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A Study on Optimized Thermal Analysis Modeling for Thermal Design Verification of a Geostationary Satellite Electronic Equipment

정지궤도위성 전장품의 열설계 검증을 위한 최적 열해석 모델링 연구

  • 전형열 (한국항공우주연구원 통신위성체계그룹) ;
  • 양군호 (한국항공우주연구원 통신위성체계그룹) ;
  • 김정훈 (한국항공우주연구원 통신위성체계그룹)
  • Published : 2005.04.01

Abstract

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

Keywords

References

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