• 제목/요약/키워드: $VacSim^{(Multi)}$

검색결과 12건 처리시간 0.019초

A study on Applicability of VacCAD Simulator

  • Kim, Hyung-Taek;Kim, Kang-Won
    • International journal of advanced smart convergence
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    • 제8권4호
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    • pp.200-206
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    • 2019
  • In this study, we compared the VacCAD and VacSim(Multi), commercial vacuum simulators, to verify the advantages of VacCAD's efficiency. It was emphasized on immediacy and simplicity of simulation modelling, and characteristics of the pump combinations, pumping down curves, and vacuum materials. First, usability of simulation mechanism was estimated through the modeling schematics and obtained simulation results of each employed simulator were compared to evaluate the applicability in practice. Simulation reliability of each simulator was also probed by comparing the pumping characteristics of commercially available high vacuum systems. In addition, the degree of tolerances on VacCAD was also investigated through pumping down analysis considering outgassing effect due to chamber material variations. The higher effectiveness and expediency of VacCAD than VacSim(Multi) has been presented, and it was expected that the utilization of VacCAD in vacuum applications to be increased.

진공시스템 성능에 대한 설계인자 영향 전산모사 (Simulation of Design Factor Effects on Performance of Vacuum System)

  • 김형택;정광필
    • 한국진공학회지
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    • 제16권6호
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    • pp.405-413
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    • 2007
  • 진공시스템 최적화 설계를 위한 시스템 성능에 대한 설계인자 영향이 전산모사로 연구되었다. 본 연구로 상업화 전산모사기인 $VacSim^{Multi}$에 의한 진공시스템 모델링기구가 제시되었으며 진공시스템의 진공생성기구인 펌핑계 설계인자의 영향을 평가하여 향후 여러 설계인자들의 전산모사 연구 가능성이 확인되었다. $VacSim^{Multi}$의 저진공펌프 모델 전산모사 결과와 펌프사양에 의한 배기거동이 오차범위로 일치하였으며 부스터펌프의 사용이 중진공영역 응용에 효과적인 것으로 확인되었다. 또한 자체 배기능력이 없는 유확산펌프와 터보분자펌프 배기계의 최적화보조펌프 조합이 제시되었으며, 유확산 및 터보분자펌프 배기계의 시스템 공정응용특성도 확인되었다.

디스플레이공정 진공시스템 밸브응용에 따른 진공특성 전산모사 (Simulation of Vacuum Characteristics by Applications of Vacuum Valves in Display Processing)

  • 김형택
    • 한국인터넷방송통신학회논문지
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    • 제12권2호
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    • pp.77-83
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    • 2012
  • 진공 시스템의 성능에 대한 밸브 컨덕턴스의 영향은 진공시스템의 설계 최적화를 위해 전산모사 되었다. 본 연구에서는, 전산모사기인 VacSimMulti에 의한 모델링기구가 제시되었다. 진공 시스템의 설계는 진공 장비의 다양한 산업적 구현을 위해 특정한 프로세스 조건을 충족해야 한다. 진공 밸브의 구조, 길이, 직경 등은 컨덕턴스 영향의 전산모사 변수로서 모델링 되었으며, 직렬 진공 시스템의 배기 밸브 또한, 다양한 크기와 구조로 모델링하여 전산모사되었다. 밸브 직경의 변화는 도관의 길이의 변화보다 진공특성에 있어 더 유의미한 효과를 보여주었으며 슬릿형의 밸브도관 시스템은 모델링된 밸브구조 중 가장 뛰어난 진공특성을 가지는 것으로 관찰 되었다.

Simulations of the Performance Factors on Vacuum System

  • Kim, Hyung-Taek
    • International journal of advanced smart convergence
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    • 제6권4호
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    • pp.1-8
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    • 2017
  • In this work, the effects of fairly influential factors on performance of vacuum system, such as constant pressure and outgassing effect were simulated to propose the optimum design factors. Outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for vacuum systems were suggested based on the simulation results. And, the effects of throttle valve applications on vacuum characteristics were also simulated to obtain the optimum design model of variable conductance on high vacuum system. Simulated vacuum characteristics of the proposed modelling were agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve were schematized as the modelling of throttle valve for the constant process-pressure. Simulation results were plotted as pump-down curve of chamber and variable conductance of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably.

Analysis of High Vacuum System Based on the Applications of Vacuum Materials

  • Kim, Hyung-Taek
    • Transactions on Electrical and Electronic Materials
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    • 제14권6호
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    • pp.334-338
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    • 2013
  • In this study, the outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the turbomolecular pump system than in the diffusion pump system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

반도체공정 고진공시스템 진공특성에 대한 배기도관 컨덕턴스 영향 전산모사 (Simulation of Conductance Effects on Vacuum Characteristics of High Vacuum System for Semiconductor Processing)

  • 김형택;서만재
    • 한국전기전자재료학회논문지
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    • 제23권4호
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    • pp.287-292
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    • 2010
  • Effect of conductance factors on performance of vacuum system was simulated for optimum design of vacuum system. In this investigation, the feasibility of modeling mechanism for VacSim$^{Multi}$ simulator was proposed. Application specific design of vacuum system is required to meet the particular process conditions for various industrial implementations of vacuum equipments. Geometry and length, diameter of exhaust pipeline were modeled as simulation modeling variables for conductance effects. Series vacuum system was modeled and simulated with varied dimensions and structures of exhaust pipeline. Variation of pipeline diameter showed the more significant effects on vacuum characteristics than that of pipeline length variations. It was also observed that the aperture structure of pipeline had the superior vacuum characteristics among the modeled systems.

Simulation of Modeling Characteristics of Pumping Design Factor on Vacuum System

  • Kim, Hyung-Taek;Cho, Han-Ho
    • International journal of advanced smart convergence
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    • 제5권2호
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    • pp.1-7
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    • 2016
  • Recently, with the development of advanced thin film devices comes the need for constant high quality vacuum as the deposition pressure is more demanding. It is for this reason our research seeks to understand how the variable design factors are employed in such vacuum systems. In this study, the effects of design factor applications on the vacuum characteristics were simulated to obtain the optimum design modeling of variable models on an ultra high vacuum system. The commercial vacuum system simulator, $VacSim^{(multi)}$, was used in our investigation. The reliability of the employed simulator was verified by the simulation of the commercially available models of ultra high vacuum system. Simulated vacuum characteristics of the proposed modeling aligned with the observed experimental behavior of real systems. Simulated behaviors showed the optimum design models for the ideal conditions to achieve optimal pressure, pumping speed, and compression ratio in these systems.

Simulation of outgassing effects of vacuum materials on vacuum characteristics

  • Kim, Hyung-Taek;Kim, Young-Suk
    • 반도체디스플레이기술학회지
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    • 제8권1호
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    • pp.7-12
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    • 2009
  • The outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the TMP system than in the DP system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

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진공펌프 조합에 의한 반도체공정 진공시스템 진공특성 전산모사 (Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps)

  • 김형택;김대연
    • 한국전기전자재료학회논문지
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    • 제24권6호
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    • pp.449-457
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    • 2011
  • Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.