• Design & Manufacturing
• /
• v.12 no.1
• /
• pp.18-25
• /
• 2018

Both injection and injection molding dies have evolved into advanced technology. Product quality is also evolving day after day. Therefore, the conditions of the injection mold and the injection conditions are becoming important. In order to improve the quality of the product, the Hardware part of the mold has developed as an advanced technology, and the Software part has also developed with advanced technology. This study deals with the cooling part, which is part of the hardware. In addition to fluid cooling, which is commonly used in the industry, by using gas cooling identify the phenomena that appear on the surface of the product and the critical point strain of the product to find the optimal cooling. Electronic parts and automobile parts whose surface condition is important, the cooling process is important to such a degree that they are divided with good products and defective products according to the cooling process at the time of injection. By controlling this important cooling and reducing the injection time with additional cooling, the product quality can be increased to the highest production efficiency. In addition, high efficiency can be achieved without additional investment costs. This study was conducted to apply these various advantages in the field.

• 제어로봇시스템학회:학술대회논문집
• /
• 2004.08a
• /
• pp.1017-1022
• /
• 2004

This paper presents the conversion speed drive of the cooling tower fans from constant to variable speed. The speed of fan is adjusted using variable speed drives. Since the ambient temperature of cooling tower is varied seasonally, an economic evaluation was performed to determine the potential annual savings. The performances of the proposed technique were observed using cooling tower fans of chemical plant in Thailand as an illustrative case study. The experimental results demonstrating the energy savings fork cooling process and some economic benefits are obtained.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.3
• /
• pp.1-6
• /
• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.4
• /
• pp.51-55
• /
• 2018

As the OLED industry develops, display equipment is becoming larger. As a result, the stage required for display equipment is getting bigger. This enlargement led to increase in OLED production and industrial development. However, due to the large scale of the stage, other problems due to overheating and overheating caused by heavy load on the linear motor, which is mainly used in the stage, must be solved. In this study, a linear motor equipped with a cooling channel is modeled and the three - dimensional heat conduction flow analysis for this model is simulated using Fluent to analyze the cooling efficiency and cooling efficiency according to the cooling water flow rate. As a result, the cooling channel was effective and the cooling effect and efficiency were the best when the flow rate was about 5 ~ 10 L./min. In addition, the cooling effect is increased when the flow rate is increased, but the efficiency is significantly lowered when the flow rate is more than the predetermined value.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.3
• /
• pp.100-103
• /
• 2018

Due to the plasma applied from the outside, which acts as an etchant during the etching process, considerable heat is transferred to the wafer and a separate cooling process is performed to effectively remove the heat after the process. In this case, a direct cooling method using a refrigerant is suitable for cooling through effective heat exchange. The direct cooling method using the refrigerant using the latent heat exchange is superior to the cooling method using the sensible heat exchange. Therefore, in this paper, AMESim is used to design a direct refrigerant cooling system using latent heat exchange simulator was built.The constructed simulator is reliable compared with the actual experimental results. It is expected that this simulator will help to design and search for optimal process conditions.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.16 no.3
• /
• pp.87-93
• /
• 2008

The $CO_2$ air conditioning system installed in fuel cell vehicles could be used either for stack cooling or for cabin cooling, and thus was used for the stack cooling when additional stack heat release was required over a fixed radiator capacity for high power generation. This study investigated the performance of the stack cooling system using $CO_2$ air conditioner at various operating conditions. Also, the heat releasing effectiveness and mutual interference were analyzed for the stack cooling system using an air conditioner and compared with the conventional radiator cooling system with/without cabin cooling. The heat release of the stack cooling system with the aid of $CO_2$ air conditioner increased up to 36% more than that of the conventional radiator cooling system with cabin cooling. Furthermore, the heat release of the stack cooling system using $CO_2$ air conditioner increased more by 7% than that of the conventional radiator cooling system without cabin cooling.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.13 no.2
• /
• pp.124-130
• /
• 2014

In a mass manufacturing system of optical fibers, the sufficient cooling of glass fibers freshly drawn from a draw furnace is essential, asinadequately cooled glass fibers can lead to poor resin coating on the fiber surface and possibly fiber breakage during the process. In order to improve fiber cooling at a high drawing speed, it is common to use a helium injection into a glass fiber cooling unit in spite of the high cost of the helium supply. The present numerical analysis carried out three-dimensional thermo-fluid computations of the cooling gas flow and heat transfer on moving glass fiber to determine the cooling performance of glass fiber cooling depending on the method of helium injection. The results showed that afront injection of helium is most effective compared to a uniform or rear injection for reducing air entrainment into the unit and thus cooling the glass fibers at a high fiber drawing speed. However, above a certain amount of injected helium, there was no more increase of the cooling effect regardless of the helium injection method.

• Design & Manufacturing
• /
• v.1 no.1
• /
• pp.27-32
• /
• 2007

In the optical application demand for high quality lens is increasing. Plastics lenses are demanded more than glass lenses for large size lenses as well as micro-size lenses. It is difficult to apply typical straight cooling channels of injection mold to lens molding due to its non-uniform temperature distribution. In this study, we manufactured molds for plastic lenses with the conventional cooling channels and conformal cooling channels produced by the DMLS process. We evaluated cooling performance for the 2 molds by injection molding experiment. Also, uniformity of the temperature distribution was tested by infrared camera and temperature monitoring. We confirmed that the cooling performance and temperature uniformity with the conformal cooling channels is much improved from the ones with the conventional. The cooling time with the conformal cooling channels was reduced 30% compared with the conventional cooling channels.

• Transactions of Materials Processing
• /
• v.16 no.7
• /
• pp.549-554
• /
• 2007

The objective of this paper is to investigate into the fabrication technology of cores for the injection mould with three-dimensional conformal cooling channels to reduce the cooling time. The location of the conformal cooling channels has been determined through the injection molding analysis. The mould has been manufactured from a hybrid rapid tooling technology, which is combined a direct metal rapid tooling with a machining process. Several injection molding experiments have been performed to examine the productivity and the validity of the designed mould. From the results of the experiments, it has been shown that the proposed mould can mold a final product within a cooling time of 3 seconds and a cycle time of 21 seconds, respectively.

• Nuclear Engineering and Technology
• /
• v.56 no.1
• /
• pp.275-282
• /
• 2024

Lead bismuth eutectic (LBE) is used as coolant for MicroURANUS, a small marine nuclear power plant, and this coolant is transported in the plant by an electromagnetic pump. Given the considerable heat generated by the electromagnetic pump, the cooling of the pump is essential. This study compared air cooling and water-cooling methods and found that the maximum temperatures during air and water cooling were 640 K and 372 K, respectively. These findings were utilized to design an electromagnetic pump with water-cooling. The maximum temperature of the pump was lower than the boiling point of water; thus, the pump did not require a separate pressurization. Consequently, the resistance problem of the coil and the deformation problem of the material caused by generated heat can be solved through water-cooling.