• 한국전기전자재료학회논문지
• /
• 제21권10호
• /
• pp.916-922
• /
• 2008

AC PDP with MgO protective layer coated with the optimum evaporation rate of $5{\AA}/s$ can generate more enhanced efficiency through the vacuum in-line sealing process. However, the optimized process conditions still require the optimum driving scheme on the ramp-up and ramp-down slope of the reset waveform for enhancing the efficiency. In this paper, for the in-situ vacuum sealed PDP with the optimum evaporation rate of MgO protective layer, the address delay time was investigated with various slopes of ramp waveform during a reset ramp-up and ramp-down period. In this study, the minimum statistical delay time was obtained at the ramp-up rate of $6.0 V/{\mu}s$ and the ramp-down rate of $0.7 V/{\mu}s$ of the reset waveform.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
• /
• pp.147-148
• /
• 2000

Sealing of two glass plates composing of FED panel was done in a vacuum chamber. Several factors related with a heating process of a frit glass were investigated, including comparisons with a conventional method.

• 센서학회지
• /
• 제29권5호
• /
• pp.354-359
• /
• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
• /
• pp.337-337
• /
• 2000

This paper describes a Chuck System developed for scaling PDP gas hole on PDP panel glass. There are lots of constraints for designing Chuck System: high temperature, high vacuum, precious motor control etc. A such constraints was considered by design of structure and by selecting of parts and material for Chuck System. The Chuck System was manufactured and assembled after the design process. It was applied on the PDP process unit. For sealing POP hole, precious control of a step motor was important in this system. For this experiment, a step motor, motor driver and micro controller(80196KC) were used.

• 한국전기전자재료학회논문지
• /
• 제15권11호
• /
• pp.976-980
• /
• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2010년도 춘계학술대회 논문집
• /
• pp.95-96
• /
• 2010

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2009년도 춘계학술대회 논문집
• /
• pp.169-170
• /
• 2009

• 조명전기설비학회논문지
• /
• 제23권5호
• /
• pp.29-35
• /
• 2009

FED는 잠재적인 평판기술에 따라 현재 연구되고 있다. 이 논문의 제안은 FED 핵심적인 개발을 위한 진공 패키징 기술에 대한 연구결과를 보여준다. FED 진공 패키징을 위해서는 유리/유리 접합, 진공배기, 게터기술, 그리고 시뮬레이션, 진공패키징 기술을 연구하였다. 유리/유리 접합은 프릿 글래스를 사용하므로 형태에 따르고, 내부 압력은 $2{\times}10^{-5}$[Torr]이며 패널로서 완성을 보여준다. 게터의 결과에 따라 그것은 압력의 증가는 박막 게터에 의해 불순기체가 줄어드는 것을 보여주었다.

• 마이크로전자및패키징학회지
• /
• 제10권1호
• /
• pp.31-38
• /
• 2003

MEMS 소자는 현재의 전자산업환경에서 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 이러한 MEMS 소자를 이용한 MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 충분히 만족시켜야 한다. 본 논문에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판내부에 수동소자를 실장할 수 있는 LTCC 기술$^{1)}$ 을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화로부터 leakage rate를 측정 (stacked via : $4.1{\pm}1.11{\times}10^{-12}$/Torr1/sec, LTCC 기판/AgPd/solder/Cu의 여러 가지 계면구조: $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec)하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다. 실제 적용의 한 예로 LTCC 기술을 이용하여 Bolometer를 성공적으로 진공패키징할 수 있었으며 실제 관찰된 이미지를 함께 소개한다.

• 한국재료학회지
• /
• 제28권12호
• /
• pp.732-737
• /
• 2018

We develop a purification process of $Hg_2Br_2$ raw powders using a physical vapor transport(PVT) process, which is essential for the fabrication of a high performance acousto-optic tunable filter(AOTF) module. Specifically, we characterize and compare three $Hg_2Br_2$ powders: $Hg_2Br_2$ raw powder, $Hg_2Br_2$ powder purified under pumping conditions, and $Hg_2Br_2$ powder purified under vacuum sealing. Before and after purification, we characterize the powder samples through X-ray diffraction and X-ray photoelectron spectroscopy. The corresponding results indicate that physical properties of the $Hg_2Br_2$ compound are not damaged even after the purification process. The impurities and concentration in the purified $Hg_2Br_2$ powder are evaluated by inductively coupled plasma-mass spectroscopy. Notably, compared to the sample purified under pumping conditions, the purification process under vacuum sealing results in a higher purity $Hg_2Br_2$ (99.999 %). In addition, when the second vacuum sealing purification process is performed, the remaining impurities are almost removed, giving rise to $Hg_2Br_2$ with ultra-high purity. This high purification process might be possible due to independent control of impurities and $Hg_2Br_2$ materials under the optimized vacuum sealing. Preparation of such a highly purified $Hg_2Br_2$ materials will pave a promising way toward a high-quality $Hg_2Br_2$ single crystal and then high performance AOTF modules.