• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.4
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• pp.30-36
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• 2004

The development of LD(Laser Diode) tester and its control system based on the graphical programming language(LabVIEW) is addressed. The ill tester is used to check the optic power and the optic spectrum of the LD Chip. The emitter size of LD chip and the diameter of the Detector(optic fiber and photo diode) are very small, therefore the test device needs high accuracy. But each motion part of the test device could not accomplish high accuracy due to the limit of the mechanical performance. So, an image processing with machine vision is proposed to compensate for the error. By adopting our method we can reduce the error of position within $\pm$5$\mu\textrm{m}$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.390-393
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• 2005

he FPCs(Flexible Printed Circuit) are currently used in several electronic products like digital cameras, cellular phones because of flexible material characteristics. Because the FPC is usually small size and flexible, only one FPC should not enter chip mounting process, instead, several FPCs is placed on the large rigid pallette and go to the chip mounting process. Currently the job of mounting FPC on the pallette is carried by totally manual way. Thus, the goals of the research is develop the automatic machine of FPC mounting on pallette using vision alignment. The procedure of operating machine is firstly to measure alignment error of FPC, correct alignment errors, and finally mount well-aligned FPC on the pallette. The vision technology is used to measure alignment error accurately, and precision motion control is used in correcting errors nd mounting FPC. The two picker heads handling two FPC together is used to increase the productivity.

• Journal of the Semiconductor & Display Technology
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• v.4 no.2 s.11
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• pp.33-37
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.

• Journal of the Institute of Convergence Signal Processing
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• v.1 no.1
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• pp.89-96
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• 2000

In this paper, we propose a vision algorithm for the inspection of very small RF-chip inductor which is used in mobile-communication terminal. The proposed method divides coil part from the inductor body by local adaptive thresholding and integral projection method. After dividing work, the coil components are extracted by thinning and labelling techniques. The test items are the number of turns, the intervals in coil, and the measure of uniformity between the extracted lines. If the values of these are more than the specific value a tested product is decided bad one. In the simulation, the proposed method has a good performance.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.1
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• pp.159-164
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• 2013

Recently the solution integrated of vision and motion controller which are important element in automatiomn system has been many developed. However typically such a solutions has a many case that integrated vision processing and motion control into network or organized two chip solution on one module. We implement one chip solution integrated into vision and motion controller using Zynq-7000 that is developed recently as extended processing platform. We also apply EtherCAT to motion control that is industrial Ethernet protocol which have compatibility for open standardization Ethernet in order to control of motion because EtherCAT has a secure to realtime control and can treat massive data.

• Proceedings of the Korea Institute of Convergence Signal Processing
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• 2000.08a
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• pp.261-264
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• 2000

본 논문에서는 이동 통신용 단말기에 주로 사용되는 RF-chip inductor의 자동 외관검사를 위한 시스템 개발에 필요한 알고리즘을 제안하였다. 본 논문에서 제안한 방법은 영상취득 후 처리과정에서 동적 이진화 방법, 가산투영 등 영상처리에 관련된 방법을 이용해 코일 부분과 코어부분을 분리한 후 세선화 방법, 라벨링 방법 등을 적용하여 분리된 코일부분에 대해 코일의 감긴 회수와 피치간격의 불균일 검사를 수행하고 기준값 이상의 오차를 갖는 소자를 불량으로 처리하는 보다 개선된 처리방법을 제안하였으며 모의실험을 통해 성능을 검증하였다.

• 제어로봇시스템학회:학술대회논문집
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• 1995.10a
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• pp.400-403
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• 1995

A robot system is proposed to realize coordinated motion of two arm robot. Due to a 3-D vision sensor, precise coordinated motions could be realized. Using a sophisticated IC chip, real time image processing could be executed using a simple circuit.

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.777-780
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• 2003

We have tried to create a vision system like human eye for a long time. We have obtained some distinguished results through many studies. Stereo vision is the most similar to human eye among those. This is the process of recreating 3-D spatial information from a pair of 2-D images. In this paper, we have designed a stereo matching algorithm based on systolic array architecture using edges and pixel data. This is more advanced vision system that improves some problems of previous stereo vision systems. This decreases noise and improves matching rate using edges and pixel data and also improves processing speed using high integration one chip FPGA and compact modules. We can apply this to robot vision and automatic control vehicles and artificial satellites.

• Proceedings of the Korea Society of Information Technology Applications Conference
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• 2005.11a
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• pp.285-288
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• 2005

We propose a novel programmable miniature vision module based on a custom designed analog VLSI (aVLSI) chip. The vision module consists of the optical flow vision sensor embedded with commercial off-the-shelves digital hardware; in our case is the Intel XScale PXA270 processor enforced with a programmable gate array device. The aVLSI sensor provides gray-scale imager data as well as smooth optical flow estimates, thus each pixel gives a triplet of information that can be continuously read out as three independent images. The particular computational architecture of the custom designed sensor, which is fully parallel and also analog, allows for efficient real-time estimations of the smooth optical flow. The Intel XScale PXA270 controls the sensor read-out and furthermore allows, together with the programmable gate array, for additional higher level processing of the intensity image and optical flow data. It also provides the necessary standard interface such that the module can be easily programmed and integrated into different vision systems, or even form a complete stand-alone vision system itself. The low power consumption, small size and flexible interface of the proposed vision module suggests that it could be particularly well suited as a vision system in an autonomous robotics platform and especially well suited for educational projects in the robotic sciences.