• 한국세라믹학회지
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• 제44권8호
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• pp.403-406
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• 2007

Ferroelectric Ce-doped $Bi_4Ti_3O_{12}$ (BCT) thin films were deposited by liquid delivery metal organic chemical vapor deposition (MOCVD) onto a $Pt(111)/Ti/SiO_2/Si(100)$ substrate. X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to identify the crystal structure, the surface, and the cross-section morphology of the deposited ferroelectric flims. After annealing above $640^{\circ}C$, the BCT films exhibited a polycrystalline structure with preferred (001) and (117) orientations. The BCT lam capacitor with a top Pt electrode showed a large remnant polarization ($2P_r$) of $44.56{\mu}C/cm^2$ at an applied voltage of 5 V and exhibited fatigue-free behavior up to $1.0{\times}10^{11}$ switching cycles at a frequency of 1 MHz. This study clearly reveals that BCT thin film has potential for application in non-volatile ferroelectric random access memories and dynamic random access memories.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 춘계총회,특별강연,심포지움,연구발표회
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• pp.124.1-124.1
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• 2000

• 한국전기전자재료학회논문지
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• 제20권7호
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• pp.575-580
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• 2007

A 16 Mb 1T1C FeRAM device was integrated with BLT capacitors. But a lot of cells were failed randomly during the measuring the bit-line signal distribution of each cell. The reason was revealed that the grain size and orientation of the BLT thin film were severely non-uniform. And the grain size and orientation were severely affected by the process conditions of post heat treatment, especially nucleation step. The optimized annealing temperature at the nucleation step was $560^{\circ}C$. The microstructure of the BLT thin film was also varied by the annealing time at the step. The longer process time showed the finer grain size. Therefore, the uniformity of the grain size and orientation could be improved by changing the process conditions of the nucleation step. The FeRAM device without random bit-fail cell was successfully fabricated with the optimized BLT capacitor and the sensing margin in bit-line signal distribution of it was about 340 mV.

• 한국전기전자재료학회논문지
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• 제16권4호
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• pp.298-303
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• 2003

Bi$_4$-$_{x}$EU$_{x}$Ti$_3$O$_{12}$ (BET) thin films were etched by inductively coupled CF$_4$/Ar plasma. We obtained the maximum etch rate of 78 nm/min at the gas mixing ratio of CF$_4$(10%)/Ar(90%). The variation of volume density for F and Ar atoms are measured by the optical emission spectroscopy. As CF$_4$increased in CF$_4$/Ar plasma, the emission intensities of F increase, but Ar atoms decrease, which confirms our suggestion that emission intensity is proportional to the volume density of atoms. From X-ray photoelectron spectroscopy, the intensities of the Bi-O, the Eu-O and the Ti-O peaks are changed. By pure Ar plasma, intensity peak of the oxygen-metal (O-M : TiO$_2$, Bi$_2$O$_3$, Eu$_2$O$_3$) bond was seemed to disappear while the intensity of pure oxygen peak showed an opposite tendency. After the BET thin films was etched by CF$_4$/Ar plasma, the peak intensity of O-M bond increase slowly, but more quickly than that of peak belonged to pure oxygen atoms due to the decrease of Ar ion bombardment. Scanning electron microscopy was used to investigate etching Profile. The Profile of etched BET thin film was over 85$^{\circ}$./TEX>.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.565-568
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• 2001

We have fabricated $Bi_{3.25}La_{0.75}Ti_{3}O_{12}(BLT)$ thin(200nm) films on the $Pt/Ti/SiO_{2}/Si$ substrates using a MOD(Metalorganic decomposition) method with annealing temperature from $550^{\circ}C$ to $750^{\circ}C$. The structural properties of the films examined by x-ray diffraction. The layered-perovskite phase obtained above $600^{\circ}C$. Scanning electron micrographs showed uniform surface composed of rodlike grains. The grain size increased with increasing annealing temperature. The BLT thin films showed little polarization fatigue test up to $3.5{\times}10^{9}$ bipolar cycling at a 5V and 100kHz.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.565-568
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• 2001

We have fabricated $Bi_{3.25}$$La_{0.75}$ti$_3$O$_{12}$ (BLT) thin(200nm) films on the Pt/Ti/SiO$_2$/Si substrates using a MOD(Metalorganic decomposition) method with annealing temperature from 55$0^{\circ}C$ to 75$0^{\circ}C$. The structural properties of the films examined by x-ray diffraction. The layered-perovskite phase obtained above $600^{\circ}C$. Scanning electron micrographs showed uniform surface composed of rodlike grains. The grain size increased with increasing annealing temperature. The BLT thin films showed little polarization fatigue test up to 3.5x10$^{9}$ bipolar cycling at a 5V and 100kHz.kHz.

• 한국재료학회지
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• 제13권7호
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• pp.478-483
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• 2003

The crystallographic characteristics of the $(Bi, La)_4$$Ti_3$$O_{12}$ thin film, which is considered as an applicable dielectrics in the ferroelectric RAM device due to a low crystallization temperature and a good fatigue property, were investigated at the atomic scale by high resolution transmission electron microscopy and the high resolution Z-contrast technique. The analysis showed that a (00c) preferred orientation and a crystallization of the film were enhanced with the diffraction intensity increase of the (006) and (008) plane as the annealing temperature increased. It indicated a change of the atomic arrangement in the (00c) plane. Stacking faults on the (00c) plane were also observed. Through the comparison of the high-resolution Z-contrast image and the $Bi_4$$Ti_3$$O_{12}$ atomic model, it was evaluated that the intensity of the Bi atom was different according to the atomic plane, and it was attributed to a substitution of La atom for Bi at the specific atom position.

• 대한전자공학회논문지SD
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• 제37권4호
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• pp.7-14
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• 2000

Bi/sub 4/Ti/sub 3/O/sub 12/ (BIT) 박막을 acetate 계 precursor 를 이용한 sol-gel 법으로 제작한 후, 구조적 및 전기적 특성을 조사하여 NVFRAM (Won-Volatile Ferroelectric RAM)으로의 응용가능성을 조사하였다. DT-TG (Differential Thermal-Thermal Gravimetric) 분석으로 drying 온도와 annealing 온도가 각각 400℃ 와 650℃ 인 BIT 박막의 열처리조건을 확립하였다. Pt/Ta/Sio/sub 2//Si 기판 위에 제작된 BIT 박막은 완전한 orthorhombic perovskite상을 가지며, 입자크기가 약 100nm 이고 표면 거칠기는 약 70.2Å 으로 비교적 치밀한 형상을 나타내었다. 10㎑ 의 주파수에서 비유전률과 유전손실은 각각 176 과 0.038 이었으며, 100 ㎸/cm 의 전기장에서 누설전류밀도는 4.71㎂/㎠ 이었다. ±250㎸/㎝ 에서 이력곡선을 측정한 결과, 잔류분극 (Pr)과 항전계 (Ec)는 각각 5.92μC/㎠ 과 86.3㎸/㎝ 이었다. BIT 박막에 ±5V 의 사각펄스를 인가하여 피로특성을 측정한 결과, 잔류분극은 초기값 5.92μC/㎠ 에서 10/sup 9/회에서는 3.95μC/㎠ 로 약 33% 감소하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.851-856
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• 2003

We have investigated the material and electrical properties of $Bi_{4-x}La_xTi_3O_{12}$ (BLT) ferroelectric thin film for ferroelectric nonvolatile memory applications of capacitor type and single transistor type. The 120nm thick BLT films were deposited on $Pt/Ti/SiO_2/Si$ and $SiO_2/Nitride/SiO_2$ (ONO) substrates by the sol-gel spin coating method and were annealed at $700^{\circ}C$. It was observed that the crystallographic orientation of BLT thin films were strongly affected by the excess Bi content and the intermediate rapid thermal annealing (RTA) treatment conditions regardeless of two type substrates. However, the surface microstructure and roughness of BLT films showed dependence of two different type substrates with orientation of (111) plane and amorphous phase. As increase excess Bi content, the crystallographic orientation of the BLT films varied drastically in BLT films and exhibited well-crystallized phase. Also, the conversion of crystallographic orientation at intermediate RTA temperature of above $450^{\circ}C$ started to be observed in BLT thin films with above excess 6.5% Bi content and the rms roughness of films is decreased. We found that the electrical properties of BLT films such as the P-V hysteresis loop and leakage current were effectively modulated by the crystallographic orientations change of thin films.

• 한국결정성장학회지
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• 제13권2호
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• pp.56-62
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• 2003

졸-겔법을 이용하고 금속 나프테네이트를 출발원료로 사용하여 $SrTiO_3$(100), $LaA1O_3$(100) 및 MgO(100) 기판 위에 에피탁샬 $Bi_4Ti_3O_{12}$ 박막을 제조하였다. 코팅된 전구막은 $500^{\circ}C$에서 10분간 전열처리 하였고, $750^{\circ}C$에서 30분간 최종 열처리를 행하였다. 박막의 결정화도는 X-선회절 분석법 ($\theta$-2$\theta$ 스캔과 $\beta$ 스캔)으로 조사하였고, 표면 미세구조와 거칠기를 field emission-scanning electron microscope와 atomic force microscope를 이용하여 각각 분석하였다. MgO(100) 기판 위에 제조한 박막은 모든 기판 중에서 가장 낮은 결정화도와 면내 배향성을 보였다. 가장 낮은 결정화도와 배향성을 보인 MgO(100) 기판위의 박막은 침상 형태로 성장한 반면, 결정성과 배향성이 좋은 $LaA1O_3$(100)과 $SrTiO_3$(100) 기판위의 박막들은 원형의 입자 성장 형태를 보이고 있었다.