• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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• pp.481-485
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• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• Journal of the Korean Wood Science and Technology
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• 제29권3호
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• pp.68-72
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• 2001

In order to effectively use the waste wood, two types of woodceramics chip tile were made from woodceramics chip, gravel, zeolite and additions. The woodceramics chip was made from branch of apple tree (Malus pumila Mill.) Snow melting property, bending strength and compressive strength of woodceramics chip tile were tested according to the mixing rate of woodceramics chip. Snow melting properties of woodceramics chip tile increased after additions treatment but mechanical properties were reduced significantly after additions treatment. The results indicate that the additions are effective for snow melting property but negative effect on mechanical properties.

• Journal of the Korean Physical Society
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• 제73권9호
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• pp.1346-1350
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• 2018

An electrode-evaporation technology on both the top and bottom sides of the bare vertical-type single chip separated from the traditional substrate by cooling, was developed for III-nitride vertical-type single chip LEDs with thick GaN epilayer. The post-process of the cooling step was followed by sorting the bare vertical-type single chip LEDs into the holes in a pocket-type shadow mask for deposition of the electrodes at the top and bottom sides of bare vertical-type single chip LEDs without the traditional substrate for electrode evaporation technology for vertical-type single chip LEDs. The variation in size of the hole between the designed shadow mask and the deposited electrodes owing to the use of the designed pocket-type shadow mask is investigated. Furthermore, the electrical and the optical properties of bare vertical-type single chip LEDs deposited with two different shapes of n-type electrodes using the pocket-type shadow mask are investigated to explore the possibility of the e-beam evaporation method.

• Molecules and Cells
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• 제45권2호
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• pp.76-83
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• 2022

Neurons-on-a-Chip technology has been developed to provide diverse in vitro neuro-tools to study neuritogenesis, synaptogensis, axon guidance, and network dynamics. The two core enabling technologies are soft-lithography and microelectrode array technology. Soft lithography technology made it possible to fabricate microstamps and microfluidic channel devices with a simple replica molding method in a biological laboratory and innovatively reduced the turn-around time from assay design to chip fabrication, facilitating various experimental designs. To control nerve cell behaviors at the single cell level via chemical cues, surface biofunctionalization methods and micropatterning techniques were developed. Microelectrode chip technology, which provides a functional readout by measuring the electrophysiological signals from individual neurons, has become a popular platform to investigate neural information processing in networks. Due to these key advances, it is possible to study the relationship between the network structure and functions, and they have opened a new era of neurobiology and will become standard tools in the near future.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• Journal of Microbiology and Biotechnology
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• 제16권8호
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• pp.1229-1235
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• 2006

A lab-on-a-chip (LoC) was designed for simultaneous monitoring of microorganisms, antibiotic residues, somatic cells, and pH in raw milk. The LoC was fabricated from polydimethylsiloxane (PDMS) using microelectromechanical system (MEMS) technology, which consisted of two parts; a protein array and microchannel. The protein array was fabricated by immobilizing five types of antibodies corresponding to two microorganisms, two antibiotic residues, and somatic cells. A sol-gel film was deposited on a glass substrate to immobilize the antibodies. The target analytes in raw milk could be bound with the corresponding antibody by an immunoreaction, and the antigen-antibody complex was detected using fluorescence microscopy. SNARF-dextran was used as a pH indicator, and the SNARF-entrapped hydrogel was attached to the microchannel in the chip. After injecting the milk sample into the channel, the pH was measured by monitoring the change in fluorescence intensity by fluorescence microscopy. The on-chip simultaneous assay of two microorganisms (E. coli O157:H7 and Streptococcus agalactiae), two antibiotic residues (penicillin G and dihydrostreptomycin), and neutrophils was successfully accomplished using the proposed LoC system.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2004년도 International Symposium
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• pp.1-15
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• 2004

o Various microfluidic components including mixromixers and micropumps have been developed for disposable biochip applications. o Single cell capturing, positioning and nanoliter drug injection chip has been demostrated. o Multi-channel, two-dimensional micro-well array has been fabricated and cell capturing and specific reagent injection have been performed.

• 마이크로전자및패키징학회지
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• 제15권3호
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• pp.53-58
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• 2008

본 연구에서는 상용화된 2.4 GHz 영역대에서 사용되어지는 WiFi용 DPDT(Double Pole Double throw) switch 칩을 laser 비아 가공과 도금 공정을 이용하여 폴리머 기판내에 내장시켜 그 특성을 분석하였으며 통상적으로 실장되는 wire 본딩방식으로 패키징된 기판과 특성차이를 분석 비교하였다. 폴리머는 FR4기판과 아지노 모토사의 ABF(Ajinomoto build up film)를 이용하여 패턴도금법으로 회로를 형성하였다. ABF공정의 최적화를 위해 폴리머의 경화정토를 DSC (Differenntial Scanning Calorimetry) 및 SEM (Scanning Electron microscope)으로 분석하여 경화도에 따라 도금된 구리패턴과의 접착력을 평가하였다. ABF의 가경화도가 $80\sim90%$일 경우 구리층과 최적의 접착강도를 보였으며 진공 열압착공정을 통해 기공(void)없이 칩을 내장할 수 있었다. 내장된 기관과 와이어 본딩된 기판의 측정은 S 파라미터를 이용하여 삽입손실과 반사손실을 비교 분석하였으며 그 결과 삽입손실은 두 경우 유사하게 나타났지만 반사손실의 경우 칩이 내장된 경우 6 GHz 까지 -25 dB 이하로 안정적으로 나오는 것을 확인할 수 있었다.

• 한국생산제조학회지
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• 제5권4호
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• pp.98-107
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• 1996

In order to predict analytically torque, thrust force, tool life and chip formation in drilling, cutting models for chisel edge with various tool-chip contact length were developed in this type. Also, the experimental tests are run with various pilot holes. The following conclusions were obtained from the analysis. \circled1 It's also found experimentally that thrust force(Fz) decreases as pilot hole diameter increases. \circled2 Surface roughness for material(G) is larger that for material(J). The difference over two materials in roughness value about 0.5$mu extrm{m}$. \circled3 Flank wear of the drill in cutting material of G less than any other kinds of materials(F, G, H, I, J). \circled4 In drilling a deep hole on a workpiece over SM45C either twist drill. The chip was conical helix type at the fist suspensely change the two segment type and than two a long pitch helix style.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.676-678
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• 2004

In order to develop new yellow phosphor that emit efficiently under the 450 - 470 nm excitation range, we have synthesized a $Eu^{2+}$-activated $Sr_3SiO_5$ yellow phosphor and investigated an attempt to develop white LEDs by combining it with a InGaN blue LED chip (460 nm). Two distinct emission bands from the InGaN-based LED and the $Sr_3SiO_5$:Eu phosphor are clearly observed at 460 nm and at 570 nm, respectively. These two emission bands combine to give a spectrum that appears white to the naked eye. Our results showed that InGaN (460 nm chip)-based $Sr_3SiO_5$:Eu exhibits a better luminous efficiency than that of the industrially available product InGaN (460 nm chip)-based YAG:Ce.