• Title/Summary/Keyword: thin film hardness

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The effect of mechanical properties of carbon-based thin film on plasma nitrided injection mold steel (플라즈마 질화처리한 사출금형소재의 비정질 탄소계 박막 증착에 따른 기계적 특성 향상 효과)

  • Hye-Min Kim;Dae-Wook Kim
    • Journal of the Korean institute of surface engineering
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    • v.56 no.5
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    • pp.328-334
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    • 2023
  • The carbon-based films have various properties, which have been widely applied in industrial application. However, it has critical drawback for poor adhesion between films and metal substrate. In the present work, we have deposited carbon-based films on injection mold steel by plasma assisted chemical vapor deposition (PACVD). In order to improve adhesion, prior to film deposition, the substrate was nitriding-treated using PACVD. And its effect on the adhesion was investigated. Due to the pre-nitriding, the amorphous carbon nitride (a-CN:H) films presented 10 times higher adhesion (34.9 N) than that of un-nitirided. In addition, a friction coefficient was decreased from 0.29 to 0.15 for the amorphous carbon (a-C:H) due to improved adhesion. The obtained results demonstrated that pre-nitriding considerably improved the adhesion, and the relationship among adhesion, hardness, and surface roughness was discussed in detail.

Nano-behavior of material beneath an indenter in nanoindentation (나노 인덴테이션에 의한 나노재료의 경도예측 (1) 나노 인덴테이션에서 압자 밑 재료의 나노거동)

  • Kim, J.;Park, J.W.;Kim, Y.S.;Lee, S.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.111-115
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    • 2003
  • Nanoindentation is simply an indentation test in which the length scale of the penetration is measured in nanometres rather than microns or millimetres, the latter being common in conventional hardness tests. Three-dimensional molecular dynamics simulations have been conducted to evaluate the nanoindentation test. Molecular dynamics simulations were carried out on single crystal copper by varying crystal orientations to investigate nano-behavior of material beneath an indenter in nanoindentation. Morse potential function was used as an interatomic force between indenter and thin film. The result of the simulation shows that crystal orientation significantly influenced the slip system, dislocation nucleation and dislocation behavior.

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Fabrication of Nanoscale Metal Nanobeam Specimens and Evaluation of the Mechanical Properties of Gold Thin Film Nanostructures (나노스케일의 금속 나노빔 시험편 제작 및 이를 이용한 금 박막 나노 구조물의 기계적 물성 평가)

  • Baek, Chang-Wook;Hyeon, Ik-Jae
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.7
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    • pp.1294-1297
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    • 2007
  • In this paper, fabrication techniques for nanoscale metallic nanobeam specimens have been proposed, and mechanical properties of the fabricated gold nanobeams have been evaluated by nanoindentation techniques and nanobeam bending test. Elastic modulus and hardness of gold nanobeams were measured to be $109.6\;{\pm}\;10\;GPa\;and\;1.73\;{\pm}\;0.3\;GPa$, respectively, from the nanoindentation test, while elastic modulus was $241\;{\pm}\;7\;GPa$ from the nanobeam bending test.

A Study on Elastic-Plastic Deformation and 3-D FEA for the Berkovich Nano-Indentation (베르코비치 나노인덴테이션에 대한 3차원 유한요소해석과 탄소성 변형에 관한 연구)

  • Yang Hyeon-Yun;Kim Ji-Soo;Yun Jon-Do;Cho Sang-Bong
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.10 s.175
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    • pp.167-173
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    • 2005
  • The Berkovich nano-indentation is an indentation test method analyzing mechanical properties of materials such as hardness and elastic modulus. The length scale of the penetration is measured in nanometers. Therefore, this method becomes widely useful for analyzing the mechanical property of thin film which can not be measured before. In this paper, comparing two results of the load-displacement curve obtained by the Berkovich nano-indentation and the 3-D finite element analysis, it was confirmed that the 3-D finite element analysis is useful. The phenomenon of pile-up and sink-in due to material properties was discussed by the finite element analysis.

Solid State Cesium Ion Beam Sputter Deposition

  • Baik, Hong-Koo
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1996.06a
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    • pp.5-18
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    • 1996
  • The solid state cesium ion source os alumino-silicate based zeolite which contains cerium. The material is an ionic conductor. Cesiums are stably stored in the material and one can extract the cesiums by applying electric field across the electrolyte. Cesium ion bombardment has the unique property of producing high negative ion yield. This ion source is used as the primary source for the production of a negative ion without any gas discharge or the need for a carrier gas. The deposition of materials as an ionic species in the energy range of 1.0 to 300eV is recently recognized as a very promising new thin film technique. This energetic non-thermal equilibrium deposition process produces films by “Kinetic Bonding / Energetic Condensation" mechansim not governed by the common place thermo-mechanical reaction. Under these highly non-equilibrium conditions meta-stable materials are realized and the negative ion is considered to be an optimum paeticle or tool for the purpose. This process differs fundamentally from the conventional ion beam assisted deposition (IBAD) technique such that the ion beam energy transfer to the deposition process is directly coupled the process. Since cesium ion beam sputter deposition process is forming materials with high kinetic energy of metal ion beams, the process provider following unique advantages:(1) to synthesize non thermal-equilibrium materials, (2) to form materials at lower processing temperature than used for conventional chemical of physical vapor deposition, (3) to deposit very uniform, dense, and good adhesive films (4) to make higher doposition rate, (5) to control the ion flux and ion energy independently. Solid state cesium ion beam sputter deposition system has been developed. This source is capable of producing variety of metal ion beams such as C, Si, W, Ta, Mo, Al, Au, Ag, Cr etc. Using this deposition system, several researches have been performed. (1) To produce superior quality amorphous diamond films (2) to produce carbon nitirde hard coatings(Carbon nitride is a new material whose hardness is comparable to the diamond and also has a very high thermal stability.) (3) to produce cesiated amorphous diamond thin film coated Si surface exhibiting negative electron affinity characteristics. In this presentation, the principles of solid state cesium ion beam sputter deposition and several applications of negative metal ion source will be introduced.

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Superhard SiC Thin Films with a Microstructure of Nanocolumnar Crystalline Grains and an Amorphous Intergranular Phase

  • Lim, Kwan-Won;Sim, Yong-Sub;Huh, Joo-Youl;Park, Jong-Keuk;Lee, Wook-Seong;Baik, Young-Joon
    • Corrosion Science and Technology
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    • v.18 no.5
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    • pp.206-211
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    • 2019
  • Silicon carbide (SiC) thin films become superhard when they have microstructures of nanocolumnar crystalline grains (NCCG) with an intergranular amorphous SiC matrix. We investigated the role of ion bombardment and deposition temperature in forming the NCCG in SiC thin films. A direct-current (DC) unbalanced magnetron sputtering method was used with pure Ar as sputtering gas to deposit the SiC thin films at fixed target power of 200 W and chamber pressure of 0.4 Pa. The Ar ion bombardment of the deposited films was conducted by applying a negative DC bias voltage 0-100 V to the substrate during deposition. The deposition temperature was varied between room temperature and $450^{\circ}C$. Above a critical bias voltage of -80 V, the NCCG formed, whereas, below it, the SiC films were amorphous. Additionally, a minimum thermal energy (corresponding to a deposition temperature of $450^{\circ}C$ in this study) was required for the NCCG formation. Transmission electron microscopy, Raman spectroscopy, and glancing angle X-ray diffraction analysis (GAXRD) were conducted to probe the samples' structural characteristics. Of those methods, Raman spectroscopy was a particularly efficient non-destructive tool to analyze the formation of the SiC NCCG in the film, whereas GAXRD was insufficiently sensitive.

Effect of Anode Voltage on Diamond-like Carbon Thin Film Using Linear Ion Source (Linear Ion Source를 이용한 Anode Voltage 변화에 따른 DLC 박막특성)

  • Kim, Wang-Ryeol;Jung, Uoo-Chang;Jo, Hyung-Ho;Park, Min-Suk;Chung, Won-Sub
    • Journal of the Korean institute of surface engineering
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    • v.42 no.4
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    • pp.179-185
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    • 2009
  • Diamond-like carbon(DLC) films were deposited by linear ion source(LIS)-physical vapor deposition method changing the anode voltages from 800 V to 1800 V, and characteristics of the films were investigated using residual stress tester, nano-indentation, micro raman spectroscopy, scratch tester and Field Emission Scanning Electron Microscope(FE-SEM). The results showed that the residual stress and hardness increased with increasing the ion energy up to anode voltage of 1400 V. It was also found that the content of $SP^3$ carbon increased with increasing the anode voltage $SP^3/SP^2$ ratio through investigation of $SP^3/SP^2$ ratio by the micro-raman analysis. From these results, it can be concluded that the physical properties of DLC films such as residual stress and hardness are increased with increasing the anode voltage. These results can be explained that 3-dimensional cross-links between carbon atoms and Dangling bond are enhanced and the internal compressive stress also increased with increasing the anode voltage. The optimal anode voltage is considered to be around 1400 V in these experimental conditions.

The Study of Ag Thin Film of Suitable Anode for T-OLED: Focused on Nanotribology Methode (UV 처리에 의한 T-OLED용 산화전극에 적합한 Ag 박막연구: Nano-Mechanics 특성 분석을 중심으로)

  • Lee, Kyu Young;Kim, Soo In;Kim, Joo Young;Kwon, Ku Eun;Kang, Yong Wook;Son, Ji Won;Jeon, Jin Woong;Kim, Min Chul;Lee, Chang Woo
    • Journal of the Korean Vacuum Society
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    • v.21 no.6
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    • pp.328-332
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    • 2012
  • The work function of Ag (silver) is too low (~4.3 eV) to be used as an electrode of T-OLED (Top Emission Organic Light Emitting Diode). To solve this weakness, researches used plasma-, UV-, or thermal treatment on Ag films in order to increase the work function (~5.0 eV). So, most of studies have focused only on the work function of various treated Ag films, but studies focusing on nanomechanical properties were very important to investigate the efficiency and life time of T-OLED etc. In this paper, we focused on the mechanical properties of the Ag and $AgO_x$ film. The Ag was deposited on a glass substrate with the thickness of 150 nm by using rf-magnetron sputter with the power was fixed at 100 W and working pressure was 3 mTorr. The deposited Ag film was UV treated by UV lamp for several minutes (0~9 min). We measured the sheet resistance and mechanical property of the deposited film. From the experimental result, there were some differences of the sheet resistance and surface hardness of Ag thin film between short time (0~3 min) and long time UV treatment. These result presumed that the induced stress was taken place by the surface oxidation after UV treatment.

Micro/Nanotribology and Its Applications

  • Bhushan, Bharat
    • Tribology and Lubricants
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    • v.11 no.5
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    • pp.128-135
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    • 1995
  • Atomic force microscopy/friction force microscopy (AFM/FFM) techniques are increasingly used for tribological studies of engineering surfaces at scales, ranging from atomic and molecular to microscales. These techniques have been used to study surface roughness, adhesion, friction, scratching/wear, indentation, detection of material transfer, and boundary lubrication and for nanofabrication/nanomachining purposes. Micro/nanotribological studies of single-crystal silicon, natural diamond, magnetic media (magnetic tapes and disks) and magnetic heads have been conducted. Commonly measured roughness parameters are found to be scale dependent, requiring the need of scale-independent fractal parameters to characterize surface roughness. Measurements of atomic-scale friction of a freshly-cleaved highly-oriented pyrolytic graphite exhibited the same periodicity as that of corresponding topography. However, the peaks in friction and those in corresponding topography were displaced relative to each other. Variations in atomic-scale friction and the observed displacement has been explained by the variations in interatomic forces in the normal and lateral directions. Local variation in microscale friction is found to correspond to the local slope suggesting that a ratchet mechanism is responsible for this variation. Directionality in the friction is observed on both micro- and macro scales which results from the surface preparation and anisotropy in surface roughness. Microscale friction is generally found to be smaller than the macrofriction as there is less ploughing contribution in microscale measurements. Microscale friction is load dependent and friction values increase with an increase in the normal load approaching to the macrofriction at contact stresses higher than the hardness of the softer material. Wear rate for single-crystal silicon is approximately constant for various loads and test durations. However, for magnetic disks with a multilayered thin-film structure, the wear of the diamond like carbon overcoat is catastrophic. Breakdown of thin films can be detected with AFM. Evolution of the wear has also been studied using AFM. Wear is found to be initiated at nono scratches. AFM has been modified to obtain load-displacement curves and for nanoindentation hardness measurements with depth of indentation as low as 1 mm. Scratching and indentation on nanoscales are the powerful ways to screen for adhesion and resistance to deformation of ultrathin fdms. Detection of material transfer on a nanoscale is possible with AFM. Boundary lubrication studies and measurement of lubricant-film thichness with a lateral resolution on a nanoscale have been conducted using AFM. Self-assembled monolyers and chemically-bonded lubricant films with a mobile fraction are superior in wear resistance. Finally, AFM has also shown to be useful for nanofabrication/nanomachining. Friction and wear on micro-and nanoscales have been found to be generally smaller compared to that at macroscales. Therefore, micro/nanotribological studies may help def'me the regimes for ultra-low friction and near zero wear.

Characteristics of Electomigration & Surface Hardness about Tungsten-Carbon-Nitrogen(W-C-N) Related Diffusion Barrier (W-C-N 확산방지막의 전자거동(ElectroMigration) 특성과 표면 강도(Surface Hardness) 특성 연구)

  • Kim, Soo-In;Hwang, Young-Joo;Ham, Dong-Shik;Nho, Jae-Kue;Lee, Jae-Yun;Park, Jun;Ahn, Chan-Goen;Kim, Chang-Seong;Oh, Chan-Woo;Yoo, Kyeng-Hwan;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.18 no.3
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    • pp.203-207
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    • 2009
  • Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.