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[Search Query: (Kojic:MOKRBW) AND (Publication Year:[2011 TO 2015])]

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No Article Title /Author/Journal Title/Publication Year Cited
Study on the Electrode Design for an Advanced Structure of Vertical LED/
[Park, Jun-Beom;Park, Hyung-Jo;Jeong, Tak;Kang, Sung-Ju;Ha, Jun-Seok;Leem, See-Jong;] / Journal of the Microelectronics and Packaging Society / 2015     		2
Evaluation of Thermal Conductivity for Screen-Printed AlN Layer on Al Substrate in Thickness Direction/
[Kim, Jong-Gu;Park, Hong-Seok;Kim, Hyun;Hahn, Byung-Dong;Cho, Young-Rae;] / Journal of the Microelectronics and Packaging Society / 2015     		7
A Method for Application of Ammonium-based Pretreatment Solution in Preparation of Copper Flakes Coated by Electroless Ag Plating/
[Kim, Ji Hwan;Lee, Jong-Hyun;] / Journal of the Microelectronics and Packaging Society / 2015     		6
A Study on Thermal Behavior and Reliability Characteristics of PCBs with a Carbon CCL/
[Cho, Seunghyun;Kim, Jeong-Cheol;Kang, Suk Won;Seong, Il;Bae, Kyung Yun;] / Journal of the Microelectronics and Packaging Society / 2015     		3
A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL/
[Cho, Seunghyun;Jang, Junyoung;Kim, Jeong-Cheol;Kang, Suk Won;Seong, Il;Bae, Kyung Yun;] / Journal of the Microelectronics and Packaging Society / 2015     		2
Study of On-chip Liquid Cooling in Relation to Micro-channel Design/
[Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung;] / Journal of the Microelectronics and Packaging Society / 2015     		2
PLC Devices Fabricated on Flexible Plastic Substrate by Roll-to-Roll Imprint Lithography/
[Kang, Ho Ju;Kim, Taehoon;Jeong, Myung Yung;] / Journal of the Microelectronics and Packaging Society / 2015     		3
A Review of Ag Paste Bonding for Automotive Power Device Packaging/
[Roh, Myong-Hoon;Nishikawa, Hiroshi;Jung, Jae-Pil;] / Journal of the Microelectronics and Packaging Society / 2015     		2
Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications/
[Sharma, Ashutosh;Jung, Jae-Pil;] / Journal of the Microelectronics and Packaging Society / 2015     		0
Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging/
[Jung, Do hyun;Kumar, Santosh;Jung, Jae pil;] / Journal of the Microelectronics and Packaging Society / 2015     		5