• 한국세라믹학회지
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• 제30권8호
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• pp.615-622
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• 1993

In order to increase chemical durability of thin films in binary system B2O3-SiO2 and Al2O3-SiO2 on the slide glass by the dip-coating technique from TEOS(Tetraethyl Orthosilicate) and boric acid or aluminum nitrate, phosphoric acid(5~20mol%) was added, respectively. Corrosion of acid and alkali of samples treated with 1N, HCl, NaOH and distilled water at 10$0^{\circ}C$ for 15 minute, were measured IR transmittance and variance of transmittance at visible range. Surface structure of thin film was investigated with SEM and formation of crystal phase according to additiion of phosphoric acid was measrued with XRD. In Al2O3-SiO2 system, change of remarkable characteristic was not obtained at the addition of P2O5 but transmittance of thin film was decreased with addition of P2O5 in B2O3-SiO2 system.

• 한국전기전자재료학회논문지
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• 제16권9호
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• pp.807-811
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• 2003

We investigated the electrical characterisitics of T $a_2$ $O_{5}$ (tantalum pentoxide) film and Ti-O/T $a_2$ $O_{5}$ film deposited on $Al_2$ $O_3$based substrate. Ta (tantalum) electrode and $Al_2$ $O_3$ substrate was used for the purpose of simplifying the manufacturing process in IPD's (integrated passive devices). Dielectric materials (T $a_2$ $O_{5}$ and Ti-O/T $a_2$ $O_{5}$ films) deposited on Ta/Ti/A $l_2$ $O_3$ were annealed at 700 $^{\circ}C$ for 60 sec. in vacuum. The XRD results showed that as-deposited T $a_2$ $O_{5}$ film possessed amorphous structure, which was transformed to crystallines by rapid thermal heat treatment. We compared the lnJ- $E^{{\frac}{1}{2}}$, C-V, C-F of both as-deposited and annealed dielectric thin films deposited on Ta bottom electrode. From this results, we concluded that the leakage current could be reduced by introducing Ti-O buffer layer and conduction mechanisms of T $a_2$ $O_{5}$ and Ti-O/T $a_2$ $O_{5}$ could be interpreted appropriately by Schottky emission effect.

• 한국표면공학회지
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• 제35권3호
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• pp.149-157
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• 2002

Spectral emissivity depends on the surface conditions of the materials. The mechanisms that affect the spectral emissivity in anodic oxide films on aluminum were investigated. The aluminum specimens were anodized in a sulfuric acid solution and the thickness of the resulting oxide film formed changed with the anodizing time. FT-IR spectrum analysis identified the anodic oxide film as boehmite ($Al_2$$O_3$.$H_2$O). Both the infrared emisivity and reflectivity of the anodized aluminum were affected by the structure of the anodic oxide film because Al-OH and Al-O-Al have a pronounced absorption band in the infrared region of the spectrum. The presence of an anodic oxide film on aluminum caused a rapid drop in the infrared reflectivity. An aluminum surface in the clean state had an emissivity of approximately 0.2. However, the infrared emissivity rapidly increased to 0.91 as the thickness of the anodic oxide film increased.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.319-320
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• 2009

In this study, high-quality Al-N doped p-type ZnO thin films were deposited on n-type Si (100) wafer or Si coated with buffer layer by DC magnetron sputtering in the mixture of $N_2$ and $O_2$ gas. The target was ceramic ZnO mixed with $Al_2O_3$ (2 wt%). The p-type ZnO thin film showed higher carrier concentration $2.93\times10^{17}cm^{-3}$, lower resistivity of $5.349\;{\Omega}cm$ and mobility of $3.99\;cm^2V^{-1}S^{-1}$, respectively. According to PL spectrum, the Al donor energy level depth ($E_d$) of Al-N codoped p-type ZnO film was reduced to about 51 meV, and the N acceptor energy level depth ($E_a$) was reduced to 63 meV, respectively.

• 한국표면공학회지
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• 제1권1호
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• pp.14.1-18
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• 1967

The characteristics of sulfuric acid anodized layer was studied under various Conbitions, acid concentration : 5-20%, temperature : 5-25$^{\circ}C$, bath voltate : 16 volts , bath agitain : mech agitation : mechanical . The Al+++ ion increase in anodizing baty, the film thickness under microscope, the comparative porosity and the thickness were determined. It was found that film thickness and the porosithy which are the main factors of determining andoized layet quality, rule the corrosing and abrasiion tesistance of the film, and that the porosity is increasing in the outerlayer. The formation mechanism was assumed as follows : The film thickness -increase is due to OH_ ion diffusion into compact non-conductive layer and Al+ + OH_ \longrightarrowAl(OH), Al(OH)+ + OH_ \longrightarrowAl(OH)+$_2$ , Al(OH)+$_2$ + OH_ \longrightarrowAl(OH)$_3$., the strong adhesion force is alse due to Al(OH) or Al(OH)$_2$ in transtion layer. And the pore-nucleation is produced by volume change between Al and Al$_2$O$_3$ and activated H$_2$O gas created by large reaction heat of Al+(x) +OH_ \longrightarrowAl(OH)x.

• 한국전기전자재료학회논문지
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• 제33권3호
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• pp.219-224
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• 2020

Al₂O₃ powders with particle sizes of 0.35 ㎛, 0.5 ㎛, 1.5 ㎛, and 2.5 ㎛ are deposited onto glass and Cu substrates using the aerosol deposition (AD) process. The deposition characteristics of Al₂O₃ films using those four types of Al₂O₃ powders are investigated to determine the influence of the particle size on the films. To observe detailed micro-structures of the films, the cross-section and surface morphology are observed. Then, the crystalline size and internal strain are calculated from X-ray diffraction peaks in order to confirm the hammering effect as well as the micro-strain during the AD deposition. From the above results, deposition mechanisms related to the particle size are studied. The results of this study indicate the optimal particle size and formation mechanisms for dense Al₂O₃ film with a smooth surface roughness as well as for a porous Al₂O₃ film with a rough surface roughness.

• 마이크로전자및패키징학회지
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• 제6권3호
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• pp.37-43
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• 1999

고주파에서 사용하기 위한 $SiO_2-TiO_2-Bi_2O_3$-RO계(RO:BaO-CaO-SrO)를 주성분으로 하는 결정화 유리와 세라믹 충진재로서 $Al_2O_3$를 혼합하여 제조한 저온 소성용 Glass/Ceramic 유전체 모재와 Ag-thick film의 동시 소결시 발생할 수 있는 소결 부정합과 그 해소 방안을 연구하였다. 적층된 Glass/Ceramic 유전체 sheet와 Ag-thick film의 동시 소결시에 소결체는 sheet와 film의 densification rate 차 등에 의해 큰 camber 현상과 그로 인해 Ag-film에 crack이 발생하였다. 이를 교정하기 위해 유리 성분과 $Al_2O_3$성분이 혼합된 유전체 분말에 $B_2O_3$를 6, 8, 10, 12, 14 vol% 첨가한 결과를 보면 $B_2O_3$첨가량이 증가함에 따라 소결체의 camber 현상은 점점 크게 줄어들었으며 14 vol% 첨가된 경우에는 거의 관찰되지 않았다. 또한 $BaO_3$첨가량이 증가함에 따라 유전율($varepsilon_{r}$)은 점점 감소하였고 Q$\times$f 값은 크게 증가하는 경향을 나타내었으며 $\tau_{f}$ 값은 양(+)의 값으로 점점 크게 변하였다.

• Current Photovoltaic Research
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• 제3권1호
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• pp.32-38
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• 2015

CIGS solar cell consisted of various films. In this research, we investigated electrode materials in $Cu(In,Ga)Se_2$ (CIGS) cells, including Al-doped ZnO (ZnO:Al), intrinsic ZnO (i-ZnO), and Al films. The sputtered ZnO:Al film with a sputtering power at 200W showed the lowest series resistance and highest cell efficiency. The electrical resistivity of the 200-W sputtered ZnO:Al film was $5.2{\times}10^{-4}{\Omega}{\cdot}cm$ by the rapid thermal annealing at $200^{\circ}C$ for 1 min. The electrical resistivity of i-ZnO was not measurable due to its high resistance. But the optical transmittance was highest with less oxygen supply and high efficiency cell was achieved with $O_2/(Ar+O_2)$ ratio was 1% due to the increase of short-circuit current. No significant change in the cell performance by inserting a Ni layer between Al and ZnO:Al films was observed.

• 한국세라믹학회지
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• 제47권5호
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• pp.461-466
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• 2010

In this study, $Al_2O_3/TaAlO_4/SiO_2$ (A/TAlO/S) structures with tantalum aluminate charge trap layer were fabricated for Nand flash memory device. We evaluated the memory window and retention characteristic as the thickness of the tunnel oxide was varied among 3 nm, 4 nm, and 5 nm. All tunnel oxide thicknesses were measured by ellipsometer and TEM (Transmission Electron Microscope). The A/TAlO/S multi-layer film consisted of 5 nm tunnel oxide showed the best result of memory window of 1.57 V and retention characteristics. After annealing the 5 nm tunnel oxide A/TAlO/S multi-layer film at $900^{\circ}C$. The memory window decreased to 1.32 V. Moreover, the TEM images confirmed that the thickness of multi-layer structure decreased 14.3% after annealing and the program conditions of A/TAlO/S multi-layer film decreased from 13 V to 11 V for 100 ms. Retention properties of both as-deposited and annealed films stably maintained until to $10^4$ cycles.

• 한국결정성장학회지
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• 제20권6호
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• pp.254-261
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• 2010

본 연구에서는 다결정 실리콘 태양전지 응용을 위한 다결정 실리콘 씨앗층의 제조와 그의 특성에 관한 연구를 수행하였다. 다결정 실리콘 씨앗층은 glass/Al/$Al_2O_3$/a-Si 구조를 이용하여 aluminum-induced layer exchange(ALILE) 고정으로 제조하였으며, 자연산화막부터 50 nm까지 다양한 크기로 $Al_2O_3$ 막두께를 변화시켜 알루미늄 유도 결정화 공정에서 막의 두께가 결정화 특성 및 결정결함, 결정크기에 미치는 영향에 대하여 조사하였다. 연구결과, ALILE 공정으로 생성된 다결정 실리콘막의 결함은 $Al_2O_3$ 막의 두께가 증가할수록 함께 증가한 반면, 결정화 정도와 결정입자의 크기는 $Al_2O_3$막의 두께가 증가할수록 감소하였다. 본 실험에서는 16 nm 두께 이하의 앓은 $Al_2O_3$ 막의 구조에서 평균 약 $10\;{\mu}m$ 크기의 sub-grain 결정립을 얻었으며, 결정성은 <111> 방향의 우선 배향성 특성을 보였다.