• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.251-254
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• 2001

In this paper, we analysed the properties change of electric wire when the thermal stress was applied to NFR-8 and FR-PVC [600] wire. Measurement is made of the attenuation of a light beam by smoke accumulating with in a closed chamber due to nonflamining pyrolytic decomposition and flaming combustion. Results are expressed in terms of specific optical density which is derived from a geometrical factor and the measured optical density a measurement characteristic of the concentration of smoke. Referenced documents were ASTM E662 standard test method for specific Ds generated by solid materials. The furnace control system shall maintain the required irradiance level under steady-state condition with the chamber door closed of 2.5${\pm}$0.04[w/$\textrm{cm}^2$] for 20 min. According to the results of the smoke density analysis of NFR-8 and FR-PVC the highest decomposition flaming smoke density range of NFR-8 and FR-PVC were 7.2 to 77.5 and 51.1 respectively. Nonflaming smoke density range of NFR-8 and FR-PVC were 100.4 to 112.2 and 126.5 to 398.8. The amount of carbon monoxide generated was found to be much higher in FR-PVC decomposition than in NFR-8 due to incomp1ete combustion of FR-PVC which has high content of carbon in compound.

• Journal of Satellite, Information and Communications
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• v.7 no.2
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• pp.18-24
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• 2012

High current behaviors of the extended drain n-type metal-oxide-semiconductor field effects transistor (EDNMOSFET) for electrostatic discharge (ESD) protection of high voltage operating LDI (LCD Driver IC) chip are analyzed. Both the transmission line pulse (TLP) data and the thermal incorporated 2-dimensional simulation analysis demonstrate a characteristic double snapback phenomenon after triggering of biploar junction transistor (BJT) operation. Also, background doping concentration (BDC) is proven to be a critical factor to affect the high current behavior of the EDNMOS devices. The EDNMOS device with low BDC suffers from strong snapback in the high current region, which results in poor ESD protection performance and high latchup risk. However, the strong snapback can be avoided in the EDNMOS device with high BDC. This implies that both the good ESD protection performance and the latchup immunity can be realized in terms of the EDNMOS by properly controlling its BDC.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.39-48
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• 2005

Finite element analyses have been performed for the purpose of obtaining the robust and reliable design of engine cylinder block. Fatigue under high cycle operating loads is a primary concern and is evaluated by a probabilistic method. The robust and reliable design by a probabilistic method can provide satisfactory design conditions for the performance of the system under the influence of noise factors. Therefore, the design by this method will be desensitized to the uncontrollable noise factors. The simple methodology evaluates the distortion of main bore is proposed for the purpose of maintaining a well-controlled clearance between the crankshaft and main bores. The proposed methodology has proven a capability of predicting the distortion of the main bore under assembly, thermal, and firing loads. The calculated results are correlated well with the experimental ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2009.04a
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• pp.557-563
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• 2009

FMVSS 302 수평 연소 시험법을 통과한 자동차 내장재의 열적 특성을 평가하기 위해서 콘칼로미터를 이용하여 시험을 수행하였다. 화재 위험과 관련된 착화시간(time to ignition), 열방출률(heat release rate), 질량감소율(specific mass loss rate), 감쇠계수(extinction coefficient) 그리고 연기요소(smoke factor)와 같은 여러 가지 요소들을 분석하였다. 최대 열방출률값은 시험편에 따라 232${\sim}$635kW/$m^2$으로 큰 편차를 보였으며, 연기요소 또한 99${\sim}$551MW/$m^2$로 큰 편차를 보였다. 보조매트의 최대 열방출률은 다른 시험편에 비해서 상대적으로 낮은 값을 보였지만, 총연기 발생이 다른 시험편에 비해서 상당히 높았다. 따라서 최대 열방출률과 총 연기발생을 함께 고려한 연기요소값은 상대적으로 다른 시험편에 비해서 높게 나타났다.

• Journal of Korean Society for Quality Management
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• v.47 no.3
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• pp.401-415
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• 2019

Purpose: When the SURION Aircraft operated in the fields, cracks are found in PU(polyurethane) Strip on main rotor blade. This study has been conducted to explain PU(polyurethane) Strip crack phenomenon of SURION main rotor blade and to propose useful solution of it by experimental method. Methods: This study considered a lot of factor because the SURION is operated at severe environment. This study investigated the influence of temperature, thermal shock, paint and primer process, PU Strip material, primer material. Results: The results of this study are as follows; The primer process was most excellent influence. The Application of primer having a brittleness caused by a crack of PU Strip. Other factors have influenced on the PU Strip, but they can not be controlled because they are related to the SURION's operating environment. Conclusion: The Quality of PU Strip on SURION main rotor blade was improved through removing the primer process. Finally, the reliability of main rotor blade was guaranteed through improving the quality of PU Strip.

• Advances in Energy Research
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• v.3 no.2
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• pp.117-124
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• 2015

In this paper, we have reported an enhancement in thermoelectric properties of un-doped zinc oxide (ZnO) grown by molecular beam epitaxy (MBE) on silicon (001) substrate by annealing treatment. The grown ZnO thin films were annealed in oxygen environment at $500^{\circ}C-800^{\circ}C$, keeping a step of $100^{\circ}C$ for one hour. Room temperature Seekbeck measurements showed that Seebeck coefficient and power factor increased from 222 to $510{\mu}V/K$ and $8.8{\times}10^{-6}$ to $2.6{\times}10^{-4}Wm^{-1}K^{-2}$ as annealing temperature increased from 500 to $800^{\circ}C$ respectively. This observation was related with the improvement of crystal structure of grown films with annealing temperature. X-ray diffraction (XRD) results demonstrated that full width half maximum (FWHM) of ZnO (002) plane decreased and crystalline size increased as the annealing temperature increased. Photoluminescence study revealed that the intensity of band edge emission increased and defect emission decreased as annealing temperature increased because the density of oxygen vacancy related donor defects decreased with annealing temperature. This argument was further justified by the Hall measurements which showed a decreasing trend of carrier concentration with annealing temperature.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.7
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• pp.386-393
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• 2009

The present study has been studied on a thermal and flow characteristic of the microchannel waterblock with flow distributions in each channels. Results of a numerical analysis using the CFX-11 are compared with results of an experiment. Numerical analysis and experiment are conducted under an input power of 150 W, inlet temperature of $20^{\circ}C$ and mass flow rates of $0.7{\sim}2.0$ kg/min. Base temperature and pressure drop are investigated with standard deviations of mass flow rates in each channels of samples. The flow distribution and j/f factor of the sample 4 is increased by about 65.7% and 42.6%, compared to that of the reference model sample 3.

• Journal of the Korean Solar Energy Society
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• v.33 no.3
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• pp.17-26
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• 2013

The aim of this study is to analyze the performance of a parabolic trough solar collector (PTC) for water heating and to validate the model performance. The simulated model was compared, calibrated and verified with the experimental results. RMSE (Root mean square error) was used to calibrate the convective heat transfer coefficient between the absorber pipe and the ambient air which was the main factor affecting the heat transfer associated with the PTC. The calibrated model was better fitted with the experimental model. The maximum, minimum and mean deviation between the measured and predicted water temperatures differed only $0.81^{\circ}C$, $0.09^{\circ}C$ and $0.31^{\circ}C$ respectively in the calibrated model. RMSE values were decreased from 0.5389 to 0.4910, 0.0134 to 0.0125 and R-squared was increased from 0.9955 to 0.9956 after calibration. The temperature of water was increased from $33.7^{\circ}C$ to $48^{\circ}C$ in 12hour test. The thermal efficiency of the collector was calculated to be 55%. The calibrated model showed good agreement with the experimental data for model validation.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.