• Journal of the Korean Society of Industry Convergence
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• v.21 no.6
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• pp.265-271
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• 2018

DC-DC buck converter is a critical building block in the power management integrated circuit (PMIC) architecture for the portable devices such as cellular phone, personal digital assistance (PDA) because of its power efficiency over a wide range of conversion ratio. To ensure a safe operation, avoid unexpected damages and enhance the reliability of the converter, fully-integrated protection circuits such as over voltage protection (OVP), under voltage lock out (UVLO), startup, and thermal shutdown (TSD) blocks are designed. In this paper, these three fully-integrated protection circuit blocks are proposed for use in the DC-DC buck converter. The buck converter with proposed protection blocks is operated with a switching frequency of 1 MHz in continuous conduction mode (CCM). In order to verify the proposed scheme, the buck converter has been designed using a 180 nm CMOS technology. The UVLO circuit is designed to track the input voltage and turns on/off the buck converter when the input voltage is higher/lower than 2.6 V, respectively. The OVP circuit blocks the buck converter's operation when the input voltage is over 3.3 V, thereby preventing the destruction of the devices inside the controller IC. The TSD circuit shuts down the converter's operation when the temperature is over $85^{\circ}C$. In order to verify the proposed scheme, these protection circuits were firstly verified through the simulation in SPICE. The proposed protection circuits were then fabricated and the measured results showed a good matching with the simulation results.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.320-323
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• 2005

This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

• ETRI Journal
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• v.26 no.6
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• pp.669-672
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• 2004

To improve the operation error caused by the thermal fluctuation of electrons, we propose a novel single-electron pass-transistor logic circuit employing a multiple-tunnel junction (MTJ) scheme and modulate a parameters of an MTJ single-electron tunneling device (SETD) such as the number of tunnel junctions, tunnel resistance, and voltage gain. The operation of a 3-MTJ inverter circuit is simulated at 15 K with parameters $C_g=C_T=C_{clk}=1\;aF,\;R_T=5\;M{\Omega},\;V_{clk}=40\;mV$, and $V_{in}=20\;mV$. Using the SETD/MOSFET hybrid circuit, the charge state output of the proposed MTJ-SETD logic is successfully translated to the voltage state logic.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.786-789
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• 2002

The behaviour of contactors protected by arcs under short-circuit currents is analysed using a simple model to represent the electric circuit and the contactor. In most cases, the protection of contactors against short-circuit currents is entrusted to fuses. Fuses are suitable for preventing excessive damage to the contactor, or parts of the contactor, under short-circuit conditions. In particular, they are capable of limiting the thermal and electrodynamic stresses which can lead to arcing or welding together of the contacts of a contactor. This paper is the Dynamic Motion Analysis of a Moving Contact by Electromagnetic Repulsion Force in Molded Case Circuit Breaker(MCCB)

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.3
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• pp.198-206
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• 2011

This paper presents a new programmable compensation circuit (PCC) for a System-on-Chip (SoC). The PCC is integrated with $0.18-{\mu}m$ BiCMOS SiGe technology. It consists of RF Design-for-Testability (DFT) circuit, Resistor Array Bank (RAB) and digital signal processor (DSP). To verify performance of the PCC we built a 5-GHz low noise amplifier (LNA) with an on-chip RAB using the same technology. Proposed circuit helps it to provide DC output voltages, hence, making the RF system chain automatic. It automatically adjusts performance of an LNA with the processor in the SoC when it goes out of the normal range of operation. The PCC also compensates abnormal operation due to the unusual PVT (Process, Voltage and Thermal) variations in RF circuits.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.695-698
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• 2008

Self-blast circuit breakers utilize the energy dissipated by the arc itself to create the required conditions for arc quenching during the current zero. During the arcing period, high pressure, temperature and radiation of the arc could burn in pure SF6 gas and PTFE nozzle. Ablated nozzle shape and $SF_6$-PTFE mixture vapor affect the performance of an self-blast circuit breaker. After a number of tests, nozzle in circuit breaker is disassembled, a section of ablated nozzle is investigated precisely. Using computational fluid dynamics, the conservation equation for the gas and temperature, velocity and electric fields within breaker is solved. Before applying a section model, developed program is verified with experimental data. Performance of ablated nozzle shape is compared with original model through analysis program.

• Journal of Electrical Engineering and Technology
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• v.13 no.2
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• pp.881-885
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• 2018

In order to develop a gas circuit breaker (GCB), the breaking performance of the short line fault (SLF) should be prioritized over that of the breaker terminal fault (BTF). In brief, it is necessary to evaluate the thermal characteristics of the insulating gas that is filled in a GCB. In the process of developing a GCB, many companies use the simplified synthetic testing facility (SSTF).In order to evaluate the SLF breaking performance of a GCB with a long minimum arcing time, a modifications to the conventional SSTF was proposed. In this study, we developed the SSTF with a modified transient recovery voltage circuit. The performance of the newly developed SSTF was verified by an $L_{90}$ breaking performance test on a rating combination of 170 kV, 50 kA, and 60 Hz.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.2
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• pp.89-92
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• 2010

A bolometer sensor used in an infrared thermal imaging system has many advantages on the process because it does not need a separate cooling system and its manufacturing is easy. However the sensitivity of the bolometer is low and the fixed pattern noise(FPN) is large, because the bolometer sensor is made by micro electro mechanical systems (MEMS). These problems can be fixed-by using the high performance readout integrated circuit(ROIC) with noise reduction techniques. In this paper, we propose differential delta sampling circuit to remove the mismatch noise of ROIC itself, the FPN of the bolometer. And for reduction of FPN noise, the reference signal compensation circuit which compensate the reference signal by using on-resistance of MOS transistor was proposed.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.