• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.350-356
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• 2005

We report the space charge and the surface potential of the interface between metal and copper(Ⅱ)-phthalocyanine(CuPc) thin films by measuring the microwave reflection coefficients S/sub 11/ of thin films using a near-field scanning microwave microscope(NSMM). CuPc thin films were prepared on Au and Al thin films using a thermal evaporation method. Two kinds of CuPc thin films were prepared by different substrate heating conditions; one was deposited on preheated substrate at 150。C and the other was annealed after deposition. The microwave reflection coefficients S/sub 11/ of CuPc thin films were changed by the dependence on grain alignment due to heat treatment conditions and depended on thickness of CuPc thin films. Electrical conductivity of interface between metal and organic CuPc was changed by the space charge of the interface. By comparing reflection coefficient S/sub 11/ we observed the electrical conductivity changes of CuPc thin films by the changes of surface potential and space charge at the interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.390-391
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• 2009

Recently, composite hollow bushings have been increasingly employed mainly from the various characteristics. Composite bushings are superior to porcelain bushings in several respects, including lighter weight, better anti-pollution and anti-explosion properties, and easer manufacturing. This paper deals with the optimal thermal fitting for improved tightness characteristics of composite bushing. Two types of composite bushings were fabricated. For optimal fitting process, it is necessary using adhesive and designed internal structure of flange and FRP tube. In this study, for improved tightness characteristics of composite bushing has prominence and interface tolerance of flange and FRP tube. From FE-SEM analysis the adhesive layers were different with interface tolerance, sample 1 and 2 which have respective about $120{\mu}m$ and $50{\mu}m$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.12
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• pp.1096-1100
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• 2008

This report examines the variations on structural properties of $SnO_2$ thin films deposited by using thermal chemical vapor deposition techniques with different oxygen flow gas. TEM showed some of the interface to be atomically rough. The aspects of the boundary shape and growth behavior agree well with the theory of interface growth. The electron diffraction showed that the roughness was changed as the different oxygen flow gas increased. These measurement results suggested that the number of interface facet and abnormal grain growth were related oxygen flow gas.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.18-22
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• 2008

In this paper, the Ni-Co alloy was used for thermal stability estimation comparison with Ni structure. The proposed Ni/Ni-Co structure exhibited wider range of rapid thermal process windows, lower sheet resistance in spite of high temperature annealing up to $700^{\circ}C$ for 30 min, more uniform interface via FE-SEM analysis, NiSi phase peak. Therefore, The proposed Ni/Ni-Co structure is highly promising for highly thermal immune Ni-silicide for nano-scale MOSFET technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.693-699
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• 2003

To improve thermal stability of Teflon FEP which is the most widely used materials for electret application, Teflon AF film of 1 $\mu\textrm{m}$ thick was spin coated on FEP film and the charge storage properties were investigated. The surface potential depend on aging temperature. Thermal Stimulated Current(TSC), Atomic Force Microscopy(AFM), and Fourier Transform-Infrared Spectroscope(FT-lR) measurements were carried out. It is shown that the AF/FEP dual film have more higher electrical property and thermal stability than that FEP film have caused by charge stored at interface of AF and FEP.

• Journal of Electrochemical Science and Technology
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• v.7 no.2
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• pp.179-184
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• 2016

The interface between the surface of a cathode material and the electrolyte gives rise to surface reactions such as solid electrolyte interface (SEI) and chemical side reactions. These reactions lead to increased surface resistance and charge transfer resistance. It is consequently necessary to improve the electrochemical characteristics by suppressing these reactions. In order to suppress unnecessary surface reactions, we coated cathode material using polypropylene (PP). The PP coating layer effectively reduced the SEI film that is generated after a 4.3 V initial charging process. By mitigating the formation of the SEI film, the PP-coated Li[(Ni_0.6Co_0.1Mn_0.3)_0.36(Ni_0.80Co_0.15Al0.05)_0.64)]O₂(NCS) electrode provided enhanced transport of Li⁺ ions due to reduced SEI resistance (R_SEI) and charge transfer resistance (R_ct). The initial charge and discharge efficiency of the PP-coated NCS electrode was 96.2 % at a current density of 17 mA/g in a voltage range of 3.0 ~ 4.3 V, whereas the efficiency of the NCS electrode was only 94.7 %. The presence of the protective PP layer on the cathode improved the thermal stability by reducing the generated heat, and this was confirmed via DSC analysis by an increased exothermic peak.

• Structural Engineering and Mechanics
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• v.85 no.3
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• pp.305-314
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• 2023

The article is about the theoretical analysis of the transmission and reflection of elastic waves through the interface of perfectly connected materials. The solid continuum mediums considered are piezoelectric semiconductors and transversely isotropic in nature. The connection among the mediums is considered in such a way that it holds the continuity property of field variables at the interface. The concept of strain and stress introduced by non-local theory is also being involved to make the study more applicable It is found that, the incident wave results in the generation of four reflected and three transmitted waves including the thermal and elastic waves. The thermal waves generated in the medium are encountered by using the concept of three phase lag heat model along with fractional ordered time thermoelasticity. The results obtained are calculated graphically for a ZnO material with piezoelectric semiconductor properties for medium M₁ and CdSc material with transversely isotropic elastic properties for medium M₂. The influence of fractional order parameter, non-local parameter, and steady carrier density parameter on the amplitude ratios of reflected and refraction waves are studied graphically by MATLAB.

• Korean Journal of Optics and Photonics
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• v.25 no.4
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• pp.221-224
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• 2014

We present a method for manufacturing a TIM used for packaging a high-power LED. In this method a mixture of diamond powder and hydrogen peroxide is used as a filler epoxy. The thermal resistance of the TIM with hydrogen peroxide was improved by about 30% over the thermal resistance of the TIM without hydrogen peroxide. We demonstrate that as a result the heat generated from the chip is easily dissipated through the TIM.

• Journal of Korea Foundry Society
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• v.25 no.1
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• pp.30-35
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• 2005

The structures and mechanical property of the unidirectionally solidified Al-Co eutectic alloy were investigated. Al-Co eutectic alloy was unidirectionally solidified with growth rates(R) between I cm/hr and 10 cm/hr in the induction furnace maintaining the thermal gradient (G) at solid-liquid interface, $32^{\circ}C$/cm. The eutectic microstructure was varied with the growth condition(G/R ratio). When the G/R ratio was larger than $8.5{\times}10^{3}^{\circ}C/cm^{2}/sec$, a lamellar structure was formed, But the G/R ratio was smaller than $8.5{\times}10^{3}^{\circ}C/cm^{2}/sec$, a colony structure was formed. It was found that the interlamellar spacing(${\lambda}$) was dependent on the growth rate(R) with the relationship, ${\lambda}^{2}{\cdot}R=constant$. The microhardness of this eutectic alloy increased with increase in the growth rate.

• Journal of Welding and Joining
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• v.23 no.2
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• pp.59-65
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• 2005

A leaky surface acoustic wave (LSAW) velocity was measured using a scanning acoustic microscope on the ceramic/metal interface in order to investigate material properties. The inverse Fourier transform (IFFT) of the V(z) curve contains the reflectance function of a liquid-specimen interface. So, the longitudinal, transverse, and Rayleigh wave velocities for each layer are obtained by the inversion of the V(z) curve at the same time. This paper contains mainly the experimental procedure for measurements of the LSAW velocity, and the results obtained for the velocity variation of individual layer after the thermal shock. It is shown that this method is useful in measuring the material properties under external stress.