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피인용 문헌
- Improvement of Thermal Stability of Nickel Silicide Using Co-sputtering of Ni and Ti for Nano-Scale CMOS Technology vol.13, pp.3, 2013, https://doi.org/10.5573/JSTS.2013.13.3.252
- Novel Ni silicide formed with a Ni/Er/Ni/TiN structure for thermal stable and low contact resistance source/drain in MOSFETs vol.53, pp.8S3, 2014, https://doi.org/10.7567/JJAP.53.08NE05
- Investigation on Suppression of Nickel-Silicide Formation By Fluorocarbon Reactive Ion Etch (RIE) and Plasma-Enhanced Deposition vol.13, pp.1, 2013, https://doi.org/10.5573/JSTS.2013.13.1.022