• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Korean Electrochemical Society
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• v.19 no.3
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• pp.101-106
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• 2016

In this study, we prepared an ionic liquid composite solid polymer electrolyte (PEO-LiTFSI-$Pyr_{14}TFSI$) with poly(ethylen oxide), lithium bis(trifluoromethanesulfonyl)imide, N-butyl-N-methylpyrrolidinium bis(trifluoromethanesulfonyl)imide by blending-cross linking process. Although the PEO-LiTFSI-$Pyr_{14}TFSI$ composite solid polymer electrolyte displayed a small peak at 4.4 V, it had high electrochemical oxidation stability up to 5.7 V. Ionic conductivity of the PEO-LiTFSI-$Pyr_{14}TFSI$ composite solid polymer electrolyte increased with increasing temperature from $10^{-6}S\;cm^{-1}$ at $30^{\circ}C$ to $10^{-4}S\;cm^{-1}$ at $70^{\circ}C$. To investigate the electrochemical properties, the PEO-LiTFSI-$Pyr_{14}TFSI$ composite solid polymer electrolyte assembled with $LiFePO_4$ cathode and Li-metal anode. At 0.1 C-rate, the cell delivered $40mAh\;g^{-1}$ for $30^{\circ}C$, $69.8mAh\;g^{-1}$ for $40^{\circ}C$ and $113mAh\;g^{-1}$ for $50^{\circ}C$, respectively. The PEO-LiTFSI-$Pyr_{14}TFSI$ solid polymer electrolyte exhibited good charge-discharge performance in Li/SPE/$LiFePO_4$ cells at $50^{\circ}C$.

• Applied Chemistry for Engineering
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• v.31 no.3
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• pp.341-345
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• 2020

An in situ regeneration of activated carbon bed using an ozonated water was studied in order for avoiding the carbon loss, contaminant emission and time consuming for discharge-regeneration-repacking in a conventional thermal regeneration process. Using phenol and polyethylene glycol (PEG) as adsorbates, the adsorption breakthrough and in situ regeneration with the ozonated water were repeated. These organics were supposed to degrade by the oxidation reaction of ozone, regenerating the bed for reuse. As the number of regeneration increased, the adsorption capacity for phenol was reduced, but the change was stabilized showing no further reduction after reaching a certain degree of decrement. The reduction of adsorption capacity was due to the increase of pore size resulting in the decrease of specific surface area during ozonation. The adsorption capacity of phenol decreased after the ozonated regeneration because the in-pore adsorption was prevalent for small molecules like phenol. However, PEG did not show such decrease and the adsorption capacity was constantly maintained after several cycles of the ozonated regeneration probably because the external surface adsorption was the major mechanism for large molecules like PEG. Since the reduction in the pore size and specific surface area for small molecules were proportional to the duration of contact time with the ozonated water, careful considerations of the solute size to be removed and controlling the contact time were necessary to enhance the performance of the ozonated in situ regeneration of activated carbon bed.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.79-84
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• 2010

Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.

• Journal of the Korea Organic Resources Recycling Association
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• v.8 no.4
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• pp.129-137
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• 2000

In this study, biological treatment process of MWWT(Municipal wet-waste Treatment) has been developed through a moduling of the containerized closed ATAD(Auto thermal aerobic digestion) system & closed vertical dynamic acerator, which were used for food waste and cattle manure, respectively. Though biological process has several advantages such as low concentrations of heavy metals and salts, proper and stable C/N ratio and constant reaction rate against the process treating two wastes separately, it has a obstacles of salt concentration and much usage of bulking agent such as wood chip. After rapid oxidation in the boxed tower reactor for 5 days, the content of sewage sludge would be reduced 65% on around, might be mixed with the food waste that had been treated in the static closed reactor during 6 days and put in the secondary static reactor for curing. During composting process, the odor contained in the gas generated from the reactor was removed by passing it through a biofilter as well as the leachate was treated in the wastewater treatment facility. Consequently, it seemed to be possible to compost sewage sludge at mild and stable operating condition and at low cost through the biological ATAD process resulting in the production of organic compost satisfying the specifications regulated by itself.

• Korean Chemical Engineering Research
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• v.51 no.6
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• pp.692-699
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• 2013

In this study, isothermal (350, 375, 400, 425, 450, 500, $850^{\circ}C$) experiments were carried out using a custom-made thermobalance to analyze the thermal decomposition properties of refuse plastic fuel (RPF), which is to be used as a cofiring fuel with a sub-bituminous coal at commercial circulating fluidized bed (CFB) boiler in Korea. In isothermal pyrolysis results, no change in the reaction model was observed in the temperature range of $375{\sim}450^{\circ}C$ and it was revealed that the first order chemical reaction (F1) is the most suitable among 12 reaction models. The activation energy shows similar results irrespective of application of reaction model in that the activation energy was 39.44 kcal/mol and 36.96 kcal/mol when using Arrhenius equation and iso-conversional method ($0.5{\leq}X{\leq}0.9$) respectively. Mean-while, the devolatilization time ($t_{dev}$) according to particle size (d) of RPF could be expressed as $t_{dev}=10.38d^{2.88}$ at $850^{\circ}C$, operation temperature of CFB and for even distribution and oxidation of RPF in CFB boiler, we found that the relationship of average dispersion distance (x) and particle size was $x{\leq}1.58d^{1.44}$.

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.26-33
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• 2009

Recently ultra-supercritical steam power plants operate at $1000^{\circ}F$ ($538^{\circ}C$) and 3500 psi (24.1 MPa). Thermal efficiency of power plant will be increased about 2% if steam temperature increases from $1000^{\circ}F$ to $1150^{\circ}F$ ($621^{\circ}C$). In this study valve materials Incoloy901 (IC901) and Inconel718 (IN718) were nitrided to improve the surface hardness and solid lubrication function of the valve materials. The hardness of both IC901 and IN718 increased about two times by ion nitriding. IC901, IN718 and their nitrided specimens were corroded under ultra super-critical condition (USC) of $621^{\circ}C$. and 3600 psi (24.8 MPa) for 2000 hours. Oxidations of both IC901 and IN718 were very small due to the formation of protective oxide layer on the surface. But the corrosion resistance of both nitrided specimens decreased because of the formation of non-protective nitride layer of $Fe_{4}N$, $Fe_{2}N$ and CrN on the surface layer. The hardness of both nitrided IC901 and IN718 at $20{\mu}m$ depth from the surface decreased about 30% and 20% respectively by USC 2000 hours.

• Journal of the Korean Vacuum Society
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• v.21 no.6
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• pp.328-332
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• 2012

The work function of Ag (silver) is too low (~4.3 eV) to be used as an electrode of T-OLED (Top Emission Organic Light Emitting Diode). To solve this weakness, researches used plasma-, UV-, or thermal treatment on Ag films in order to increase the work function (~5.0 eV). So, most of studies have focused only on the work function of various treated Ag films, but studies focusing on nanomechanical properties were very important to investigate the efficiency and life time of T-OLED etc. In this paper, we focused on the mechanical properties of the Ag and $AgO_x$ film. The Ag was deposited on a glass substrate with the thickness of 150 nm by using rf-magnetron sputter with the power was fixed at 100 W and working pressure was 3 mTorr. The deposited Ag film was UV treated by UV lamp for several minutes (0~9 min). We measured the sheet resistance and mechanical property of the deposited film. From the experimental result, there were some differences of the sheet resistance and surface hardness of Ag thin film between short time (0~3 min) and long time UV treatment. These result presumed that the induced stress was taken place by the surface oxidation after UV treatment.

• Korean Journal of Food Science and Technology
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• v.31 no.3
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• pp.600-605
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• 1999

Methyl linoleate was oxidized at 60, 90, 120 and $150^{\circ}C$, respectively, with sparging oxygen for different periods of time. On the basis of the peroxide values determined at four temperatures, four heating times were chosen for the analysis of physicochemical parameters, such as peroxide value, total oxidation products, polymer content, viscosity, refractive index and characteristics of thermal degradation by DSC (Differential Scanning Calorimeter). The content of peroxide linkage (C-O-O-C) polymer and ether or carbon to carbon linkage (C-O-C/C-C) polymer were analyzed by High Performance Size Exclusion Chromatography (HPSEC). The polymer formed at four temperatures was qualitatively identified as dimer. The polymer with peroxide linkage (C-O-O-C) were detected from methyl linoleate oxidized at $60^{\circ}C\;and\;90^{\circ}C$, but they were not detected from methyl linoleate oxidized at $120^{\circ}C\;and\;150^{\circ}C$. The enthalpy changes increased as peroxide value increased whereas maximum degradation temperature decreased. The highest correlation coefficients were obtained between maximum degradation temperature $(T_m)$, exothermic enthalpy changes and peroxide value, peroxide linkage (C-O-O-C) polymer content.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.142.2-142.2
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• 2018

One-dimensional metal oxide nanostructures have attracted considerable research activities owing to their strong application potential as components for nanosize electronic or optoelectronic devices utilizing superior optical and electrical properties. In which, semiconducting $SnO_2$ material with wide-bandgap Eg = 3.6 eV at room temperature, is one of the attractive candidates for optoelectronic devices operating at room temperature [1, 2], gas sensor [3, 4], and transparent conducting electrodes [5]. The synthesis and gas sensing properties of semiconducting $SnO_2$ nanomaterials have become one of important research issues since the first synthesis of SnO2 nanowires. In this study, $SnO_2$ nanowire networks were synthesized on a basis of a two-step process. In step 1, Sn spheres (30-800 nm in diameter) embedded in $SiO_2$ on a Si substrate was synthesized by a chemical vapor deposition method at $700^{\circ}C$. In step 2, using the source of these Sn spheres, $SnO_2$ nanowire (20-40 nm in diameter; $1-10{\mu}m$ in length) networks on a spherical Sn surface were synthesized by a thermal oxidation method at $800^{\circ}C$. The Au layers were pre-deposited on the surface of Sn spherical and subsequently oxidized Sn surface of Sn spherical formed SnO2 nanowires networks. Field emission scanning electron microscopy and high-resolution transmission electron microscopy images indicated that $SnO_2$ nanowires are single crystalline. In addition, the $SnO_2$ nanowire is also a tetragonal rutile, with the preferred growth directions along [100] and a lattice spacing of 0.237 nm. Subsequently, the $NO_2$ sensing properties of the $SnO_2$ network nanowires sensor at an operating temperature of $50-250^{\circ}C$ were examined, and showed a reversible response to $NO_2$ at various $NO_2$ concentrations. Finally, details of the growth mechanism and formation of Sn spheres and $SnO_2$ nanowire networks are also discussed.