Reliability is a multi-disciplinary subject in essence because it is necessary to have knowledge about engineering such as mechanical, electronic and communication engineering as well as statistics and management in order to enhance the reliability of a system or a product. Therefore, it is important to standardize terminology in reliability. In this paper, we show how the task of terminology standardization in reliability is undertaken.

In this paper, we verified the failure mechanism of the discolored masking tape wrapped around the wire and studied an improved case study as well. Masking tapes are poly(Vinylchloride-co-Methyl methacrylate) (PVC) and the wire connecting with indoor/outdoor components of the air conditioner is chloroprene(CR). The masking tape under. the ultraviolet ray was accelerated to discolor fivefold. The results determined reveal the discoloration of masking tapes as an elution of the additives, dephenyl Amine series antioxidants, in the connecting wire. When changed dephenyl Amine series to phenol series, we found that the degree of discoloration was dramatically decreased. Due to stink of Thiourea and Thiuram monosulfide, as accelerators in CR wire, we controlled the vulcanization temperature and time without using these accelerators and could get the wire not to smell bad with the equal mechanical properties.

As an alternative to traditional life testing, degradation tests can be effective in assessing product reliability when measurements of degradation leading to failure can be observed. This article presents an accelerated degradation testing for vacuum fluorescent displays (VFDs). The accelerated degradation model is based on Arrhenius-lifetime relationship for cathode temperatures. We compare the results between accelerated degradation test and test at normal use condition. Accelerated degradation test for display devices is observed as an efficient method to warrantee product reliability to customers, as well as a tool to save time and costs.

This paper is concerned with the problem in predicting the reliability of an LCD product, Product reliability calculation methods classify accelerated life test (ALT) and using the reliability standard as MIL-HDBK-217F and Telcordia SR-332. The reliability standard can calculate estimating value more quickly than accelerated life test. The system MTBF was calculated in accordance of Telcordia SR-332 standard which includes directions of part electronic measurement, temperature rise and environmental test data. This research is intended to obtain the useful information for each electric design step to save time and cost.

Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.

This paper describes procedure to build a generic reliability analysis database structure and failure data during the conceptual design phase. Reliability prediction utilizing such supporting database system enable the designer to quantify the effects of varying design and operational constrains on mechanical component's failure rate. This leads to compare competing alternatives to the reliability improvement efforts.

A unreliable network system results in unsatisfied performance. A performance criterion of a network is throughput and availability. One of the most compelling technological advances of this decade has been the advent of deploying wireless networks of heterogeneous smart sensor nodes for complex information gathering tasks, The advancement and popularization of wireless communication technologies make more efficiency to network devices with wireless technology than with wired technology. Recently, the research of wireless sensor network has been drawing much attentions. In this paper, We evaluate throughput and availability of wireless sensor network, which have hierarchical structure based on clustering and estimate the maximum hroughput, average throughput and availability of the network considering several link failure patterns likely to happen at a cluster consisted of sensor nodes. Also increasing a number of sensor nodes in a cluster, We analysis the average throughput and availability of the network.

MEMS devices usually have micro actuators contained in a cavity, If the pressure level of testing chamber is higher than that of cavity, moisture will ingress into the cavity, which may cause critical failure such as stiction of the moving parts. To design an accelerated life test based on high temperature and high humidity, such a phenomena should be considered. In this study, a throughput model that can estimate the amount of moisture ingress is used to decide the testing time and conditions of a high temperature and high humidify test.