Welding & Joining Technology Center, KITECH)
Yu, A-Mi (Advanced Welding & Joining Technology Center, KITECH)
Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Lee, Chang-Woo (Advanced Welding & Joining Technology Center, KITECH)
Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.3, 2013 , pp. 53-57 More about this Journal
Abstract
Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.
Keywords
Pb-free solder; alloying effect; solderability; mechanical shock reliability; board level BGA package;
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