• Title/Summary/Keyword: 게이트 시뮬레이션 모델

Search Result 96, Processing Time 0.023 seconds

An Analytical DC Model for HEMT's (헴트 소자의 해석적 직류 모델)

  • Kim, Young-Min
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.26 no.6
    • /
    • pp.38-47
    • /
    • 1989
  • A purely analytical model for HEMT's based on a two dimensional charge control simul-ation[4] is proposed. In this model proper treatment of diffusion effect of electron transport along a 2-DEG (two dimensional electron gas) channel is perfoemed. This diffusion effect is shown to effectively increase the bulk mibility and threshold voltage of the I-V curves compared to the existing models. The channel thickness and gate capacitance are expressed as functions of gate voltages covering subthreshold characteristics of HEMT's analytically. By introducing the finite channel opening and an effiective channel-length modulation, the solpe of the saturation region of the I-V curves ws modeled. The smooth transition of the I-V curves at linear-to-saturation regions of the I-V curves was possible using the continuous Troffimenkoff-type of field dependent mobility. Furthermore, a correction factor f was introduced to account for the finite transition section forming between a GCA and a saturated section. This factor removes large discrepancies in the saturation region of the I-V curve predicted by existing l-dimensional models.

  • PDF

Short Channel n-MOSFET의 Breakdown 전압

  • Kim, Gwang-Su;Lee, Jin-Hyo
    • ETRI Journal
    • /
    • v.9 no.1
    • /
    • pp.118-124
    • /
    • 1987
  • Short channel n-MOSFET의 드레인-소오스 사이의 breakdown은 단순한 접합 breakdown이 아닌 avalanche-induced breakdown으로 p-MOSFET, long channel n-MOSFET의 breakdown 전압보다 훨씬 작은 값을 갖는다. Short channel n-MOSFET의 breakdown의 특징은 current-controlled 부저항 특성(snapback)이 나타나고, 게이트 전압에 따라 breakdown 전압보다 작은 sustainning 전압이 존재한다. 이와 같은 sustainning 전압은 short channel n-MOSFET의 안정한 동작에 또 하나의 제한 요소가 될 수 있다. 따라서 공정 및 회로 시뮬레이션을 위해, short channel n-MOSFET의 avalanche breakdown 현상에 대한 정확한 분석이 요구된다. Short channel n -MOSFET의 avalanche breakdown 현상을 분석하기 위해서Parasitic bipolar transistor를 도입한 분석적 모델을 이용하였다.

  • PDF

Low Power Digital Logic Gate Circuits Based on N-Channel Oxide TFTs (N-Channel 산화물 TFT 기반의 저소비전력 논리 게이트 회로)

  • Ren, Tao;Park, Kee-Chan;Oh, Hwan-Sool
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.48 no.3
    • /
    • pp.1-6
    • /
    • 2011
  • Low-power logic gates, i.e. inverter, NAND, and NOR, are proposed employing only n-channel oxide thin film transistors (TFTs). The proposed circuits were designed to prevent the pull-up and pull-down switches from being turned on simultaneously by using asymmetric feed-through and bootstrapping, thereby exhibited same output voltage swing as the input signal and no static current. The inverter is composed of 5 TFTs and 2 capacitors. The NAND and the NOR gates consist of 10 TFTs and 4 capacitors respectively. The operations of the logic gates were confirmed successfully by SPICE simulation using oxide TFT model.

Instruction-level Power Model for Asynchronous Processor (명령어 레벨의 비동기식 프로세서 소비 전력 모델)

  • Lee, Je-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.13 no.7
    • /
    • pp.3152-3159
    • /
    • 2012
  • This paper presents the new instruction-level power model for an asynchronous processor. Until now, the various power models for estimating the power dissipation of embedded processor in SoC are proposed. Since all of them are target to the synchronous processors, the accuracy is questionable when we apply those power models to the asynchronous processor in SoC. To solve this problem, we present new power model for an asynchronous processor by reflecting the behavioral features of an asynchronous circuit. The proposed power model is verified using an implementation of asynchronous processor, A8051. The simulation results of the proposed model is compared with the measurement result of gate-level synthesized A8051. The proposed power model shows the accuracy of 90.7% and the simulation time for estimation the power consumption was reduced to 1,900 times.

Threshold and Flat Band Voltage Modeling and Device design Guideline in Nanowire Junctionless Transistors (나노와이어 junctionless 트랜지스터의 문턱전압 및 평탄전압 모델링과 소자설계 가이드라인)

  • Kim, Jin-Young;Yu, Chong-Gun;Park, Jong-Tae
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.48 no.12
    • /
    • pp.1-7
    • /
    • 2011
  • In this work, an analytical models for the threshold voltage and flat band voltage have been suggested and proved using 3-dimensional device simulator. The method for device design guideline and its example in nanowire junctionless transistor and example of device design of was also presented. One can find that the suggested model for threshold voltage and flat band voltage agrees with 3-dimension simulation results. The threshold voltage and flat band voltage are decreased with the increase of nanowire radius, gate oxide thickness, and channel impurity doping concentration. When the work function of gate material and the ratio of ON and OFF current is given, the device design guide line for nanowire junctionless transistor has been proposed. It is known that the device with high impurity channel concentration can be fabricated with th decreased of nanowire radius and gate oxide thickness.

Analysis of Channel Doping Profile Dependent Threshold Voltage Characteristics for Double Gate MOSFET (이중게이트 MOSFET에서 채널도핑분포의 형태에 따른 문턱전압특성분석)

  • Jung, Hak-Kee;Han, Ji-Hyung;Lee, Jae-Hyung;Jeong, Dong-Soo;Lee, Jong-In;Kwon, Oh-Shin
    • Journal of the Korea Institute of Information and Communication Engineering
    • /
    • v.15 no.6
    • /
    • pp.1338-1342
    • /
    • 2011
  • In this paper, threshold voltage characteristics have been analyzed as one of short channel effects occurred in double gate(DG)MOSFET to be next-generation devices. The Gaussian function to be nearly experimental distribution has been used as carrier distribution to solve Poisson's equation, and threshold voltage has been investigated according to projected range and standard projected deviation, variables of Gaussian function. The analytical potential distribution model has been derived from Poisson's equation, and threshold voltage has been obtained from this model. Since threshold voltage has been defined as gate voltage when surface potential is twice of Fermi potential, threshold voltage has been derived from analytical model of surface potential. Those results of this potential model are compared with those of numerical simulation to verify this model. As a result, since potential model presented in this paper is good agreement with numerical model, the threshold voltage characteristics have been considered according to the doping profile of DGMOSFET.

Analysis of Subthreshold Swing for Oxide Thickness and Doping Distribution in DGMOSFET (산화막두께 및 도핑분포에 대한 DGMOSFET의 문턱전압이하 스윙분석)

  • Jung, Hak-Kee
    • Journal of the Korea Institute of Information and Communication Engineering
    • /
    • v.15 no.10
    • /
    • pp.2217-2222
    • /
    • 2011
  • In this paper, the relationship of potential and charge distribution in channel for double gate(DG) MOSFET has been derived from Poisson's equation using Gaussian function. The relationship of subthreshold swing and oxide thickness has been investigated according to variables of doping distribution using Gaussian function, i.e. projected range and standard projected deviation, The analytical potential distribution model has been derived from Poisson's equation, and subthreshold swing has been obtained from this model for the change of oxide thickness. The subthreshold swing has been defined as the derivative of gate voltage to drain current and is theoretically minimum of 60 mS/dec, and very important factor in digital application. Those results of this potential model are compared with those of numerical simulation to verify this model. As a result, since potential model presented in this paper is good agreement with numerical model, the relationship of subthreshold swing and oxide thickness have been analyzed according to the shape of doping distribution.

SPICE Simulation of 3D Sequential Inverter Considering Electrical Coupling (전기적 상호작용을 고려한 3차원 순차적 인버터의 SPICE 시뮬레이션)

  • Ahn, Tae-Jun;Yu, Yun Seop
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2017.05a
    • /
    • pp.200-201
    • /
    • 2017
  • This paper introduces the SPICE simulation results of 3D sequential inverter considering electrical coupling. TCAD data and the SPICE data are compared to verify that the electrical coupling is well considered by using BSIM-IMG for the upper NMOS and LETI-UTSOI model for the lower PMOS. When inter layer dielectric is small, it is confirmed that electrical coupling is well reflected in the top transistor $I_{ds}-V_{gs}$ characteristics according to the change of the bottom transistor gate voltage.

  • PDF

A Study on Improved SPICE MOSFET RF Model Considering Wide Width Effect (Wide Width Effect를 고려하여 개선된 SPICE MOSFET RF Model 연구)

  • Cha, Ji-Yong;Cha, Jun-Young;Lee, Seong-Hearn
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.45 no.2
    • /
    • pp.7-12
    • /
    • 2008
  • In this study, the wide width effect that the increasing rate of drain current and the value of cutoff frequency decrease with larger finger number is observed. For modeling this effect, an improved SPICE MOSFET RF model that finger number-independent external source resistance is connected to a conventional BSIM3v3 RF model is developed. Better agreement between simulated and measured drain current and cutoff frequency at different finger number is obtained for the improved model than the conventional one, verifying the accuracy of the improved model for $0.13{\mu}m$ multi-finger MOSFET.

A study on the device structure optimization of nano-scale MuGFETs (나노 스케일 MuGFET의 소자 구조 최적화에 관한 연구)

  • Lee Chi-Woo;Yun Serena;Yu Chong-Gun;Park Jong-Tae
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.43 no.4 s.346
    • /
    • pp.23-30
    • /
    • 2006
  • This paper describes the short-channel effect(SCE), corner effect of nano-scale MuGFETs(Multiple-Gate FETs) by three-dimensional simulation. We can extract the equivalent gate number of MuGFETs(Double-gate=2, Tri-gate=3, Pi-gate=3.14, Omega-gate=3.4, GAA=4) by threshold voltage model. Using the extracted gate number(n) we can calculate the natural length for each gate devices. We established a scaling theory for MuGFETs, which gives a optimization to avoid short channel effects for the device structure(silicon thickness, gate oxide thickness). It is observed that the comer effects decrease with the reduction of doping concentration and gate oxide thickness when the radius of curvature is larger than 17 % of the channel width.