• Title/Summary/Keyword: $SiN_{x}$

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Domestic Intercomparison Study for the Performance of Personnel Dosimeters (개인선량계 성능의 국내 상호비교)

  • Kim, Jang-Lyul;Chang, Si-Young;Kim, Bong-Hwan
    • Journal of Radiation Protection and Research
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    • v.21 no.3
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    • pp.147-153
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    • 1996
  • The Korea Atomic Energy Research Institute(KAERI) conducted a intercomparison study for personnel dosimetry services in Korea to enhance the accuracy and precision of the dosimetry system. Nine types of dosimeters(6 TLD, 3 film badge) from 7 institutions took part in this intercomparison study. Each participant submitted 30 dosimeters including transit control for irradiations. Both TLDs and film badges were irradiated with Cs-137 gamma, Sr/Y-90 beta and 4 X-ray beams in ISO wide series. Four dosimeters were irradiated on phantom with same dose equivalent for each field category. The delivered dose equivalent was in the range of $0.1{\sim}10mSv$. The participants assessed the results of their dosimeter readings in terms of the ICRU operational quantities for personal monitoring, Hp(10) and Hp(0.07). Most participants except 1 dosimeter estimated the delivered dose equivalent with biases less than ${\pm}25%$ for Cs-137 and Sr/Y-90. But for X-rays, the biases exceeded ${\pm}35%$ in some cases bacause the dose evaluation algorithm was based on the ANSI N13.11 X-ray fields which are different from those given by ISO.

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Chemical Factors of Soil Associated with the Prediction Model for Fertilizer Need of N and K in Flooded Rice based on the Multinutrient Factor Balance Concept (다요인조절개념하(多要因調節槪念下)에서의 수도(水稻) N. K 시비적량여측(施肥適量予測) 모형식(模型式)에 관여(關與)하는 토양화학적(土壤化學的) 요인(要因))

  • Park, Chon-Suh
    • Korean Journal of Soil Science and Fertilizer
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    • v.16 no.3
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    • pp.210-222
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    • 1983
  • The chemical factors of topsoil, which are associated with the prediction models of urea nitrogen (N kg/ha) need under the concept of multinutrient factor balance in soil to maintain optimum nutrient balance in rice plant grown in flooded condition, were the x/z and the Kas/Kai values. In the prediction model or equation $NRe=(58.5+0.647x/z){\cdot}F$, the F was difined as the productivity factor, which was considered to be dependent on the variety, climate and soil, and found to be better estimated as the function of Kas/Kai rather than x/z from the equation Fb=0.65+1.086kas/kai, where the x, z, Kas and Kai, respectively, were available $SiO_2$ ppm, % organic matter, K activity ratio or exchangeable $K^+/(\sqrt{Ca+Mg}+Na^+)$ in topsoil and the ideal K activity ratio determined by the equation Kai=0.03+0.00083x/z for standard variety Jinheung. The relative K activity ratio or Kas/kai in topsoil, which have to be equal to 1.0 in the prediction of K fertilizer need for standard Japonica Variety Jinheung, found to be 1.63 for the varieties of Indica ${\times}$ Japonica or Milyang No. 23 grown in Korean condition and 0.322 for the Indica varieties of IR 8, 20, 36 and 42 gown in the Philippines condition. The ideal K activity rations for different Varieties such as Indies ${\times}$ Japonica grown in Korea or $Kai_1$ and Indica grown in the Philippines or $Kai_2$ were computed to be estimated from the following equations respectively ; $\\Kai_1=0.0489+0.001353X/Z\\Kai_2=0.01+0.000267X/Z$.

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Plasma-Induced Grafting of Poly(N-vinyl-2-pyrrolidone) onto Polypropylene Surface (폴리프로필렌 표면 위에 폴리비닐피롤리돈의 플라즈마 유도 그래프트 공중합)

  • Ji, Han-Sol;Jung, Si-In;Hur, Ho;Choi, Ho-Suk;Kim, Jae-Ha;Park, Han-Oh
    • Polymer(Korea)
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    • v.36 no.3
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    • pp.302-308
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    • 2012
  • The objective of this study is to investigate optimum reaction conditions for the grafting of poly($N$-vinyl- 2-pyrrolidone) (PVP) onto the surface of plasma-treated polypropylene film. The plasma treatment conditions were fixed as 200 W rf power, 6 LPM Ar flow rate, 30 sec treatment time, and 5 min exposure time after treatment. For graft copolymerization, we investigated the change of grafting degree with respect to reaction time, reaction temperature and $N$-vinyl-2-pyrrolidone concentration. Maximum grafting degree was obtained at the conditions of 6 h reaction time, $90^{\circ}C$ reaction temperature, and 40% $N$-vinyl-2-pyrrolidone concentration. The introduction of PVP was confirmed by ATR-FTIR, XPS, and SEM analysis.

A Study on the Surface of the Dry Etched TaN Thin Film by Adding The CH4 Gas in BCl3/Ar Inductively Coupled Plasma (BCl3/Ar 유도결합 플라즈마 안에 CH4 가스 첨가에 따른 건식 식각된 TaN 박막 표면의 연구)

  • Woo, Jong-Chang;Choi, Chang-Auck;Yang, Woo-Seok;Joo, Young-Hee;Kang, Pil-Seung;Chun, Yoon-Soo;Kim, Chang-Il
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.5
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    • pp.335-340
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    • 2013
  • In this study, the plasma etching of the TaN thin film with $CH_4/BCl_3/Ar$ gas chemistries was investigated. The etch rate of the TaN thin film and the etch selectivity of TaN to $SiO_2$ was studied as a function of the process parameters, including the amount of $CH_4$. X-ray photoelectron spectroscopy (XPS) and Field-emission scanning electron microscopy (FE-SEM) was used to investigate the chemical states of the surface of the TaN thin film.

Electrical and Physical Characteristics of Nickel Silicide using Rare-Earth Metals (희토류 금속을 이용한 니켈 실리사이드의 전기 및 물리적 특성)

  • Lee, Won-Jae;Kim, Do-Woo;Kim, Yong-Jin;Jung, Soon-Yen;Wang, Jin-Suk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.1
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    • pp.29-34
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    • 2008
  • In this paper, we investigated electrical and physical characteristics of nickel silicide using rare-earth metals(Er, Yb, Tb, Dy), Incorporated Ytterbium into Ni-silicide is proposed to reduce work function of Ni-silicide for nickel silicided schottky barrier diode (Ni-silicided SBD). Nickel silicide makes ohmic-contact or low schottky barrier height with p-type silicon because of similar work function (${\phi}_M$) in comparison with p-type silicon. However, high schottky barrier height is formed between Ni-silicide and p-type substrate by depositing thin ytterbium layer prior to Ni deposition. Even though the ytterbium is deposited below nickel, ternary phase $Yb_xN_{1-x}iSi$ is formed at the top and inner region of Ni-silicide, which is believed to result in reduction of work function about 0.15 - 0.38 eV.

Fabrication of Microbolometer using Polyimide Sacrificial Layer (폴리이미드 희생층을 이용한 마이크로 볼로미터의 제작)

  • Ha, W.H.;Kang, H.K.;Kim, M.C.;Moon, S.;Oh, M.H.;Kim, D.H.;Choi, J.S.
    • Proceedings of the KIEE Conference
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    • 1999.11d
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    • pp.1137-1139
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    • 1999
  • 저가의 우수한 성능을 갖는 적외선 영상표시 소자 구현에 적합한 마이크로 볼로미터를 MEMS 기술을 사용하여 제작하였다. 작은 열질량을 갖는 마이크로미터 단위의 열적고립 구조(thermal isolation structure) 제작은 폴리이미드(PI2611)를 희생층으로 사용하여 최종적으로 ashing공정 단계에서 폴리이미드를 제거하여 마이크로 볼로미터 구조를 완성하였다. 이 때의 구조층으로는 PECVD 질화실리콘($SiN_x$) 박막, 감지층으로 산화바나듐($VO_x$) 박막을 사용하였다. 본 연구에서는 폴리이미드 패턴 형성시 건식식각 공정조건 변수에 따라서 패턴의 기울기를 조절하여 폴리이미드 측면에서 발생되는 불 균일한 박막 증착과 패터닝 문제를 개선하였다. 또한 저응력의 질화실리콘 박막을 사용하여 잔류응력에 의한 열적고립 구조의 뒤틀림 현상을 완화하였다.

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High Crystalline Epitaxial Bi2Se3 Film on Metal and Semiconductor Substrates

  • Jeon, Jeong-Heum;Jang, Won-Jun;Yun, Jong-Geon;Gang, Se-Jong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.302-302
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    • 2011
  • The binary chalcogenide semiconductor Bi2Se3 is at the center of intensive research on a new state of matter known as topological insulators. It has Dirac point in their band structures with robust surface states that are protected against external perturbations by strong spin-orbit coupling with broken inversion symmetry. Such unique band configurations were confirmed by recent angle-resolved photoelectron emission spectroscopy experiments with an unwanted n-type doping effect, showing a Fermi level shift of about 0.3 eV caused by atomic defects such as Se vacancies. Since the number of defects can be reduced using the molecular beam epitaxy (MBE) method. We have prepared the Bi2Se3 film on noble metal Au(111) and semiconductor Si(111) substrates by MBE method. To characterize the film, we have introduced several surface sensitive techniques including x-ray photoemission electron spectroscopy (XPS) and micro Raman spectroscopy. Also, crystallinity of the film has been confirmed by x-ray diffraction (XRD). Using home-built scanning tunneling microscope, we observed the atomic structure of quintuple layered Bi2Se3 film on Au(111).

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Improving the Light Extraction Efficiency of GRIN Coatings Pillar Light Emitting Diodes

  • Moe, War War;Aye, Mg;Hla, Tin Tin
    • Korean Journal of Materials Research
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    • v.32 no.6
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    • pp.293-300
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    • 2022
  • This study investigated a graded-refractive-index (GRIN) coating pattern capable of improving the light extraction efficiency of GaN light-emitting diodes (LEDs). The planar LEDs had total internal reflection thanks to the large difference in refractive index between the LED semiconductor and the surrounding medium (air). The main goal of this paper was to reduce the trapped light inside the LED by controlling the refractive index using various compositions of (TiO2)x(SiO2)1-x in GRIN LEDs consisting of five dielectric layers. Several types of multilayer LEDs were simulated and it was determined the transmittance value of the LEDs with many layers was greater than the LEDs with less layers. Then, the specific ranges of incident angles of the individual layers which depend on the refractive index were evaluated. According to theoretical calculations, the light extraction efficiency (LEE) of the five-layer GRIN is 25.29 %, 28.54 % and 30.22 %, respectively. Consequently, the five-layer GRIN LEDs patterned enhancement outcome LEE over the reference planar LEDs. The results suggest the increased light extraction efficiency is related to the loss of Fresnel transmission and the release of the light mode trapped inside the LED chip by the graded-refractive-index.

The Electrical Properties of Mutilayer Chip Capacitor with X7R by Addition of Rare-Earth Ions (Y2O3, Er2O3) using Design of Experiments (실험계획법을 적용한 X7R 적층 칩 커패시터의 희토류(Y2O3, Er2O3) 첨가에 따른 전기적 특성)

  • Yoon, Jung-Rag;Moon, Hwan;Lee, Heun-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.3
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    • pp.216-221
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    • 2010
  • Employing statistical design of experiments, the difference in doping behaviors of rare-earth ions and their effects on the dielectric property and microstructure of $BaTiO_3$-MgO-$MnO_2$-($Ba_{0.4}Ca_{0.6}$) $SiO_3-Re_2O_3$ (Re = $Y_2O_3$, $Er_2O_3$) system were investigated. Through the statistical analysis we have found that the amount of $Re_2O_3$ are significantly affecting on the dielectric properties. The $Re_2O_3$ improved the dielectric constant, dielectric loss and R*C constant, so the appropriate contents of $Y_2O_3$ and $Er_2O_3$ were 0.8 ~ 1.2 mol% and 0.8 ~ 1.3 mol%, respectively. The MLCC(mutilayer chip capacitor) with $2.0{\times}1.2{\times}1.2mm$ size and 475 nF was also suited for X7R with the above composition. It showed that the dielectric constant and RC constant were 2,839 and 3,675 ${\Omega}F$, respectively in the sintering condition at $1250^{\circ}C$ in $Po_2$ $10^{-7}$ Mpa.

CMOS 소자 응용을 위한 Plasma doping과 Silicide 형성

  • Choe, Jang-Hun;Do, Seung-U;Seo, Yeong-Ho;Lee, Yong-Hyeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.456-456
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    • 2010
  • CMOS 소자가 서브마이크론($0.1\;{\mu}m$) 이하로 스케일다운 되면서 단채널 효과(short channel effect), 게이트 산화막(gate oxide)의 누설전류(leakage current)의 증가와 높은 직렬저항(series resistance) 등의 문제가 발생한다. CMOS 소자의 구동전류(drive current)를 높이고, 단채널 효과를 줄이기 위한 가장 효율적인 방법은 소스 및 드레인의 얕은 접합(shallow junction) 형성과 직렬 저항을 줄이는 것이다. 플라즈마 도핑 방법은 플라즈마 밀도 컨트롤, 주입 바이어스 전압 조절 등을 통해 저 에너지 이온주입법보다 기판 손상 및 표면 결함의 생성을 억제하면서 고농도로 얕은 접합을 형성할 수 있다. 그리고 얕은 접합을 형성하기 위해 주입된 불순물의 활성화와 확산을 위해 후속 열처리 공정은 높은 온도에서 짧은 시간 열처리하여 불순물 물질의 활성화를 높여주면서 열처리로 인한 접합 깊이를 얕게 해야 한다. 그러나 접합의 깊이가 줄어듦에 따라서 소스 및 드레인의 표면 저항(sheet resistance)과 접촉저항(contact resistance)이 급격하게 증가하는 문제점이 있다. 이러한 표면저항과 접촉저항을 줄이기 위한 방안으로 실리사이드 박막(silicide thin film)을 형성하는 방법이 사용되고 있다. 본 논문에서는 (100) p-type 웨이퍼 He(90 %) 가스로 희석된 $PH_3$(10 %) 가스를 사용하여 플라즈마 도핑을 실시하였다. 10 mTorr의 압력에서 200 W RF 파워를 인가하여 플라즈마를 생성하였고 도핑은 바이어스 전압 -1 kV에서 60 초 동안 실시하였다. 얕은 접합을 형성하기 위한 불순물의 활성화는 ArF(193 nm) excimer laser를 통해 $460\;mJ/cm^2$의 에니지로 열처리를 실시하였다. 그리고 낮은 접촉비저항과 표면저항을 얻기 위해 metal sputter를 통해 TiN/Ti를 $800/400\;{\AA}$ 증착하고 metal RTP를 사용하여 실리사이드 형성 온도를 $650{\sim}800^{\circ}C$까지 60 초 동안 열처리를 실시하여 $TiSi_2$ 박막을 형성하였다. 그리고 $TiSi_2$의 두께를 측정하기 위해 TEM(Transmission Electron Microscopy)을 측정하였다. 화학적 결합상태를 분석하기 위해 XPS(X-ray photoelectronic)와 XRD(X-ray diffraction)를 측정하였다. 접촉비저항, 접촉저항과 표면저항을 분석하기 위해 TLM(Transfer Length Method) 패턴을 제작하여 I-V 특성을 측정하였다. TEM 측정결과 $TiSi_2$의 두께는 약 $580{\AA}$ 정도이고 morphology는 안정적이고 실리사이드 집괴 현상은 발견되지 않았다. XPS와 XRD 분석결과 실리사이드 형성 온도가 $700^{\circ}C$에서 C54 형태의 $TiSi_2$ 박막이 형성되었고 가장 낮은 접촉비저항과 접촉저항 값을 가진다.

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