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http://dx.doi.org/10.6117/kmeps.2015.22.4.015

A Review of Ag Paste Bonding for Automotive Power Device Packaging  

Roh, Myong-Hoon (Joining and Welding Research Institute, Osaka University)
Nishikawa, Hiroshi (Joining and Welding Research Institute, Osaka University)
Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.22, no.4, 2015 , pp. 15-23 More about this Journal
Abstract
Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.
Keywords
Automotive power device packaging; Power module; Lead-free bonding; Ag paste;
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Times Cited By KSCI : 2  (Citation Analysis)
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