1 |
W. U. Chung, S. R. Oh, J. H. You, K. T. Lim, Y. K. Oh, and N. H. Kim, Proc. of 13th Korean Conference on Semiconductors (Jeju, Korea, 2006) p. 909.
|
2 |
Y. H. Joo, J. C. Woo, and C. I. Kim, Trans. Electr. Electron. Mater., 13, 144 (2012). [DOI: http://dx.doi.org/10.4313/TEEM.2012.13.3.144]
DOI
|
3 |
J. C. Woo, Y. S. Chun, Y. H. Joo, and C. I. Kim, Vacuum, 86, 2152 (2012). [DOI: http://dx.doi.org/10.1016/j.vacuum.2012.05.016]
DOI
|
4 |
A. Le Gouil, O. Joubert, G. Cunge, Tchevolleau, L. Vallier, B. Chenevier, and I. Matko, J. Vac. Sci. Technol. B, 25, 767 (2007. [DOI: http://dx.doi.org/10.1116/1.2732736]
DOI
|
5 |
K. R. Choi, J. C. Woo, Y. H. Joo, and C. I. Kim, Ferroelectrics, 456, 63 (2013). [DOI: http://dx.doi.org/10.1080/00150193.2013.846201]
DOI
|
6 |
C. S. Lee, Z. Y. Cui, H. F. Jin, S. W. Sung, H. G. Lee, and N. S. Kim, Trans. Electr. Electron. Mater., 12, 35 (2011). [DOI: http://dx.doi.org/10.4313/TEEM.2011.12.1.35]
DOI
|
7 |
H. S. Kim, S.A. Campbell, and D.C. Gilmer, IEEE Electron Device Lett., 18, 465 (1997). [DOI: http://dx.doi.org/10.1109/55.624911].
DOI
|
8 |
A. M. Efremov, G. H. Kim, J. G. Kim, A.V. Bogomolov, and C. I. Kim, Microelectronic Engineering, 84, 136 (2007). [DOI: http://dx.doi.org/10.1016/j.mee.2006.09.020]
DOI
|
9 |
R. d’Agostino, F. Fracassi, and C. Pacifico, J. Appl. Phys., 72, 4351 (1992). [DOI: http://dx.doi.org/10.1063/1.352199]
DOI
|
10 |
I. Bertoti, M. Mohai, J. L. Sullivan, and S. O. Saied, Appl. Surf. Sci., 84, 357 (1995). [DOI: http://dx.doi.org/10.1016/0169-4332(94)00545-1]
DOI
|
11 |
A. M. Efremov, D. P. Kim, and C. I. Kim, IEEE Trans. Plasma Sci., 32, 1344 (2004). [DOI: http://dx.doi.org/10.1109/TPS.2004.828413]
DOI
|
12 |
G. H. Kim, K. T. Kim, D. P. Kim, and C. I. Kim, Thin Solid Films, 475, 86 (2005). [http://dx.doi.org/10.1016/j.tsf.2004.08.028]
DOI
|
13 |
L. Sha, R. Puthenkovilakam, Y. S. Lin, and J. P. Chang, J. Vac. Sci. Technol. B, 21, 2420 (2003). [DOI: http://dx.doi.org/10.1116/1.1627333]
DOI
|
14 |
L. Sha, B. O. Cho, and J. P. Chang, J. Vac. Sci. Technol. A, 20, 1525 (2002). [http://dx.doi.org/. [DOI: http://dx.doi.org/10.1116/1.1491267]
DOI
|
15 |
N. H. Kim, Inventor: APTC Co, Assignee. United States Patent US2009015635 (2009).
|