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C.-H. Tsai, S.-Y. Chen, J.-M. Song, I.-G. Chen and H.-Y. Lee, "Thermal Stability of Cu@Ag Core-Shell Nanoparticles", Corros. Sci., 74(Sep), 123 (2013).
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S.-S. Chee and J.-H. Lee, "Preparation and Oxidation Behavior of Ag-coated Cu Nanoparticles Less Than 20 nm in Size", J. Mater. Chem. C, 2(27), 5372 (2014).
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J.-S. Park, J.-H. Hwang, J.-G. Kim, Y.-H. Kim, H.-D. Park and S.-G. Kang, "Properties of Ag Thick Films Fabricated by Using Low Temperature Curable Ag Pastes", Kor. J. Mater. Res., 13(1), 18 (2003).
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H. S. Kim, J. C. Choi, B. O. Rhee and S. C. Choi, "Preparation and Characterization of Bi Based Frit for Ag Electrode in PDP Application", J. Microelectron. Packag. Soc., 10(4), 47 (2003).
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J.-K. Lee, S.-H. Park and G.-S. Yang, "Effect of Sintering Aid and Glass-Frit on the Densification and Resistivity of Silver Paste", Kor. J. Mater. Res., 18(5), 283 (2008).
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6 |
L. Tongxiang, G. Wenli, Y. Yinghui and T. Chunhe, "Electroless Plating of Silver on Graphite Powders and the Study of Its Conductive Adhesive", Int. J. Adh. Adh. 28(1-2), 55 (2008).
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S. Wu, "Preparation of Fine Copper Powder Uusing Ascorbic Acid as Reducing Agent and Its Aapplication in MLCC", Mater. Lett., 61(4-5), 1125 (2007).
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8 |
X. Xu, X. Luo, H. Zhuang, W. Li and B. Zhang, "Electroless Silver Coating on Fine Copper Powder and Its Effects on Oxidation Resistance", Mater. Lett., 57(24-25), 3987 (2003).
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9 |
D. S. Jung, H. M. Lee, Y. C. Kang and S. B. Park, "Air-stable Silver-coated Copper Particles of Sub-micrometer Size', J. Colloid Interface Sci., 364(2), 574 (2011).
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10 |
J. Zhao, D. M. Zhang and J. Zhao, "Fabrication of Cu-Ag Core-Shell Bimetallic Superfine Ppowders by Eco-friendly Reagents and Structures Characterization", J. Solid State Chem., 184(9), 2339 (2011).
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11 |
H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung and C. O. Kim, "Developing Process for Coating Copper Particles with Silver by Electroless Plating Method", Surf. Coat. Technol., 201(6), 3788 (2006).
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12 |
J. H. Kim and J.-H. Lee, "Effects of Pretreatment and Ag Coating Processes Conditions on the Properties of Ag-Coated Cu Flakes", J. Mater. Res., 24(11), 617 (2014).
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R. Zhang, W. Lin, K. Lawrence and C. P. Wong, "Highly Reliable, Low Cost, Isotropically Conductive Adhesives Filled with Ag-coated Cu Flakes for Electronic Packaging Applications", Int. J. Adh. Adh. 30(6), 403 (2010).
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14 |
Y. Peng, C. Yang, K. Chen, S. R. Popuri, C.-H. Lee and B.- S. Tang, "Study on Synthesis of Ultrafine Cu-Ag Core-Shell Powders with High Electrical Conductivity", Appl. Surf. Sci., 263(15), 38 (2012).
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15 |
G. Kim, K.-M. Jung, J.-T. Moon and J.-H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014).
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16 |
Y. Wei, S. Chen, Y. Lin, Z. Yang and L. Liu, "Cu-Ag Core- Shell Nanowires for Electronic Skin with a Petal Molded Microstructure", J. Mater. Chem. C, 3(37), 9594 (2015).
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17 |
J. H. Kim, Y. H. Cho and J.-H. Lee, "Fabrication of a Ultrathin Ag Film on a Thin Cu Film by Low-Temperature Immersion Plating in an Grycol-Based Solution", J. Microelectron. Packag. Soc., 21(2), 79 (2014).
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18 |
D. W. Shoesmith, S. Sunder, M. G. Bailey, G. J. Wallace and F. W. Stanchell, "Anodic Oxidation of Copper in Alkaline Solutions: Part IV. Nature of the Passivating Film", J. Electroanal. Chem., 143(1-2), 153 (1983).
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19 |
G.-L. Song, R. Mishra and Z. Xu, "Crystallographic Orientation and Electrochemical Activity of AZ31 Mg Alloy", Electrochem Comm., 12(8), 1009 (2010).
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20 |
A. Muzikansky, P. Nanikashvili, J. Grinblat and D. Zitoun, "Ag Dewetting in Cu@Ag Monodisperse Core-Shell Nanoparticles", J. Phys. Chem. C, 117(6), 3093 (2013).
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