1 |
Choi, S. B., 2004, "Development of Telemetry/Telecommand Process and Time Synchronization via Communication Satellite," R&D Final Report, Korea Aerospace Research Institute
|
2 |
Card-lok Thermal Resistance Data, Calmark Corporation
|
3 |
Wedge-lok Performance Data, APW Ltd
|
4 |
TAS(Thermal Analysis System version 7.0) User's Manual, 2002, Harvard Thermal Inc
|
5 |
Kang, M. Y., Park, J. H., Chang, Y. K. and Oh, H. S., 2001, "A Study on Thermal Modeling Methodology for Satellite Electronic Components," Journal of the Korean Society for Aeronautical and Space Sciences, Vol. 29, No. 7, pp.127-136
|
6 |
Kraus, A. D. and Bar-Cohen, A, 1983, Thermal Analysis and Control for Electronic Equipment, Hemisphere Publishing Corp
|
7 |
http://www.frigprim.com/
|
8 |
Lambert, M. A., Gavenall, I. G. and Fletcher, L. S., 1997, "Experimental Thermal Contact Conductance of Electronic Modules," Journal of Thermophysics and Heat Transfer, Vol. 11, No. 2, pp.146-152
DOI
ScienceOn
|
9 |
Seo, H. S., Shin, C. H., Kim, T. K. and Choi S. W., 2001, "A Study on the Review of Design of Electronic Equipments for Satellite using Thermal & Part Stress Analysis," Journal of the Korean Society for Aeronautical and Space Sciences, Vol. 29, No. 6, pp.105-111
|