• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• 대한기계학회논문집B
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• 제29권4호
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2005년도 춘계 학술대회논문집
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• 한국표면공학회지
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• 제29권3호
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• pp.163-175
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• 1996

Flame-sprayed Ni-based coatings are investigated in order to improve the thermal fatigue properties of gray cast iron in the presence of water spraying. The results of thermal cycling tests from room temperature to $1100^{\circ}C$ indicate that thermal fatigue endurance is increased in the order of Ni-20%Cr, NiCr-6%Al, and Ni-5%Al. The thermal fatigue failure is caused by the formation of iron oxides between the coating and the substrate and then the thermal fatigue cracks have propagated either along the brittle iron oxide layer resulting in the spatting of the coatings in case of Ni-5%Al and NiCr-6%Al coatings or to the substrate resulting in the whole specimen fracture in case of Ni-20%Cr coating. It seems that the most governing factor for thermal fatigue resistance is the thermal expansion coefficient difference between the coating and the substrate. Microstructural variations before and after the tests are also discussed.

• 한국전산유체공학회지
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• 제11권2호
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2004년도 한국우주과학회보 제13권2호
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• pp.270-273
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• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

• 한국세라믹학회지
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• 제55권5호
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• pp.452-460
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• 2018

This study investigate changes in mechanical behaviors such as indentation load-displacement and hardness of thermal barrier coatings (TBCs) using cycling of thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/super alloy are prepared using different starting granules, 204C-NS and 204NS commercial powers, and the effect of double layers of 204C-NS on 204NS and 204NS on 204C-NS are investigated. The highest temperature applied during thermal shock test is $1100^{\circ}C$ and the maximum number of cycles is 1,200. The results indicate that bilayered TBC showed a relatively mechanically resistant property during thermal shock cycles and that the mechanical behavior is influenced by the microstructure of TBCs by exposure to high temperature during tests or different starting granules.

• Journal of Power Electronics
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• 제16권2호
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• pp.685-694
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• 2016

This paper presents a reliability assessment model for the power semiconductors used in wind turbine power converters. In this study, the thermal loadings at different timescales of wind speed are considered. First, in order to address the influence of long-term thermal cycling caused by variations in wind speed, the power converter operation state is partitioned into different phases in terms of average wind speed and wind turbulence. Therefore, the contributions can be considered separately. Then, in regards to the reliability assessment caused by short-term thermal cycling, the wind profile is converted to a wind speed distribution, and the contribution of different wind speeds to the final failure rate is accumulated. Finally, the reliability of an actual power converter semiconductor for a 2.5 MW wind turbine is assessed, and the failure rates induced by different timescale thermal behavior patterns are compared. The effects of various parameters such as cut-in, rated, cut-out wind speed on the failure rate of power devices are also analyzed based on the proposed model.

• 한국항공우주학회지
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• 제31권10호
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• pp.21-26
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• 2003

본 논문에서는 광섬유 센서를 사용하여 우주환경하에 노출된 그래파이트/에폭시 복합재 적층판의 열팽창계수의 변화를 측정하였다. 열변형률과 온도를 동시에 측정하기 위해서 두개의 FBG 센서를 사용하였다. 또한 열-진공 챔버를 사용하여 고진공, 자외선, 열적 사이클 등의 인자를 가지는 저궤도(LEO) 우주환경을 모사하였다. 예비실험으로써, 본 실험에서 사용되는 온도범위에 대해 FBG 온도센서를 기준온도계로부터 보정하였고 알루미늄 시편에 부착된 FBG 변형률 센서와 변형률 게이지(ESG)의 비교실험을 통해 FBG 변형률 센서의 사용가능성을 검증하였다. 검증된 FBG센서가 삽입된 그래파이트/에폭시 복합재 평판을 모사된 우주환경에 노출하여 일정한 노화간격마다 열팽창계수 변화를 실시간으로 측정하였다. 실험결과 1000 사이클 노화후의 열팽창계수는 노화전에 비해 대체적으로 큰 변화는 없었지만 전 온도구간에서 약간 감소하는 경향을 보였다. 이러한 현상은 가스방출(outgassing), 수분방출, 모재균열 등에 기인한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.