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http://dx.doi.org/10.5207/JIEIE.2009.23.5.029

A Study on Panel Manufacture and Packaging Method for Digital FED  

Kim, Soo-Yong (군산대학교 전자정보공학부)
Publication Information
Journal of the Korean Institute of Illuminating and Electrical Installation Engineers / v.23, no.5, 2009 , pp. 29-35 More about this Journal
Abstract
Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{\times}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.
Keywords
FED; Vacuum Sealing; Outgassing;
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