• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.256-256
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• 2012

Cu가 기존 배선물질인 Al을 대체함에 따라 resistance-capacitance delay와 electromigration (EM) 등의 문제들이 어느 정도 해결되었다. 그러나 지속적인 배선 폭의 감소로 배선의 저항 증가, EM 현상 강화 그리고 stability 악화 등의 문제가 지속적으로 야기되고 있다. 이를 해결하기 위한 방법으로 Cu alloy seed layer를 이용한 barrier 자가형성 공정에 대한 연구를 진행하였다. 이 공정은 Cu 합금을 seed layer로 사용하여 도금을 한 후 열처리를 통해 $SiO_2$와의 계면에서 barrier를 자가 형성시키는 공정이다. 이 공정은 매우 균일하고 얇은 barrier를 형성할 수 있고 별도의 barrier와 glue layer를 형성하지 않아 seed layer를 위한 공간을 추가로 확보할 수 있는 장점을 가지고 있다. 또한, via bottom에 barrier가 형성되지 않아 배선 전체 저항을 급격히 낮출 수 있다. 합금 물질로는 초기 Al이나 Mg에 대한 연구가 진행되었으나, 낮은 oxide formation energy로 인해 SiO2에 과도한 손상을 주는 문제점이 제기되었다. 최근 Mn을 합금 물질로 사용한 안정적인 barrier 형성 공정이 보고 되고 있다. 하지만, barrier 형성을 하기 위해 300도 이상의 열처리 온도가 필요하고 열처리 시간 또한 긴 단점이 있다. 본 실험에서는 co-sputtering system을 사용하여 Cu-V 합금을 형성하였고, barrier를 자가 형성을 위해 300도에서 500도까지 열처리 온도를 변화시키며 1시간 동안 열처리를 실시하였다. Cu-V 공정 조건 확립을 위해 AFM, XRD, 4-point probe system을 이용하여 표면 거칠기, 결정성과 비저항을 평가하였다. Cu-V 박막 내 V의 함량은 V target의 plasma power density를 변화시켜 조절 하였으며 XPS를 통해 분석하였다. 열처리 후 시편의 단면을 TEM으로 분석하여 Cu-V 박막과 $SiO_2$ 사이에 interlayer가 형성된 것을 확인 하였으며 EDS를 이용한 element mapping을 통해 Cu-V 내 V의 거동과 interlayer의 성분을 확인하였다. PVD Cu-V 박막은 기판 온도에 큰 영향을 받았고, 200도 이상에서는 Cu의 높은 표면에너지에 의한 agglomeration 현상으로 거친 표면을 가지는 박막이 형성되었다. 7.61 at.%의 V함량을 가지는 Cu-V 박막을 300도에서 1시간 열처리 한 결과 4.5 nm의 V based oxide interlayer가 형성된 것을 확인하였다. 열처리에 의해 Cu-V 박막 내 V은 $SiO_2$와의 계면과 박막 표면으로 확산하며 oxide를 형성했으며 Cu-V 박막 내 V 함량은 줄어들었다. 300, 400, 500도에서 열처리 한 결과 동일 조성과 열처리 온도에서 Cu-Mn에 의해 형성된 interlayer의 두께 보다 두껍게 성장했다. 이는 V의 oxide formation energy가 Mn 보다 작으므로 SiO2와의 계면에서 산화막 형성이 쉽기 때문으로 판단된다. 또한, $V^{+5}$이온 반경이 $Mn^{+2}$이온 반경보다 작아 oxide 내부에서 확산이 용이하며 oxide 박막 내에 여기되는 전기장이 더 큰 산화수를 가지는 V의 경우 더 크기 때문으로 판단된다.

• Conservation Science in Museum
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• v.23
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• pp.71-90
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• 2020

The scientific analysis of a 'F-51D Mustang Fighter'(Registered Cultural Heritage 666), one of the War Memorial of Korean collections, was carried out. The paint layer and canopy were discolored due to a constant outdoor exhibit. The results obtained through the scientific survey and analysis processes were intended to be used as basic data for the future dismantling and restoration of the fighter. The analysis results for the pigment components have confirmed red oxide of iron, Fe₂O₃ organic pigments, such as Cobalt Blue, phthalocyanine blue, etc., yellow PbCrO₄, white TiO₂, black Fe₃O₄, and gray Fe₃O₄ + TiO₂. It has been also confirmed that Alkyd resin was mainly used for painting. The fighter's canopy was Poly methyl methacrylate(PMMA), and Al was detected as the main component of the fighter body, wings, and tails.

• Journal of Conservation Science
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• v.26 no.2
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• pp.157-169
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• 2010

This study focused on the material characteristics and archaeometric relationship between the molten glass and bronze materials within the crucibles and gilt-bronze Bodhisattva statue excavated from the Ssangbukri site in Buyeo, Korea. Yellowish green to red brown vitreous material in the crucibles was identified as lead glass which contained scarce amount of BaO, and low $Al_2O_3$ and CaO. Metallic molten material was identified as bronze of copper-tin-lead alloy with low amount of impurities that indicated well-refined materials. Also, cassiterite was used for raw metal ore of tin. The Bodhisattva statue consisted of major copper with trace impurities in the core metal, and gold amalgam in the gilded layer. Though lead isotopic analysis showed contradictory results in each lead glass, bronze and Bodhisattva statue that required further examination, it could be stated that the statue was made in the Ssangbukri site based on the high-level technical skills of bronze production.

• Korean Journal of Environmental Biology
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• v.34 no.3
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• pp.212-215
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• 2016

We developed a new ecotoxicological test method using native test species, eggs of Ephemera orientalis, and five kinds of industrial wastewater were tested to validate the test method. The water samples were collected in Jun 2006 from the following industries: pesticide, metal plating, PCB, leather1, and leather2. Wastewater and effluent were diluted by distilled water, respectively, to prepare various concentrations, 100, 50, 25, 12.5, 6.3, 3.1, and 0%. For the egg bioassay, 20 freshly laid eggs (<24 h old) were exposed to test solutions in a Petri dish ($52{\times}12mm$) at $20^{\circ}C$ with photoperiod of 16 h light and 8 h dark for 14 days. The median egg hatching concentrations (EHC50) were estimated using Probit analysis. All EHC50s of wastewater were less than 3.1%, which meant very high ecotoxicity except for the wastewater of PCB industry having 6.1% of EHC50. Among the effluents, the least toxic effluent was from pesticide industry having 58% of EHC50, while the effluent of leather2 was the most toxic having 7.3% of EHC50.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.11
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• pp.3260-3268
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• 2009

A test apparatus has been fabricated to simulate chemical effect on head loss through a strainer in a pressurized water reactor (PWR) containment water pool after a loss of coolant accident (LOCA). Tests were conducted under condition of same ratio of strainer surface area to water volume between the test appratus and the containment sump. A series of tests have been performed to investigate the effects of spray, existence of calcium-silicate with tri-sodium phosphate (TSP), and composition of materials. The results showed that head loss across the chemical bed with even a small amount of calcium-silicate insulation instantaneously increased as soon as TSP was added to the test solution. Also, the head loss across the test screen is strongly affected by spray duration and is increased rapidly at the early stage, because of high dissolution and precipitation of aluminum and zinc. After passivation of aluminum and zinc by corrosion, the head loss increase is much slowed down and is mainly induced by materials such as calcium, silicon, and magnesium leached from NUKONTM and concrete. Furthermore, it is newly found that the spay buffer agent, tri-sodium phosphate, to form protective coating on the aluminum surface and reduce aluminum leaching is not effective for a large amount of aluminum and a long spray.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Applied Microscopy
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• v.32 no.3
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• pp.285-290
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• 2002

The therapeutic effect of safflower seed powder on experimental osteoporosis in the rat induced by ovariectomy was evaluated. Thirty Sprague-Dawley rats were ovariectomized at the age of 12 weeks. Seven weeks postovariectomy, rats were divided into two groups: control and safflower seed powder treated group. Five animals from each group were sacrificed at the following time points: 1, 3, and 5 weeks. Scanning electron microscopic observation and morphometric analysis of the tibiae epiphysis showed that the administration of safflower seed powder significantly prevented reduction of cortical bone width and bone volume compared with the control group. In conclusion, safflower seed powder contains something that prevent bone loss due to estrogen deficiency, and was effective in preventing the osteoporotic decrease of bone mass.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.527-532
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• 2005

Ionic polymer metal composites (IPMC) are soft polymeric smart materials having large displacement at low voltage in air and water. The polymeric electrolyte actuator consists of a thin and porous membrane and metal electrodes plated on both faces, in impregnation electro-plating method. The response and actuation of actuator are governed. Among many factors governing the activation and response of IPMC actuator, the surface electrode plays an important role. In this study, the well-designed modification of electrode surface was carried out in order to improve the chemical stability well as electromechanical characteristics of the IPMC actuator. We employed Ion Beam Assisted Deposition (IBAD) method to prepare the topologically homogeneous thin surface electrode. After roughing the surface of Nafion membrane in order to get a larger surface area, the IPMC was prepared by impregnation for electro-plating and re- coating on the surface through traditional chemical deposition, followed by an additional surface treatment with high conductive metals with IBAD. It was observed that our IPMC specimen shows the enhanced surface electrical properties as well as the improved actuation and response characteristics under applied electric field.

• Journal of the Korean Magnetics Society
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• v.25 no.4
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• pp.129-137
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• 2015

The Cu(radius ra = $95{\mu}m$)/$Ni_{80}Fe_{20}$(outer radius $r_b$ = $120{\mu}m$) core/shell composite wire is fabricated by electrodeposition. The two diagonal components of impedance tensor for the Cu/$Ni_{80}Fe_{20}$ core/shell composite wire in cylindrical coordinates, $Z_{zz}$ and $Z_{{\theta}{\theta}}$, are measured as a function of frequency in 10 kHz~10 MHz and external static magnetic field in 0 Oe~200 Oe. The equations expressing the diagonal $Z_{zz}$ and $Z_{{\theta}{\theta}}$ in terms of diagonal components of complex permeability tensor, ${\mu}^*_{zz}$ and ${\mu}^*_{{\theta}{\theta}}$, are derived from Maxwell's equations. The real and imaginary parts of ${\mu}^*_{zz}$(f) and ${\mu}^*_{{\theta}{\theta}}$(f) spectra are extracted from the measured $Z_{zz}$(f) and $Z_{{\theta}{\theta}}$(f) spectra, respectively. It is presened that the extraction of ${\mu}^*_{zz}$(f) and ${\mu}^*_{{\theta}{\theta}}$(f) spectra from the diagonal impedance spectra can be a versatile tool to investigate dymanic magnetization process in the core/shell composite wire.

• Clean Technology
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• v.8 no.2
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• pp.85-92
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• 2002

Red mud is generated as a by-product during the production of aluminum hydroxide from bauxite ore. In this study the red mud coagulants were prepared by reacting 100 ml of 5 M $H_2SO_4$ solution with 10g of red mud at $85^{\circ}C$ or by reacting 100ml of 9M HCl solution with 10g of red mud at $25^{\circ}C$. The prepared red mud coagulants were tested for their coagulation performance of pollutants in the municipal and industrial wastewater. In addition, the coagulation performance was compared with that of a commercially available coagulant ($FeCl_3$). As a result, the red mud coagulants were found to have a good removal efficiency of pollutants in the municipal wastewater (turbidity, phosphate phosphorus) and in the plating wastewater (turbidity, $Pb^{2+}$, $Cd^{2+}$, $Cu^{2+}$, $Zn^{2+}$, $Cr^{3+}$). In the experiment to remove COD in the petrochemical wastewater, the COD removal efficiency by the red mud coagulants was a little poor, but it was better than that by $FeCl_3$.