• Title/Summary/Keyword: ultra fine grinding

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The development of Centerless Grinder for Ferrule Grinding (페룰 가공용 초정밀 센터리스 연삭기 개발)

  • CHO S.J.;EBIHARA EBIHARA;TSUKISHIMA TSUKISHIMA;YOON J.S.;CHO C.R.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.6-9
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    • 2005
  • In this study, the ultra precision centerless grinder for ferrule grinding was designed. As the good-qualified ferrule is required a precise and fine grinding, grinding machine for ferrule must have a high accuracy and a sufficient stiffness. The centerless grinder is composed of the high damping concrete bed, grinding wheel spindle unit, regulating wheel spindle unit, feeding table and dressing unit. For a newly developed centerless grinder, hydrostatic system with high precision feeding and high stiffness was proposed. The grinding and regulating wheel spindle units were composed of hydrostatic spindle and feeding table was hydrostatic table. The prototype of hydrostatic table was manufactured and tested.

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Long Range and High Axial Load Capacity Nanopositioner Using Single Piezoelectric Actuator and Translating Supports

  • Juluri, Bala Krishna;Lin, Wu;Lim, Lennie E N
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.4
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    • pp.3-9
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    • 2007
  • Existing long range piezoelectric motors with friction based transmission mechanisms are limited by the axial load capacity. To overcome this problem, a new linear piezoelectric motor using one piezoelectric actuator combined with a novel stepping mechanism is reported in this paper. To obtain both long range and fine accuracy, dual positioning control strategy consisting of coarse positioning and fine positioning is used. Coarse positioning is used for long travel range by accumulating motion steps obtained by piezoelectric actuator. This is followed by fine positioning where required accuracy is obtained by fine motion displacement of piezoelectric actuator. This prototype is able to provide resolution of 20 nanometers and withstand a maximum axial load of 300N. At maximum load condition, the positioner can move forward to a travel distance of 5mm at a maximum speed of 0.4 mm/sec. This design of nanopositioner can be used in applications for ultra precision positioning and grinding operations where high axial force capacity is required.

Grinding Kinetics of Calcite, Pyrophyllite and Talc During Stirred Ball Milling - Consideration of Selection Function (교반 볼밀에 의한 방해석, 납석, 활석의 분쇄 시 분쇄속도론에 관한 연구 - 선택함수의 고찰)

  • Choi, Hee-Kyu;Kim, Seong-Soo;Hwang, Jin-Yeon
    • Journal of the Mineralogical Society of Korea
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    • v.20 no.2 s.52
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    • pp.135-145
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    • 2007
  • The needs for the ultra fine particles have been increased in preparation field of raw powders such as fine ceramics and high functional products. In this study, a series of wet grinding experiments were carried out on inorganic powders such as calcite, pyrophyllite and talc by a stirred ball mill. The particle size distribution of ground products of each test material fur a given grinding time was found to be expressed by the grinding rate (selection function) which was obtained from the grinding kinetics analysis. The median diameter decreased from 6.49 to $0.47{\mu}m$ in calcite, and decreased from 3.91 to $1.14{\mu}m$ in pyrophyllite. However, in talc, median diameter was decreased a little bit from 10.30 to $6.67{\mu}m$. The grinding rate changing on calcite and pyriphyllite were similar at the same conditions. However, in the case of talc, it was observed that the grinding rate was not increased compared to other samples.

Effect of Si Wafer Ultra-thinning on the Silicon Surface for 3D Integration (삼차원 집적화를 위한 초박막 실리콘 웨이퍼 연삭 공정이 웨이퍼 표면에 미치는 영향)

  • Choi, Mi-Kyeung;Kim, Eun-Kyung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.63-67
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    • 2008
  • 3D integration technology has been a major focus of the next generation of IC industries. In this study Si wafer ultra-thinning has been investigated especially for the effect of ultra-thinning on the silicon surface. Wafers were grinded down to $30{\mu}m\;or\;50{\mu}m$ thickness and then grinded only samples were compared with surface treated samples in terms of surface roughness, surface damages, and hardness. Dry polishing or wet etching treatment has been applied as a surface treatment. Surface treated samples definitely showed much less surface damages and better roughness. However, ultra-thinned Si samples have the almost same hardness as a bulk Si wafer.

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Preparation of Seaweed Calcium Microparticles by Wet-grinding Process and their Particle Size Distribution Analysis (초미세습식분쇄공정의 공정변수에 따른 해조칼슘의 입자크기 분석)

  • Han, Min-Woo;Youn, Kwang-Sup
    • Food Engineering Progress
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    • v.13 no.4
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    • pp.269-274
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    • 2009
  • The main objective of this study was to establish optimum condition of wet grinding process for manufacturing microparticulated seaweed calcium. Process parameters such as concentration of forming agent, rotor speed, bead size, feed rate, and grinding time were adapted during wet-grinding of seaweed calcium. The particle size range of the raw seaweed calcium was 10-20 $\mu$m. The calcium particles were reduced to under 1 $\mu$m as nano scale after grinding. Gum arabic was suitable for forming agent and 5%(w/v) concentration was the most effective in grinding efficiency. A wet-grinding process operated at 4,000 rpm rotor speed, 0,4 mm bead size, and 0.4 L/hr feeding rate, respectively, produced less than 600 mm(>>90%)-sized particles. In batch systems, 8 cycles of grinding showed higher efficiency, but 20 min of grinding time in continuous processing was more efficient to reduce particle size than the batch processing. Based on the result, the optimum conditions of the wet grinding process were established: operation time of 20 minutes, rotor speed of 4,000 rpm, bead size of 0.4 mm, feed rate of 40 mL/min and 30% mixing ration with water. The size of the resulting ultra fine calcium particles ranged between 40 and 660 mm.

Physical Properties of Ultrafine Ash Blended Cement (초미분말 애시를 혼합한 시멘트의 물성)

  • Yoo, Dong-Woo;Byun, Seung-Ho;Song, Jong-Taek
    • Journal of the Korean Ceramic Society
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    • v.44 no.9
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    • pp.489-495
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    • 2007
  • Effects of ultrafinely ground ash on the rheological properties of cement paste were investigated. Also compressive strength development and setting time of ultrafine ash blended cement mortar were investigated in the study. A sample with silica fume was included for comparison. According to the results of ultra fine ash blended cement paste in the lower W/B ratio, the fluidity were high, and the setting time was a little retarded. And the compressive strength of ultrafine ash blended mortar was increased in the long term. In the case of hardened cement paste at 28 days, $Ca(OH)_2$ contents was decreased in order of control, ultrafine ash, silica fume blended cement due to difference of the pozzolanic reaction.

Physical and Chemical Properties of Nano-slag Mixed Mortar

  • Her, Jae-Won;Lim, Nam-Gi
    • Journal of the Korea Institute of Building Construction
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    • v.10 no.6
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    • pp.145-154
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    • 2010
  • As buildings have become higher and larger, the use of high performance concrete has increased. With this increase, interest in and use of ultra fine powder admixture is also on the rise. The silica fume and BSF are the admixtures currently being used in Korea. However, silica fume is exclusively import dependent because it is not produced in Korea. In the case of BFS, it greatly improves concrete fluidity and long-term strength. But a problem exists in securing early strength. Furthermore, air-cooled slag is being discarded, buried in landfills, or used as road bed materials because of its low activation energy. Therefore, we investigated in this study the usability of nano-slag (both rapidly-chilled and air-cooled) as an alternative material to the silica fume. We conducted a physic-chemical analysis for the nano-slag powder and performed a mortar test to propose quality standards. The analysis and testing were done to find out the industrial usefulness of the BFS that has been grinded to the nano-level.

Development of Semiconductor Packaging Technology using Dicing Die Attach Film

  • Keunhoi, Kim;Kyoung Min, Kim;Tae Hyun, Kim;Yeeun, Na
    • Journal of Sensor Science and Technology
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    • v.31 no.6
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    • pp.361-365
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    • 2022
  • Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

Inhibition Effect of Phenolic Compounds from Ultra-fine Ground Chrysanthemum indicum L. on Xanthine Oxidase (초미세 분쇄한 감국으로부터 추출된 phenolic 화합물의 xanthine oxidase 저해 효과)

  • Cho, Young-Je;Kim, Byung-Oh;Park, Hye-Jin;Lee, Eun-Ho;Jo, Jae-Bum;Lee, Jae-Eun;Lim, Su-Bin;Kim, Ye-Jin;Park, Ki-Tae;Choi, Moo-Young
    • Journal of Life Science
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    • v.27 no.8
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    • pp.902-908
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    • 2017
  • In this study, the extracted phenolic compounds from 98 species of oriental herbal medicine were examined for biological activities to be used as functional resources. In particular, the anti-gout effect by xanthine oxidase (XOase) inhibition was determined using water and ethanol as extraction solvents because of their non-toxicity in the human body. The extracts of Chrysanthemum indicum L. (83.45%), Cuscuta chinensis (60.22%), Asiasarum sieboldi F. Maekawa (51.66%), Acorus gramineus (67.8%), Aconitum pseudo-laeve var. erectum (75.23%), Thuja orientalis (47.27%), Polygonum aviculare (53.98%), Carthami semen (63.99%), and Syzygium aromaticum (40.22%) showed relatively high XOase inhibitory activity. Chrysanthemum indicum L. was selected for its high XOase inhibitory activity. The biological compounds in Chrysanthemum indicum L. were identified to contain phenolics included in extracts of solids. Ultra-fine grind technology showed a higher extraction yield than normal grind and fine grind technology. Ethanol extracts showed relatively higher XOase inhibitory activity than water extracts. XOase inhibitory activity increased in a dependent manner as phenolic concentration increased. Therefore, ultra-fine grind technology was confirmed for use in increasing the extraction yield of XOase inhibitory compounds from Chrysanthemum indicum L.. Extracts from Chrysanthemum indicum L. are expected to be a useful functional resource for the prevention or treatment of gout.