• 한국분말재료학회지
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• 제18권5호
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• pp.423-429
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• 2011

Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

• 정보저장시스템학회논문집
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• 제10권2호
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• pp.32-38
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• 2014

Heat emission from the laser diode used in the optical disc drive and the defects from the increased temperature at the system have attracted attentions from the field of the information storage device. Thermoelectric refrigerator is one of the fine solutions to solve these thermal problems. The refrigeration performance of thermoelectric device is dependent on the thermoelectric material's figure-of-merit. Meanwhile, high electrical contact resistivity between metal electrode and p- and n-type thermoelectric materials in the device would lead increased total electrical resistance resulting in the degeneracy in performance. This paper represents the manufacturing process of the PbTe-based material which has one of the highest figure-of-merit at medium-high-temperature, ~ 600K to 900 K, and the nickel contact layer for reduced electrical contact resistance at once, and the results showing the decent contact structure and figure-of-merit even after the long-term operation environment.

• Journal of Power Electronics
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• 제10권2호
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• pp.187-193
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• 2010

This paper proposes a cooling system using thermoelectric elements for improving the output of building integrated photovoltaic (BIPV) modules. The temperature characteristics that improve the output of a BIPV system have rarely been studied up to now but some researchers have proposed a method using a ventilator. The efficiency of a ventilator depends mainly on the weather such as wind, irradiation etc. Because this cooling system is so sensitive to the velocity of the wind, it is unable to operate in the nominal operating cell temperature (NOCT) or the standard test condition (STC) which allow it to generate the maximum output. This paper proposes a cooling system using thermoelectric elements to solve such problems. The temperature control of thermoelectric elements can be controlled independently in an outdoor environment because it is performed by a micro-controller. In addition, it can be operated around the NOCT or the STC through an algorithm for temperature control. Therefore, the output of the system is increased and the efficiency is raised. This paper proves the validity of the proposed method by comparing the data obtained through experiments on the cooling systems of BIPV modules using a ventilator and thermoelectric elements.

• 한국초전도ㆍ저온공학회논문지
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• 제23권3호
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• pp.55-59
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• 2021

A thermoelectric cooler (TEC) is promising as an alternative refrigeration technology for the sake of its inherent advantages; no-moving parts and refrigerant-free in its operation. Due to the compactness, reliability and excellence in temperature stability, TECs have been widely used for small cooling devices. In recent years, thermoelectric devices have been attractive technologies that not only serve the needs of cooling and heating applications but also meet the demand for energy by recycling waste heat. In this research paper, multistage TEC is proposed as a concept of demonstrating the idea of transient cooling technology. The key idea of transient cooling is to harnesses the thermal mass installed at the interfacial level of the stages. By storing heat temporally at the thermal mass, the multistage TEC can readily reach lower temperatures than that by a steady-state operation. The multistage TEC consists of four different sizes of thermoelectric modules and they are operated with an optimized current. Once the cold-part of the uppermost stage is reached at the no-load temperature, the current is successively supplied to the lower stages with a certain time interval; 25, 50 and 75 seconds. The results show the temperatures that can be ultimately reached at the cold-side of the lowermost stage are 197, 182 and 237 K, respectively. It can be concluded that the timing or total amount of the current fed to each thermoelectric module is the key parameter to determine the no-load temperature.

• 한국산업융합학회 논문집
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• 제22권2호
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• pp.219-226
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• 2019

This paper describes the development of a 500W DC/DC converter for use with a thermoelectric module(TEM). A thermoelectric device is a structure in which a P-type semiconductor and an N-type semiconductor are electrically connected in series and thermally connected in parallel. There is a feature that an electromotive force is generated by making a temperature difference between both surfaces of a thermoelectric element. This feature can be used as a renewable power source without the need for fossil energy. The proposed converter boosts the low generation voltage of the thermoelectric element to secure the voltage for the grid connection. This converter is a combination of a resonant converter for boosting and a boost-converter for output voltage control. This structure has an advantage that a voltage can be stepped up at a high efficiency and precise output voltage control is possible. We carry out simulations and experiments to verify the validity.

• 한국분말재료학회지
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• 제29권1호
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• pp.56-62
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• 2022

Atomic layer deposition (ALD) is a promising technology for the uniform deposition of thin films. ALD is based on a self-limiting mechanism, which can effectively deposit thin films on the surfaces of powders of various sizes. Numerous studies are underway to improve the performance of thermoelectric materials by forming core-shell structures in which various materials are deposited on the powder surface using ALD. Thermoelectric materials are especially relevant as clean energy storage materials due to their ability to interconvert between thermal and electrical energy by the Seebeck and Peltier effects. Herein, we introduce a surface and interface modification strategy based on ALD to control the performance of thermoelectric materials. We also discuss the properties of the interface between various deposition materials and thermoelectric materials.

• 한국산학기술학회논문지
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• 제19권2호
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• pp.695-701
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• 2018

엔진에서 배기폐열을 회수하여 엔진의 열효율을 향상시키고자 하는 연구가 활발히 이루어지고 있다. 본 연구에서는 모터사이클용 엔진의 배기 폐열 회수용 열전발전 시스템의 성능 해석을 수행하였다. Gamma Tech.의 GT-SUITE 소프트웨어를 사용하여 엔진모사 모델과 열전발전 시스템 모델을 구성하였다. 첫째, 엔진 속도 1000~7000 rpm, 엔진 부하 0~100% 조건에서 엔진의 출력, 연비 등 성능 특성과 배기가스량, 배기가스 온도 등 배기가스 특성을 파악하였다. 연료의 화학에너지 대비 배기가스로 배출되는 에너지의 비율은 엔진 속도 및 부하에 따라 40~60% 수준으로 확인되었다. 둘째, 배기폐열회수용 열전발전 시스템 모델을 구성하였다. 엔진 모델과 열전발전 시스템 모델을 통합 해석하여, 열전소자에서 발생하는 전압, 전류, 회수 전력 특성 등을 분석하였다. 열전소자의 발전 특성은 시스템을 통과하는 배기가스의 온도 분포에 지배적인 영향을 받았다. 현재 구성된 배기폐열회수용 열전발전 시스템의 열전발전량은 배기폐열 에너지 중 최대 2.2% 수준을 회수할 수 있음을 확인하였다. 향후 연구에서는 열전발전 시스템의 설계에 따른 열전발전량 특성을 파악하고, 열전발전 시스템 설계 최적화를 수행할 예정이다.

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.83-89
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• 2004

NTC 써미스터를 내장시킨 소형의 열전 냉각 모듈을 제작하고 LD와 같은 광통신부품에 적용하기 위한 온도제어 및 항온유지 특성을 분석하였다 BiTe계 열전반도체 21쌍으로 구성된 열전 모듈은 크기 $7.2 mm{\times}9 mm{\times}2.2 mm$이고, 내장된 써미스터의 빠른 응답속도로 인해 정밀온도제어가 가능하다. 열전 모듈은 성능 지수(Z) $2.5{\times}10^{-3}$/K, 300 K에서 최대 온도차(${\Delta}T_{max}$) 72 K, 최대 흡열량($Q_{max}$) 2.2W 값을 나타내었으며 온도 제어 정밀도는 대기 중에서 ${\pm}0.1^{\circ}C$내였다. 이는 광통신 부품의 작동 환경 안정성을 확보할 수 있는 항온제어용 소형 열전 모듈로서 적용이 가능하다.

• 한국전자통신학회논문지
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• 제9권12호
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• pp.1435-1440
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• 2014

본 논문에서는 13.2W급 COB LED의 공랭식 방열을 위해 열전소자를 이용하여 열적 특성을 분석하였다. 기존 방식과의 방열 성능을 비교 분석하기 위하여 Heat Sink를 설계 및 제작 하였고 실험은 100분간 COB LED를 구동시켜 접촉식 온도계를 통하여 온도 분포를 측정하였다. 접합부의 온도 측정 결과 열전소자를 사용하지 않는 방식에서는 약 $75^{\circ}C$로 나타났고, 열전소자에 0.8A의 전류를 인가하여 구동하였을 때 $57^{\circ}C$로 열 응집현상이 가장 심한 COB LED 접합부분의 열은 기존의 방식보다 약 31% 감소됨을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.304.2-304.2
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• 2014

Chalcogenides (Te,Se) and pnictogens(Bi,Sb) materials have been widely investigated as thermoelectric materials. Especially, Bi2Te3 (Bismuth telluride) compound thermoelectric materials in thin film and nanowires are known to have the highest thermoelectric figure of merit ZT at room temperature. Currently, the thermoelectric material research is mostly driven in two directions: (1) enhancing the Seebeck coefficient, electrical conductivity using quantum confinement effects and (2) decreasing thermal conductivity using phonon scattering effect. Herein we demonstrated influence of annealing temperature on structural and thermoelectrical properties of Bismuth-telluride-selenide ternary compound thin film. Te-rich Bismuth-telluride-selenide ternary compound thin film prepared co-deposited by thermal evaporation techniques. After annealing treatment, co-deposited thin film was transformed amorphous phase to Bi2Te3-Bi2Te2Se1 polycrystalline thin film. In the experiment, to investigate the structural and thermoelectric characteristics of Bi2Te3-i2Te2Se1 films, we measured Rutherford Backscattering spectrometry (RBS), X-ray diffraction (XRD), Raman spectroscopy, Scanning eletron microscopy (SEM), Transmission electron microscopy (TEM), Seebeck coefficient measurement and Hall measurement. After annealing treatment, electrical conductivity and Seebeck coefficient was increased by defect states dominated by selenium vacant sites. These charged selenium vacancies behave as electron donors, resulting in carrier concentration was increased. Moreover, Thermal conductivity was significantly decreased because phonon scattering was enhanced through the grain boundary in Bi2Te3-Bi2Te2Se1 polycrystalline compound. As a result, The enhancement of thermoelectric figure-of-merit could be obtained by optimal annealing treatment.