• Journal of the Korean institute of surface engineering
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• v.47 no.4
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• pp.162-167
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• 2014

The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle's salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.23-27
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• 2008

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.

• Journal of the Korean Geotechnical Society
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• v.17 no.2
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• pp.143-150
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• 2001

최근 국내에서는 건설재료의 부족으로 건설부산물인 폐콘크리트를 새로운 토목재료로써 재활용 또는 자원화에 노력하고 있다. 이러한 차원에서 폐콘크리트의 재활용 및 자원화는 사용용도에 적합한 공학적 특성뿐만 아니라 환경적 특성을 분석하여 대상재료의 환경 안정성을 파악해야 한다. 따라서, 본 논문은 폐콘크리트에 대하여 pH시험, 용출시험, 중금속 흡착특성 등 일련의 환경특성 실험을 실시하여 폐콘크리트 사용에 따른 주변 환경에 미치는 영향을 분석하였다. 실험결과, 폐콘크리트의 pH는 11~12정도이고, 폐기물공정시험법과 TCLP법에 의한 용출시험은 법적기준에 모두 만족하는 것으로 나타났다. 또한 중금속 흡착시험은 폐콘크리트나 구리, 납, 카드늄의 제거능이 큰 것으로 나타났으나 반면, 크롬에 대해서는 제거율이 50%정도로 나타났다.

• Journal of Powder Materials
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• v.11 no.3
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• pp.210-216
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• 2004

The possibility to decrease agglomeration of Cu nano powders and their separation during pulsed wire evaporation (PWE) process was investigated by controlling the working gas system, i.e., the design of the gas path, the type and pressure of the atmospheric gas. As a result, it was possible to choose the optimal design of the gas path providing large specific surface area and high degree of separation of the synthesized Cu nano powders. It was also shown that an Ar+10∼50$N_2$ mixture can be used in production of Cu nano powders, which do not react with nitrogen.

• Journal of the Korean institute of surface engineering
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• v.27 no.1
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• pp.29-35
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• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• Proceedings of the KIEE Conference
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• 2005.07b
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• pp.1231-1233
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• 2005

다수본의 고온초전도테이프로 구성되는 전력케이블에서 발생되는 교류손실은 초전도전력케이블의 효율을 저하시킨 뿐만 아니라 냉동기비용 증가 및 시스템 사이즈의 증가를 초래하여 기존 케이블(구리도체)과의 가격경쟁에서 경제성을 저하시키는 주된 요인으로 작용하기 때문에 이의 상용화에 앞서 교류손실에 대한 정확한 규명이 되어야 한다. 그러나 다수본으로 구성되는 초전도케이블의 교류손실은 상이한 임계전류, 상이한 전류분포 및 인접한 테이프에 흐르는 위상이 상이한 전류 및 전압리드의 형상 통의 영향 때문에 매우 복잡하다. 이와 같은 교류손실 평가와 관련된 문제들을 규명하기 위해 실제 전력케이블을 모의한 단척 모델케이블을 제작하여 이에 대한 교류손실 평가기술을 개발하였다.

• Journal of Welding and Joining
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• v.7 no.3
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• pp.36-43
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• 1989

The furnace brazing in a Ar of copper to martensitic stainless steel(13.5Cr) using Cu-(5~8%)P-(0~8%)Sn powders was investigated. Shear strength, wettability, reacted layer, defect ratio at the stainless steel interface was evaluated. As Sn was added to the Cu-P powders, defect ratio and P content at the stainless steel interface decreased. And also as Sn was added, defect form at the stainless steel interface changed from the continuous layer to the discrete type, and shear strength of the brazed joint increased.

• Journal of the Korean institute of surface engineering
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• v.29 no.3
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.4-4
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• 2003

Various Cu films were fabricated using sputtering and electroplating with and without additive, and their surface damages after annealing were investigated. After annealing at 43SoC, the difference between damage morphologies of the films was observed. In some films stress-induced grooves along the grain boundaries were observed, while in the others voids at the grain boundary triple junctions were observed. It was also observed that the stress-induced groove was formed along the high energy grain boundaries. It was found out that the difference of the morphologies of surface damages in Cu films depends on not process type but grain boundary characteristics. To explain the morphological difference of surface damages, a simple parameter considering the contributions of grain structures and grain boundary characteristics to surface and grain boundary diffusions is suggested. The effective grain boundary area, which is a function of grain size, film thickness and the fraction of high energy grain boundaries, played a key role in the morphological difference.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.155-155
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• 2009

The copper plating was deposited by pulse reverse current (PRC) method with additives. The all specimens were first immersted in 10% H2SO4 for 10 minutes, and then were rinsed with deionized water. The current densities of forward pulse were 400mA/$cm^2$, and those of reverse pulse were 1900mA/$cm^2$ and 100mA/$cm^2$. Results are compared for different additives for pulse plating conditions. When it added in Only CH4N2S (TU) or only C10H13NO3S (SVH), the effect of surface side growth of Cu was not different. But when it added in TU and SVH, surface side growth of Cu decreased. Polarization curves were measured from OCP to -0.7 V at a rate of 1mV/sec. Each specimen was observed under the PHENOM to see surface morphology.