• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.481-485
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• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• Journal of the Korean Wood Science and Technology
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• v.29 no.3
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• pp.68-72
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• 2001

In order to effectively use the waste wood, two types of woodceramics chip tile were made from woodceramics chip, gravel, zeolite and additions. The woodceramics chip was made from branch of apple tree (Malus pumila Mill.) Snow melting property, bending strength and compressive strength of woodceramics chip tile were tested according to the mixing rate of woodceramics chip. Snow melting properties of woodceramics chip tile increased after additions treatment but mechanical properties were reduced significantly after additions treatment. The results indicate that the additions are effective for snow melting property but negative effect on mechanical properties.

• Journal of the Korean Physical Society
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• v.73 no.9
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• pp.1346-1350
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• 2018

An electrode-evaporation technology on both the top and bottom sides of the bare vertical-type single chip separated from the traditional substrate by cooling, was developed for III-nitride vertical-type single chip LEDs with thick GaN epilayer. The post-process of the cooling step was followed by sorting the bare vertical-type single chip LEDs into the holes in a pocket-type shadow mask for deposition of the electrodes at the top and bottom sides of bare vertical-type single chip LEDs without the traditional substrate for electrode evaporation technology for vertical-type single chip LEDs. The variation in size of the hole between the designed shadow mask and the deposited electrodes owing to the use of the designed pocket-type shadow mask is investigated. Furthermore, the electrical and the optical properties of bare vertical-type single chip LEDs deposited with two different shapes of n-type electrodes using the pocket-type shadow mask are investigated to explore the possibility of the e-beam evaporation method.

• Molecules and Cells
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• v.45 no.2
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• pp.76-83
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• 2022

Neurons-on-a-Chip technology has been developed to provide diverse in vitro neuro-tools to study neuritogenesis, synaptogensis, axon guidance, and network dynamics. The two core enabling technologies are soft-lithography and microelectrode array technology. Soft lithography technology made it possible to fabricate microstamps and microfluidic channel devices with a simple replica molding method in a biological laboratory and innovatively reduced the turn-around time from assay design to chip fabrication, facilitating various experimental designs. To control nerve cell behaviors at the single cell level via chemical cues, surface biofunctionalization methods and micropatterning techniques were developed. Microelectrode chip technology, which provides a functional readout by measuring the electrophysiological signals from individual neurons, has become a popular platform to investigate neural information processing in networks. Due to these key advances, it is possible to study the relationship between the network structure and functions, and they have opened a new era of neurobiology and will become standard tools in the near future.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• Journal of Microbiology and Biotechnology
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• v.16 no.8
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• pp.1229-1235
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• 2006

A lab-on-a-chip (LoC) was designed for simultaneous monitoring of microorganisms, antibiotic residues, somatic cells, and pH in raw milk. The LoC was fabricated from polydimethylsiloxane (PDMS) using microelectromechanical system (MEMS) technology, which consisted of two parts; a protein array and microchannel. The protein array was fabricated by immobilizing five types of antibodies corresponding to two microorganisms, two antibiotic residues, and somatic cells. A sol-gel film was deposited on a glass substrate to immobilize the antibodies. The target analytes in raw milk could be bound with the corresponding antibody by an immunoreaction, and the antigen-antibody complex was detected using fluorescence microscopy. SNARF-dextran was used as a pH indicator, and the SNARF-entrapped hydrogel was attached to the microchannel in the chip. After injecting the milk sample into the channel, the pH was measured by monitoring the change in fluorescence intensity by fluorescence microscopy. The on-chip simultaneous assay of two microorganisms (E. coli O157:H7 and Streptococcus agalactiae), two antibiotic residues (penicillin G and dihydrostreptomycin), and neutrophils was successfully accomplished using the proposed LoC system.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.10a
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• pp.1-15
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• 2004

o Various microfluidic components including mixromixers and micropumps have been developed for disposable biochip applications. o Single cell capturing, positioning and nanoliter drug injection chip has been demostrated. o Multi-channel, two-dimensional micro-well array has been fabricated and cell capturing and specific reagent injection have been performed.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.5 no.4
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• pp.98-107
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• 1996

In order to predict analytically torque, thrust force, tool life and chip formation in drilling, cutting models for chisel edge with various tool-chip contact length were developed in this type. Also, the experimental tests are run with various pilot holes. The following conclusions were obtained from the analysis. \circled1 It's also found experimentally that thrust force(Fz) decreases as pilot hole diameter increases. \circled2 Surface roughness for material(G) is larger that for material(J). The difference over two materials in roughness value about 0.5$mu extrm{m}$. \circled3 Flank wear of the drill in cutting material of G less than any other kinds of materials(F, G, H, I, J). \circled4 In drilling a deep hole on a workpiece over SM45C either twist drill. The chip was conical helix type at the fist suspensely change the two segment type and than two a long pitch helix style.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.676-678
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• 2004

In order to develop new yellow phosphor that emit efficiently under the 450 - 470 nm excitation range, we have synthesized a $Eu^{2+}$-activated $Sr_3SiO_5$ yellow phosphor and investigated an attempt to develop white LEDs by combining it with a InGaN blue LED chip (460 nm). Two distinct emission bands from the InGaN-based LED and the $Sr_3SiO_5$:Eu phosphor are clearly observed at 460 nm and at 570 nm, respectively. These two emission bands combine to give a spectrum that appears white to the naked eye. Our results showed that InGaN (460 nm chip)-based $Sr_3SiO_5$:Eu exhibits a better luminous efficiency than that of the industrially available product InGaN (460 nm chip)-based YAG:Ce.