• 한국산학기술학회논문지
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• 제9권6호
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• pp.1754-1759
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• 2008

일반사출성형에서는 수지가 캐비티 내를 흐르면서 냉각으로 인한 점도의 상승으로 전사성이 급격히 나빠지기 때문에 미세패턴을 가진 성형품을 제작하는데 많은 어려움이 따른다. 이를 해결하는 방법으로 금형온도를 용융된 수지온도 수준까지 순간적으로 표면만을 가열하여 성형시킨 후 급속히 냉각하는 다양한 순간금형가열방식이 있고, 그 중 본 연구에서는 전열가열방식인 E-Mold을 채택하였다. 특히, 마이크/나노 부품 성형에 필수적인 E-Mold 금형설계에 있어 heating line의 배치는 금형의 온도 제어 및 균일한 온도 분포에 절대적인 영향을 미치므로 최적화된 heating line의 배치가 필수적이다. 본 연구에서는 사출공정의 사이클 타임을 최소화하면서 다양한 해석 프로그램을 사용하여 E-Mold의 최적화 설계를 전산모사 하였고, 이를 실험결과와 비교하였다. 먼저, 3D CAD 프로그램인 Pro-Engineer Wildfire 2.0 을 사용하여 E-Mold 금형을 설계하고, ANSYS사의 ICEMCFD 프로그램을 사용하여 MESH 생성하고, ANSYS사의 FLUENT 프로그램을 사용하여 금형의 초기온도 $60^{\circ}C$에서 $120^{\circ}C$와 $180^{\circ}C$까지 가열하는데 걸리는 시간과 냉각시키는데 걸리는 시간 등을 전산모사 하였다. 그리고 Polycarbonate를 이용하여 LGP 도광판을 실제 사출성형하여 얻은 데이터와 비교 분석을 하였다. 전산모사와 실제 사출결과에서 $3{\sim}4$초가량의 차이가 나타났지만 실제 사출시 고온의 용융된 플라스틱 수지에 따른 냉각시간의 오차를 생각한다면, 전산모사와 실힘결과는 거의 일치한다고 볼 수 있다. 따라서 본 체계적인 전산모사방법을 통해 E-Mold의 Heating Line 최적화 설계가 가능하다는 것을 확인하였다.

• 한국정밀공학회지
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• 제14권1호
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• pp.126-141
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• 1997

The purpose of this research is to develope a FEM program for analyzing solidification processes of axisymmetric casting, considering phase changes and the contact between the metal and mold. Tempera- ture recovery method is employed fro considering the phase changes releasing the latent heat and the coin- cident node method is used for calculating the amount of heat transfer between the metal and mold. Tan- gent modulus algorithm is adopted for calculating flow stress and a gap element is employed for modeling the interface between the mold and metal in finding deformed shapes. In order to verify the developed program, axisymmetric aluminum and steel casting processes are simulated. Temperature distribution, phase front position, and shrinkage and porosity creation are compared with measurements, FIDAP results, and good agreements are examined.

• Design & Manufacturing
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• 제12권1호
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• pp.31-35
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• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.

• Journal of Mechanical Science and Technology
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• 제19권7호
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• pp.1488-1502
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• 2005

A three dimensional model was developed to analyze the mold filling and solidification in the casting processes. The model uses the VOF method for the calculation of the free surface and the modified Equivalent Specific Heat method for the treatment of the latent heat evolution. The solution procedure is based on the SIMPLER algorithm. The complete model has been validated using the exact solutions for phase change heat transfer and the experimental results of broken water column. The three-dimensional model has been applied to the benchmark test and the results were compared to those from experiment, a two-dimensional analysis, and another three dimensional numerical model.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.413-413
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• 2014

In this paper, we present a fabrication method of functionalized gold nanostructures on flexible substrate that can be implemented for plasmonic sensing application. For biomolecular sensing, many researchers exploit unconventional lithography method like nanoimprint lithography (NIP), contact transfer lithography, soft lithography, colloidal transfer printing due to its usability and easy to functionalization. In particular, nanoimprint and contact transfer lithography need to have anti-adhesion layer for distinctive metallic properties on the flexible substrates. However, when metallic thin film was deposited on the anti-adhesion layer coated substrates, we discover much aggravation of the mold by repetitive use. Thus it would be impossible to get a high quality of metal nanostructure on the transferred substrate for developing flexible electronics based transfer printing. Here we demonstrate a method for nano-pillar mold and transfer the controllable nanoparticle array on the flexible substrates without an anti-adhesion layer. Also functionalization of gold was investigated by the different length of thiol applied for effectively localized surface plasmonic resonance sensing. First, a focused ion beam (FIB) and ICP-RIE are used to fabricate the nanoscale pillar array. Then gold metal layer is deposited onto the patterned nanostructure. The metallic 130 nm and 250 nm nanodisk pattern are transferred onto flexible polymer substrate by bi-layer functionalized contact imprinting which can be tunable surface energy interfaces. Different thiol reagents such as Thioglycolic acid (98%), 3-Mercaptopropionic acid (99%), 11-Mercaptoundecanoic acid (95%) and 16-Mercaptohexadecanoic acid (90%) are used. Overcoming the repeatedly usage of the anti-adhesion layer mold which has less uniformity and not washable interface, contact printing method using bi-layer gold array are not only expedient access to fabrication but also have distinctive properties including anti-adhesion layer free, functionalized bottom of the gold nano disk, repeatedly replicate the pattern on the flexible substrate. As a result we demonstrate the feasibility of flexible plasmonic sensing interface and anticipate that the method can be extended to variable application including the portable bio sensor via mass production of stable nanostructure array and other nanophotonic application.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.121-127
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• 2022

마이크로 LED는 크기가 100 ㎛ 이하인 LED 소자로 기존 LED에 비해 해상도, 밝기 등 여러 면에서 우수한 성능을 보일 뿐 아니라 유연 디스플레이, VR/AR 등 다양한 분야에 적용이 가능하다. 마이크로 LED 디스플레이를 제작하기 위해선 LED 웨이퍼로부터 최종기판으로 마이크로 LED를 옮기는 전사 공정이 필수적이며, 본 연구에서는 진공 척을 이용하여 마이크로 LED를 고속 대량 전사하는 방식을 제안하고 이를 검증하였다. MEMS 기술을 이용한 PDMS 마이크로 몰딩 공정을 통해 진공 척을 제작하였으며, PDMS 몰딩 공정을 제어하기 위해 댐 구조를 이용한 스핀 코팅 공정을 성공적으로 적용하였다. 솔더볼을 이용한 진공 척 구동 실험을 통해 진공 척을 이용한 마이크로 LED의 대량 전사 가능성을 확인하였다.

• 한국전기전자재료학회논문지
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• 제24권10호
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• pp.790-793
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• 2011

In this study, the surface modification for a silicon(Si) mold using $CHF_3$ inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to $CF_x$(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.

• Design & Manufacturing
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• 제17권2호
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• pp.9-14
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• 2023

In this study, an experiment was conducted to confirm the applicability of the external shape control of the ultrasonic knife to the CFRTP material, which is the base material of thermoplastic. TC910 based on polyamide6 (PA6) was used as the material. The slope 와 and tool transfer speed of the material and tool were selected as process factors for processing, and the following results were obtained. Under all cutting conditions using an ultrasonic knife, friction heat caused by high-frequency vibration was issued at 150℃ at the contact part between the material and the knife during cutting. As a result of the cutting force analysis, the faster the transfer speed, the higher the cutting force as the angle of entry of the blade increased, and the size of the cutting force changed during cutting. As for the size of the burr in accordance with the transfer speed condition, the smallest burr occurred at 150mm/min in the side part, and the smallest burr occurred at 150mm/min and 200mm/min in the case of the outlet burr. The size of the burr according to the entry angle tended to decrease as the tool entry angle increased, and the side part tended to increase as the tool entry angle increased. As a result of the cutting surface analysis, it was confirmed that the base material was eluted under all conditions, and the faster the transfer speed, the lower the elution phenomenon of the base material. Based on the above results, cutting the CFRTP material with an ultrasonic knife is possible, but the effect on heat generation caused by friction needs to be minimized, and further research needs to be conducted on this.

• Korea-Australia Rheology Journal
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• 제12권1호
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• pp.83-92
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• 2000

In resin transfer molding (RTM) process, preplaced fiber mat is set up in a mold and thermoset resin is injected into the mold. An important interest in RTM process is to minimize cycle time without sacrificing part quality or increasing cost. In this study, the numerical simulation and optimization process in filling stage were conducted in order to determine the optimum gate locations. Control volume finite element method (CVFEM) was used in this numerical analysis with the coordinate transformation method to analyze the complex 3-dimensional structure. Experiments were performed to monitor the flow front to validate simulation results. The results of numerical simulation predicted well the experimental results with every single, simultaneous and sequential injection procedure. We performed the optimization analysis for the sequential injection procedure to minimize fill time. The complex geometry of an automobile bumper core was chosen. Genetic algorithm was used in order to determine the optimum gate locations with regard to 3-step sequential injection case. These results could provide the information of the optimum gate locations in each injection step and could predict fill time and flow front.

• 한국전기전자재료학회논문지
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• 제34권4호
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• pp.262-268
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• 2021

For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.