• ETRI Journal
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• v.30 no.3
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• pp.383-393
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• 2008

The etching mechanism of $ZrO_2$ thin films and etch selectivity over some materials in both $BCl_3$/Ar and $BCl_3/CHF_3$/Ar plasmas are investigated using a combination of experimental and modeling methods. To obtain the data on plasma composition and fluxes of active species, global (0-dimensional) plasma models are developed with Langmuir probe diagnostics data. In $BCl_3$/Ar plasma, changes in gas mixing ratio result in non-linear changes of both densities and fluxes for Cl, $BCl_2$, and ${BCl_2}^+$. In this work, it is shown that the non-monotonic behavior of the $ZrO_2$ etch rate as a function of the $BCl_3$/Ar mixing ratio could be related to the ion-assisted etch mechanism and the ion-flux-limited etch regime. The addition of up to 33% $CHF_3$ to the $BCl_3$-rich $BCl_3$Ar plasma does not influence the $ZrO_2$ etch rate, but it non-monotonically changes the etch rates of both Si and $SiO_2$. The last effect can probably be associated with the corresponding behavior of the F atom density.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.4
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• pp.483-491
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• 2017

The interdigitated germanium (Ge) meta-lsemiconductor-metal (MSM) photodetectors (PDs) with and without an $SiO_2$ anti-reflection (AR) layer was fabricated, and the effect of $SiO_2$ AR layer on their optoelectronic response properties were investigated in detail. The lowest reflectance of 15.6% at the wavelength of 1550 nm was obtained with a $SiO_2$ AR layer with a thickness of 260 nm, which was in a good agreement with theoretically calculated film thickness for minimizing the reflection of Ge surface. The Ge MSM PD with 260 nm-thick $SiO_2$ AR layer exhibited enhanced device performance with the maximum values of responsivity of 0.65 A/W, the quantum efficiency of 52.2%, and the detectivity of $2.49{\times}10^9cm\;Hz^{0.5}W^{-1}$ under the light illumination with a wavelength of 1550 nm. Moreover, time-dependent switching analysis of Ge MSM PD with 260 nm- thick $SiO_2$ AR layer showed highest on/off ratio with excellent stability and reproducibility. All this investigation implies that 260 nm-thick $SiO_2$ AR layer, which is effective in the reduction in the reflection of Ge surface, has a great potential for Ge based optoelectronic devices.

• Journal of the Korean Vacuum Society
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• v.19 no.3
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• pp.177-183
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• 2010

We report on the deposition of ZnO films using a metal organic chemical vapor deposition (MOCVD) as a function of pushing pressure and kind of reactant such as oxygen gas and water A diethylzinc (DEZ) is supplied and controlled by Ar pushing pressure through bubbling system. Oxygen gas and water are used as reactant in order to form oxidation. We knew that the surface roughness is related in the process conditions such as reactant kind and DEZ flow rate. A substrate temperature has little role of surface roughness with $O_2$ reactant. However, $H_2O$ reactant makes it to increase over the 20 times. We could get the maximum roughness of 39.16 nm at the 90 sccm of DEZ Ar flow rate, the 8 Pa of $H_2O$ vapor pressure, and the $140^{\circ}C$ of substrate temperature. In this paper, we investigated the ZnO films for the application to the light absorption layer of solar cell layer.

• Progress in Superconductivity and Cryogenics
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• v.11 no.2
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• pp.1-6
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• 2009

We report a successful fabrication of $high-J_c\;NdBa_2Cu_3O_{7-{\delta}}$ (NdBCO) films on $SrTiO_3$(STO) (100) substrates by pulsed laser deposition (PLD) in a relatively wide processing window. Under various oxygen pressures controlled by either 1%$O_2$/Ar mixture gas or pure $O_2$ gas, strongly c-axis oriented NdBCO films were grown at the substrate temperature $(T_s)\;of\;800^{\circ}C$ in 800 mTorr with 1%$O_2$/Ar gas and also in 400 and 800 mTorr with pure $O_2$ gas. These samples exhibited $T_c$ values over 90K and $J_c$ values of $2.8-3.5MA/cm^2$ at 77K in self-field (77K, sf). On the other hand, $J_c$ values over $1A/cm^2$ were obtained at the temperature regions of $700-830^{\circ}C$ in 800 mTorr with 1%$O_2$/Ar gas at those of $750-830^{\circ}C$ in 800 mTorr with pure $O_2$ gas. Unlike previous reports, resent results support that the PLD processing window for high-Jc NdBCO films is not narrow.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.72-74
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• 2004

In this study, we used a inductively coupled plasma (ICP) source for etching $Al_2O_3$ thin films because of its high plasma density, low process pressure and easy control bias power. $Al_2O_3$ thin films were etched using $Cl_2/BCl_3$, $N_2/Cl_2/BCl_3$, and Ar/$Cl_2/BCl_3$ plasma. The experiments were carried out measuring the etch rates and the selectivities of $Al_2O_3$ to $SiO_2$ as a function of gas mixing ratio, rf power, and chamber pressure. When $Cl_2$ 50% was added to $Cl_2/BCl_3$ plasma, the etch rate of the $Al_2O_3$ films was 118 nm/min. We also investigated the effect of gas addition. In case of $N_2$ addition, the etch rate of the $Al_2O_3$ films decreased while $N_2$ was added into $Cl_2/BCl_3$ plasma. However, the etch rate increased slightly as Ar added into $Cl_2/BCl_3$ plasma, and then further increase of Ar decreased the etch rate. The maximum etch rate was 130 nm/min at Ar 20% in $Cl_2/BCl_3$ plasma, and the highest etch selectivity was 0.81 in $N_2$ 20% in $Cl_2/BCl_3$ plasma. And, we obtained the results that the etch rate increases as rf power increases and chamber pressure decreases. The characteristics of the plasmas were estimated using optical emission spectroscopy (OES).

• Bulletin of the Korean Chemical Society
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• v.25 no.2
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• pp.226-232
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• 2004

Ground and low-lying electronic states of Cr atoms in the gas phase were generated from photolysis of $Cr(CO)_6$ vapor in He or Ar using an unfocussed weak UV laser pulse and their reactions with $O_2$ and $N_2O$ were studied. When 0.5-1.0 Torr of $Cr(CO)_6$ /$O_2$ /He or Ar mixtures were photolyzed using 295-300 nm laser pulses, broadband chemiluminescence peaked at ~420 and ~500 nm, respectively, was observed in addition to the atomic emissions from $z^7P^{\circ}$, $z^5P^{\circ}$, and $y^7P^{\circ}$ states of Cr atoms. When $N_2O$ was used instead of $O_2$, no chemiluminescence was observed. The chemiluminescence intensities as well as the LIF intensities for those three low-lying electronic states ($a^7S_3,\;a^5S_2\;and\;a^5D_J$) showed second-order dependence on the photolysis laser power. Also, the chemiluminescence intensities were first-order in $O_2$ pressure, but the presence of excess Ar showed a strong inhibition effect on them. Based on the experimental results, the chemiluminecent species in this work is attributed to $CrO_2^*$ generated from hot ground state Cr atoms with $O_2$. The apparent radiative lifetimes of the chemiluminescent species and collisional quenching rate constants by $O_2$ and Ar also were investigated.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1211-1214
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• 2005

One of the important problems in recent AC-PDP technology is high efficiency. In this research, we have been investigated electro-optical characteristics of MgO protective layer after radio frequency(RF) plasma treatment using Ar, $O_2$, and $H_2$ gases. The breakdown voltage order was $O_2$ > Ar > Nontreatment > $H_2$. Also, brightness order was $O_2$ > Ar > Non-treatment > $H_2$. In this experiment, the best result was obtained after $O_2-plasma$ treatment.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.117-119
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• 2003

The $Pb(Zr_{0.3}Ti_{0.7)O_3/Pb(Zr_{0.7}/Ti_{0.3})O_3$ [PZT(30/70)/(70/30)] heterolayered thin films were deposited by RF sputtering method on the $Pt/TiO_2/SiO_2/Si$ substrate. Sputter gas ratio(AR/O2) was changed form 90/10 to 50/50. The structural properties and electrical properties of the PZT(30/70)/ (70/30) heterolayered thin films were studied. The relative dielectric constant and dielectric loss at 100Hz of the PZT(30/70)/PZT(70/30) heterolayered thin films with Ar/$O_2$(80/20) ratio were about 982 and 0.036, respectively.

• Transactions on Electrical and Electronic Materials
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• v.16 no.6
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• pp.346-350
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• 2015

In this study, we carried out an investigation of the etch characteristics of TiO₂ thin films and the selectivity of TiO₂ to SiO₂ in adaptive coupled C1₂/Ar plasma. The maximum etch rate of the TiO₂ thin film was 136±5 nm/min at a gas mixing ratio of C1₂/Ar (75%:25%). The X-ray photoelectron spectroscopy (XPS) analysis showed the efficient destruction of oxide bonds by the ion bombardment as well as the accumulation of low volatile reaction products on the etched surface.

• Journal of the Korean institute of surface engineering
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• v.54 no.2
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• pp.43-52
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• 2021

The Ni-based superalloy, Inconel 740, was corroded between 800 and 1100℃ for up to 100 hr in air and Ar-0.2%SO₂ gas in order to study its corrosion behavior in air and sulfur/oxygen environment. It displayed relatively good corrosion resistance in both environment, because its corrosion was primarily dominated by not sulfidation but oxidation especially in Ar-0.2%SO₂ gas. Such was attributed to the thermodynamic stability of oxides of alloying elements when compared to corresponding sulfides. The scales consisted primarily of Cr₂O₃, together with some NiAl₂O₄, MnCr₂O₄, NiCrMnO₄, and rutile-TiO₂. Sulfur from SO₂ gas made scales prone to spallation, and thicker. It also widened the internal corrosion zone when compared to air. The corrosion resistance of IN740 was mainly indebted to the formation of protective Cr₂O₃-rich oxides, and suppression of the sulfide formation.