On-Chip Process and Characterization of the Hermetic MEMS Packaging Using a Closed AuSn Solder-Loop |
Seo, Young-Ho
(한국과학기술원 디지털나노구동연구단)
Kim, Seong-A (LG전자기술원 마이크로시스템 그룹) Cho, Young-Ho (한국과학기술원 디지털나노구동연구단) Kim, Geun-Ho (LG전자기술원 마이크로시스템 그룹) Bu, Jong-Uk (LG전자기술원 마이크로시스템 그룹) |
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