• 대한기계학회논문집A
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• 제24권9호
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• pp.2334-2343
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• 2000

This paper proposes an efficient beam-shell modeling technique for the free vibration analysis of a T-joint thin-walled beam structure. Except a small portion of a T-joint which is modeled by shell elements, the structure is modeled by thin-walled beam elements that can describe warping and distortion. In order to match the shell and thin-walled beam elements at the interface of the dissimilar elements, a technique based on a pseudo inverse matrix is formulated. This paper also examines the role of the thin-walled element taking into account the distortion and warping deformation degrees of freedom in predicting accurately the dynamic characteristics of a T-joint thin-walled structure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.172-175
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• 2003

ZnO:Al thin film for application to FBAR's bottom electrode using ZnO piezoelectric thin film were prepared by FTS, in order to improve the crystallographic properties of ZnO thin films because the ZnO:Al thin film and ZnO thin films structure is equal each other. So we prepared the ZnO:Al thin film with oxygen gas flow rate. Thickness and c-axis preferred orientation and electric properties of ZnO:Al bottom electrode were evaluated by $\alpha$-step, XRD and 4-point probe..

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.244-247
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• 1996

We had experiment using LB method that can fabricate molecular order ultra-thin film below 100${\AA}$. LB method has known as main technology of information society in 21C, because it is not only free orientation and alignment of molecular but also ability of thickness control as molecular order. In this paper, the fabricated condition and physical properties of functional ultra-thin film of molecular order was investigated and highly efficient ultra-thin film capacitor was fabricated by using ultra-thin LB film for application as electronic device. Possibility of ultra-thin film capacitor was researched by analyzing and measuring electrical properties. Polyimide ultra-thin LB film capacitor was fabricated, ensured theoretically and experimentally its possibility in range of 10Hz∼lMHz through its frequency characteristics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2003년도 제24회 학술발표회 초록집
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• pp.143-143
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• 2003

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.329-329
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• 2011

We measured thin films thickness sputtered from Cu target in the magnetron sputter system. Thin films thickness is thin as integration power in target is large. Cu thin films thickness in 100 kWh integration watt was decreased by 20% when that of beginning was compared. But the shape of thin films thickness distribution was same. For the calculation of thin films thickness distribution in the 100 kWh, the angular distribution data sputtered of Cu particles is necessary when Ar ions enter to inclined erosion surface of Cu target. We used the relation results of sputter yield and main angular distribution of sputtering particles emitted from Cu target published by G. Betz.

• 센서학회지
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• 제27권1호
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• pp.36-39
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• 2018

Transparent olivine $LiNiPO_4$ thin films on sapphire substrates were fabricated by radio frequency (RF) magnetron sputtering. The X-ray diffraction patterns show these thin films have the phase of $LiNiPO_4$ with an ordered olivine structure indexed to the orthorhombic Pmna space group. $LiNiPO_4$ thin films deposited on sapphire substrates exhibit transmittance of about 83 %. It was confirmed that the $LiNiPO_4$ thin film exhibits a high potential of 5 V-class.

• 한국표면공학회지
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• 제44권4호
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• pp.137-143
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• 2011

The internal stress and magnetic properties (coercivity and squareness) of Ni-Fe nano thin film synthesized by electrodeposition method were studied as a function of acidic chloride bath conditions (composition and temperature) and current density. Fe deposition patterns were different depending on the temperature of the solution, the stress of film decreased with increasing the solution temperature, and the depending on the amount of Fe deposition showed a parabolic shape. The grain size of film was inversely proportional to stress of thin film. The internal stress of thin film and magnetic properties were deeply relevant, and the stress of thin film had a relationship with bath conditions and grain size of the thin film surface.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 정기총회 및 창립40주년기념 학술대회 학회본부
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• pp.207-209
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• 1987

This paper reports the effect of additive elements such as Bi, Sb on degradation and hole formation of the Te-Se thin films. Changes in light transmission were used to monitor the degradation rate of thin Te films in an accelerated temperature-humidity environment. In thin accelerated temperature-humidity environment, $(Te_{86}Se_{14})_{70}Bi_{30}$ thin film was stable and $(Te_{86}Se_{14})_{50}Sb_{50}$ thin film was unstable in comparison with the other films that used in this experiment. The hole formation was carried out in the Te-based thin films.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권10호
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• pp.436-440
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• 2003

The (S $r_{0.85}$C $a_{0.15}$)Ti $O_3$(SCT) thin films were deposited on Pt-coated electrode(Pt/TiN/ $SiO_2$/Si) using RF sputtering method according to the deposition condition. The optimum conditions of RF power and Ar/ $O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about 18.75[$\AA$/min] at the optimum condition. The composition of SCT thin films deposited on Si substrate is close to stoichiometry (1.102 in A/B ratio). The capacitance characteristics had a stable value within $\pm$4[%]. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films were observed above 200[kHz]. SCT thin films used in this study showed the phenomena of dielectric relaxation with the increase of frequency.ncy.

• 대한조선학회논문집
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• 제44권6호
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• pp.590-597
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• 2007

The portion of thin plate is expected to increases as to the development of design and fabrication technology. The weld-induced deformation is more serious in thin plates than in thick plates because heat affect zone of thin plates is wider than that of thick plates, and in addition internal and external constraints much more influence upon weld-induced deformation of thin plates. This paper is aimed at applying the mechanical tensioning method to fillet weld of thin plates to reduce the weld-induced deformation. For this purpose, fillet welding tests have been carried out for several thin plate specimens with varying plate thickness and magnitude of tensile load. From the present study, it has been found that the tensioning method is effective on reduction of weld-induced deformation.