• Journal of the Korean Institute of Gas
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• v.14 no.1
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• pp.47-54
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• 2010

In order to reduce the number of installation processes and the cost, a unified ball valve and polyethylene-steel pipe is proposed and tested. An integrated design approach is carried out such that a virtual manufacturing based on finite-element analysis is first performed in order to examine contact conditions under exaggerated temperature variations (${\Delta}T\;=\;60^{\circ}C$ and $-50^{\circ}C$ for summer and winter, respectively). From the final design configuration, it was predicted that the maximum contact pressures are 71 and 8.1 MPa for summer and winter, respectively, at relatively larger contact surface. Based on this observation, a prototype model is fabricated to go through an actual leakage test. The prototype pipe passed a hydrostatic strength test successfully, showing no leakage at even much higher (54 MPa) than the operational pressure (0.25 MPa).

• Journal of Energy Engineering
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• v.21 no.1
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• pp.26-32
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• 2012

This study has been performed Thermal Shock test for analyze the cause of Power drop in PV(Photovoltaic) Module. Thermal Shock test condition was performed with temperature range from $-40^{\circ}C{\sim}85^{\circ}C$. One cycle time is 30min. which are consist of low and high temperature 15min. each other. The test was performed with total 500cycles. EL, I-V were conducted every 100cycle up to 500cycles. Mono Cell resulted in 8% Power drop rates in Bare Cell and 9% in Solar Cell. In the case of Multi Cell resulted in 6% Power drop rates in Bare Cell and 13% in Solar Cell. After Thermal Shock test, Solar Cell's Power drop resulted from surface damages, but in the case of Bare Cell's Power drop had no surface damages. Therefore, Bare Cell's Power drop was confirmed as according to leakage current increase by analysis of Fill Factor after Thermal Shock test. Also, Solar Cell's Power drop rates are higher than that of Bare Cell because of surface damages and consuming electric power increase. From now on, it should be considered that analyzed the reasons of Fill Factor decrease and irregular Power drop in PV module and Cell level using cross section, various conditions and test methods.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.7
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• pp.729-736
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• 2015

In this study, the effects of specimen size and side-groove on the results of the J-R test for leak-before-break (LBB) evaluation were investigated. A series of J-R tests were conducted at both RT and $316^{\circ}C$, using three different sizes of compact tension (CT) specimens machined from SA508 Gr.1a piping material: 12.7 mm-thick 1T-CT, 25.4 mm-thick 1T-CT, and 25.4 mm-thick 2T-CT with and without side-groove. The results showed that side-grooving reduced the J-R curve for all specimens and the effect of side-grooving was more significant at $316^{\circ}C$ than at RT. As the thickness of the specimens decreased and the width of the specimens increased, the J-R curve slightly decreased at RT but it increased at $316^{\circ}C$. However, the variation in the J-R curve of SA508 Gr.1a with the thickness and width of CT specimen was insignificant.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.19-26
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• 2010

We found that saturated water vapor pressure is the most dominant stress factor for the degradation phenomenon in the package for high-power phosphor-converted white light emitting diode (high power LED). Also, we proved that saturated water vapor pressure is effective acceleration stress of LED package degradation from an acceleration life test. Test conditions were $121^{\circ}C$, 100% R.H., and max. 168 h storage with and without 350 mA. The accelerating tests in both conditions cause optical power loss, reduction of spectrum intensity, device leakage current, and thermal resistance in the package. Also, dark brown color and pore induced by hygro-mechanical stress partially contribute to the degradation of LED package. From these results, we have known that the saturated water vapor pressure stress is adequate as the acceleration stress for shortening life test time of LED packages.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.2
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• pp.148-157
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• 2015

In this paper, we propose a compact antenna hat to perform RF compatibility testing efficiently between the launch vehicle and ground stations. The proposed structure implements a small size and low loss using the conductive shield instead of the conventional RF absorber. The S-band antenna hat, which is fabricated for an inverted-F onboard antenna with the size of $74mm{\times}13mm{\times}16mm$, has the small enclosure of $88mm{\times}35mm{\times}44mm$, the return loss of 25.6 dB, the insertion loss of 0.26 dB, and the leakage loss of 49.4 dB at the center frequency of 2.25 GHz. The simulated and measured results show a good agreement.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.1
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• pp.89-98
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• 2002

Optical current sensor and optical voltage sensor modules were designed and fabricated to improve measurement error and insulation in automatic power distributor By using Faraday effect, optical current sensor with an $\alpha$-iron core was designed and fabricated to minimize current induction of the other phase and was optimized to maintain linearity. Optical voltage sensor was fabricated owing to the pockets effect and adopted spatial electric field type because of small room in an automatic power distributor. To connect a distributor with an external terminal for signal processing, optical multi connector was designed, fabricated and tested for coupling loss and gas leakage. The linearity of optical current sensor for applied current maintains variation of smaller than 2.5% for applied current range from 20A to 700A. The linearity of optical voltage sensor was smaller than 1% for appling voltage from 6.6kV to 19.8kV. Since the measured characteristics are good, these devices can be considered as being applicable in practice.

• Journal of the Korean Institute of Gas
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• v.13 no.6
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• pp.15-20
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• 2009

The number of compressed natural gas (CNG) vehicles have increased gradually by virtue of korea government's urban air quality improvement policy since 1998. Although the use of CNG as transportation fuel gives environmental benefits, there is a possibility of huge accidents from unexpected fire. Therefore, needs for the guarantee of safety are indispensible for the reliable operation of CNG vehicles. A check valve is a safety device which prevents leakage of the pressurized fuel charged in a fuel tank. Durability of this component should be guaranteed in spite of repeated operation. This research has performed durability tests of a CNG check valve regarding the repeated usage, extreme chattering, and the effect of compressor oil.Although a check valve used for CNG vehicle satisfies validation requirements in the test results, it has been found that problem in the function of leakage prevention in a check valve could take place in the case of prolonged exposure to compressor oil.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.4
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• pp.364-371
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• 2008

Ultrasonic waveguide sensor has been developed for under-sodium viewing of reactor internal structures of a sodium-cooled fast reactor (SFR). The structure design concept of a waveguide sensor assembly was suggested and evaluated for the application in SFR. A 10 m long ultrasonic waveguide sensor assembly has been manufactured and the experimental feasibility tests were carried out. The 10 m long distance propagation performance of zero-order antisymmetric $A_0$ Lamb wave has been verified. The feasibility of ultrasonic waveguide sensor has been demonstrated by the C-scanning resolution performance test.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.257-259
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• 2019

본 논문은 광물 탐사를 위한 25kW급 양극성 펄스전원장치에 대해 기술한다. 소프트스위칭 기반의 고효율 LCC 공진형 컨버터와 풀 브리지 기반 양극성 펄스 스위칭부로 구성된 단위 모듈(500V, 12.5A)을 기반으로 설계한다. LCC 공진형 컨버터는 전류의 rms값을 줄이기 위해 공진 전류모양을 사다리꼴 형태로 설계하여 도전 손실측면에서 크게 개선되었고, 높은 전력밀도를 달성하기 위해 변압기의 누설 인덕턴스를 공진 파라메터로 활용한다. 추가적으로, 짧은 펄스폭을 가지도록 설계된 게이트 구동 회로는 출력을 DC에서 8kHz의 넓은 주파수 범위에서 동작시킬 뿐만 아니라 게이트 신호를 전달하기 위한 변압기의 사이즈를 줄이기 위해 제안된다. 단위모듈 형태로 개발된 양극성 펄스전원장치는 4개의 모듈이 직병렬로 결선되어 부하조건에 따라 Grounded dipole mode (2kV, 12.5A) 또는 Loop mode (500V, 50A)로 동작한다. 4모듈 직병렬 운전 시 발생하는 모듈 간 전압 불균형 문제를 해결하기 위해 메인 변압기에 보상권선이 감긴다. 본 논문에서는 개발된 양극성 펄스전원 장치의 설계를 저항부하 실험 및 태백산 탐사시험 결과를 바탕으로 검증한다.