• Journal of the Korean Vacuum Society
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• v.11 no.4
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• pp.189-193
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• 2002

We have developed a characteristics evaluating system for low vacuum gauges with a project of basis of vacuum technology construction. By using this system, we also performed a characteristics evaluation as to the accuracy, linearity, repeatability, gas sensitivity, and long-term stability of thermal conductivity gauges.

• Journal of the Korean Vacuum Society
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• v.8 no.4B
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• pp.497-506
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• 1999

Carbon has been widely used for the material of plasma facing components in fusion experiment devices like a tokamak, because carbon has good thermal and mechanical properties. However carbon gas a relatively high ougassing rate. Therefore the amount and the surface area of the carbon material used in the vessel will determine the background pressure of the vacuum vessel. In this experiment influences of carbon on the vacuum performance was investigated by measuring chamber pressure, ougassing rater and gas spectrum of carbon fiber composite (CFC) samples in various situations, pumping out, chamber baking, carbon heating (250~$500^{\circ}C$), exposure to atmosphere for maintenance of in-vessel components, etc., occurring routinely during tokamak operations.

• Journal of Power System Engineering
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• v.14 no.4
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• pp.23-28
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• 2010

Of the roughly four million known substances, about 60,000 are processed and sold ; many of these must be dried. Many materials are processed in the liquid state - ideal for mixing and reacting - but most products are needed or wanted as dry, or relatively dry, solids. Usually operation is just below atmospheric pressure, as with direct dryers, but some are built for vacuum operation with pressures as low as 26.66kPa abs.. In spite of the global-class aquiculture agriculture and fisheries technology of our country, the processing technologies are lags behind the other nations relatively. These problems are considered to be caused directly by the lack of drying technologies. This paper is concerned to the experimental results of drying heat transfer characteristics for the green energy type vacuum dryer for the high quality agriculture and fisheries production.

• The Journal of the Korea Contents Association
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• v.20 no.11
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• pp.333-341
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• 2020

Since thermal paper is widely used in daily life such as convenience store receipts, lottery tickets and ATM receipts, it is important to develop fingerprints on thermal papers because it can be easily found in crime scenes. This study compared the ability of fingerprint development between vacuum metal deposition(VMD) and 1,2-indanedione(SOON-100) in order to evaluate the effectiveness of VMD, which some literatures have stated to be effective in thermal papers. As a result, in the case of SOON-100, clear ridges of fingerprints that enable individual identification were observed after an hour of deposition, although the fresh fingerprints were faint. In the case of VMD, the fingerprints gradually spread and the quality of the ridges deteriorated rapidly after 6 hours of deposition. This results is consistent with the principle of VMD. Considering the principles of VMD and the characteristics of the surface of thermal paper, VMD is not suitable for the development of potential fingerprints on the thermal paper.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• Progress in Superconductivity and Cryogenics
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• v.24 no.4
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• pp.65-70
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• 2022

A vacuum system is designed for thermal insulation of a 10 ton/day class air liquefaction cold box for liquid air energy storage. The vacuum system is composed of a turbomolecular pump, a backing pump and vacuum piping for the vacuum pumps. The turbomolecular pump is in combination with the backing pump for pumping capacity. The vacuum piping is designed with system installation conditions, such as distance from the cold box, connections to vacuum pumps and installation space. The capacity of the vacuum pump combination, namely pumping speed, is determined by analysis of the vacuum system, and pump-down time to 1×10^-5 mbar is estimated. Vacuum piping conductance, system pumping speed and outgassing rate are calculated for the pump-down time with the ultimate pumping speed range of the vacuum pump combination of 1400 - 2300 l/s. Although the pump-down time gets shorter by larger capacity vacuum pumps, it mainly depends on target vacuum degree and outgassing rate in the cold box. The pump-down time is estimated as 3 - 6 hours appropriate for cold box operation for the pumping speed range. Considering the outgassing rate has uncertainty, the vacuum pump combination with pumping speed of 1900 l/s is chosen for the vacuum system, which is middle value of the pumping speed range.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2500-2505
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• 2007

The vacuum interrupter (VI) is used for medium-voltage switching circuits due to its abilities and advantages as a compact and environmental friendly circuit breaker. In general, the application of a sufficiently strong axial magnetic field (AMF) permits the arc to be maintained in a diffused mode to a high-current vacuum arc. A full understanding of the vacuum arc physics is very important since it can aid to improve the performance of vacuum interrupter. In order to closely examine the vacuum arc phenomena, it is necessary to predict the magnetohydrodynamic (MHD) characteristics by the multidisciplinary numerical modeling, which is coupled with the electromagnetic and hydrodynamic fields, simultaneously. In this study, we have investigated the electromagnetic behaviors of high-current vacuum arcs for two different types of AMF contacts, which are coil-type and cup-type, using a commercial finite element analysis (FEA) package, ANSYS. The present results are compared with those of MAXWELL 3D, a reliable electromagnetic analysis software, for verification.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2515-2518
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• 2008

The vacuum interrupter (VI) is widely used in medium-voltage switching circuits due to its abilities and advantages as an environmental friendly circuit breaker. An understanding of the vacuum arc flow phenomena is very important for improving the performance of vacuum interrupter. In order to closely examine the vacuum arc phenomena, it is necessary to predict the magnetohydrodynamic (MHD) characteristics by the multidisciplinary numerical modeling, which is coupled with the electromagnetic and the thermal flow fields, simultaneously. In this study, we have investigated arc plasma constriction phenomena and an effect of AMF on the arc plasma with the high-current vacuum arcs for the cup-type AMF electrode by using a commercial finite element analysis (FEA) package, ANSYS. The simulation results applied with various AMFs and constant Joule heat generation show that strong axial magnetic field (AMF) permits the arc to be maintained in a diffused mode to a high-current vacuum arc. However, further studies are required on the two-way coupling method and radiation model for arc plasma in order to accomplish the advanced analysis method.