Browse > Article

A SATELLITE ELECTRONIC EQUIPMENT THERMAL ANALYSIS USING SEMI-EMPERICAL HEAT DISSIPATION METHOD  

Kim Jung-Hoon (한국항공우주연구원 통신해양기상위성사업단 체계종합그룹)
Jun Hyung-Yoll (한국항공우주연구원 통신해양기상위성사업단 체계종합그룹)
Yang Koon-Ho (한국항공우주연구원 통신해양기상위성사업단 체계종합그룹)
Publication Information
Journal of computational fluids engineering / v.11, no.2, 2006 , pp. 32-39 More about this Journal
Abstract
A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.
Keywords
Thermal Analysis; Heat Dissipation; Thermal Vacuum Test; Satellite; Electronic-Equipment;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Choi, S. B., 2004, "Development of Telemetry/Telecommand Process and Time Synchronization via Communication Satellite," R&D Final Report, Korea Aerospace Research Institute
2 Card-lok Thermal Resistance Data, Calmark Corporation
3 Wedge-lok Performance Data, APW Ltd
4 TAS(Thermal Analysis System version 7.0) User's Manual, 2002, Harvard Thermal Inc
5 Kang, M. Y., Park, J. H., Chang, Y. K. and Oh, H. S., 2001, "A Study on Thermal Modeling Methodology for Satellite Electronic Components," Journal of the Korean Society for Aeronautical and Space Sciences, Vol. 29, No. 7, pp.127-136
6 Kraus, A. D. and Bar-Cohen, A, 1983, Thermal Analysis and Control for Electronic Equipment, Hemisphere Publishing Corp
7 http://www.frigprim.com/
8 Lambert, M. A., Gavenall, I. G. and Fletcher, L. S., 1997, "Experimental Thermal Contact Conductance of Electronic Modules," Journal of Thermophysics and Heat Transfer, Vol. 11, No. 2, pp.146-152   DOI   ScienceOn
9 Seo, H. S., Shin, C. H., Kim, T. K. and Choi S. W., 2001, "A Study on the Review of Design of Electronic Equipments for Satellite using Thermal & Part Stress Analysis," Journal of the Korean Society for Aeronautical and Space Sciences, Vol. 29, No. 6, pp.105-111