• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.114-120
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• 2010

Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as $SF_6$, $Cl_2$, and $O_2$. The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.48.1-48.1
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• 2010

Mono-crystalline silicon solar cell is fabricated by using alkali metals. These alkali metal, used in wet etching process, must be removed for the high efficiency solar cell. As wet etching process has been adapted due to its low cost. But lots of alkali metals like potassium remains on the silicon surface and acts as impurities. To remove these alkali metals many of cleaning process have to be applied when solar cell manufacturing process. In terms of alkali metal removal, modified etchant solution is required for concise cleaning process. In this paper ethylenediamine was used and proposed for the substituion of postassium hydroxide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.19-20
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• 2006

Two methods that can reduce reflectance in solar cells are surface texturing and anti-reflection coating. Wet chemical etching is a typical method that surface texturing of multi-crystalline silicon. Wet chemical etching methods are the acid texturization of saw damage on the surface of multi-crystalline silicon or double-step chemical etching after KOH saw damage removal too. These methods of surface texturing are realized by chemical etching in acid solutions HF-$HNO_3$-$H_2O$. In this solutions we can reduce reflectance spectra by simple process etching of multi-crystalline silicon surface. We have obtained reflectance of 27.19% m 400~1100nm from acidic chemical etching after KOH saw damage removal. This result is about 7% less than just saw damage removal substrate. The surface morphology observed by microscope and scanning electron microscopy (SEM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.133-133
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• 2010

We studied the thermal and electric effect of 2D and 3D p-n photovoltaic diode structures with and without surface texturing. By analyzing the numerical simulation results of I-V characteristics and lattice temperature distributions, we systematically studied the effect of different texturing structures and different doping concentration on the characteristics of the silicon p-n photovoltaic devices. The, efficiency of the device with the surface texturing shows more than ~ 2% enhancement compared to the reference devices without texturing. The tendency of the efficiency of doping concentration has been studied with boron doping of $10^{14}{\sim}10^{17}cm^{-3}$ and phosphorus doping of $10^{15}cm^{-3}$. In addition to that, the study of changing phosphorus doping of $10^{15}{\sim}10^{18}cm^{-3}$ with boron doping of $10^{14}cm^{-3}$ has been examined. It has been shown that the texturing structure not only improves the light trapping but also plays an important role in the heat radiation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.5
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• pp.38-44
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• 2020

Surface texturing of micro-dimples has been used in many manufacturing industries to reduce friction between two sliding contacted surfaces. Surface texturing decreases the frictional force owing to minimizing of the sliding contact area. In this paper, micro-dimples have been fabricated on an Al6061-T6 surface using a two-frequency elliptical vibration texturing (TFEVT) method. A high-frequency of 18 kHz and low-frequency of 250 Hz were applied to an elliptically-vibrated tool holder. The Stribeck curve was plotted to analyze the friction coefficient trends. Furthermore, the representative wetting index, such as the water contact angle (WCA), was measured by considering the friction coefficient. WCA is associated with micro-dimple density and associated parameters. Consequently, the dimpled surfaces with a low friction coefficient exhibited a relatively high WCA in the feed direction. According to the Stribeck curve, the dimpled surfaces demonstrate superior friction performance for mixed-film lubrication compared to the non-textured surface.

• Fashion & Textile Research Journal
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• v.12 no.4
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• pp.500-507
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• 2010

In this study, physical properties were studied by using latent stretching yarn in order to develop the texturing yarn technique for super bulky yarn, which is better in bulkiness and handle than natural wool and also adds property of synthetic fiber to natural wool. In order to obtain textured conditions by analysing basic properties for manufacturing DTY yarn with super bulky property, DTY 50d/12 after spinning latent yarn spined POY 80d/12 was obtained under the two conditions of (i) false twist(T/M) level 3 in DTY texturing and (ii) draw ratio level 4 in draw texturing. For DTY texturing yarn, Elongation rate increased as the heat treatment time and temperatures increased. In addition, shrinkage became higher as false twist was higher, so that elongation rate became lower. When annealing became longer in time and higher in temperature, initial modulus increased. In addition, as the count of false twist increased, the initial modulus showed higher values. For draw texturing yarn, under the conditions of heat temperature 180 and heating time 30 minutes, shrinkage rate in draw ratio 1.55 and 1.6 draw ratio was 7%, and that in 1.65 and 1.7 draw ratio was 8.5%. High draw ratio samples' tenacity was much influenced by heating time and temperature, but low draw ratio samples' tenacity was influenced not by treated time, but by treated temperature.

• Current Photovoltaic Research
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• v.6 no.3
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• pp.86-90
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• 2018

To generate more current in crystalline silicon solar cells, surface texturing is adopted by reducing the surface reflection. Conventionally, random pyramid texturing by the wet chemical process is used for surface texturing in crystalline silicon solar cell. To achieve higher efficiency of solar cells, well ordered inverted pyramid texturing was introduced. Although its complicated process, superior properties such as lower reflectance and recombination velocity can be achieved by optimizing the process. In this study, we investigated optical and passivation properties of inverted pyramid texture. Lifetime, implied-Voc and reflectance were measured with different width and size of the texture. Also, effects of chemical rounding at the valley of the pyramid were observed.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.189-194
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• 2011

Si-cell was prepared with various types owing to the etching times textured by the KOH etching solution. The pn junction for solar cell was prepared on p-type Si wafer by the furnace using the $POCl_3$ and oxygen mixed precursor, and the metalization was done using by the Al back electrode and Ag front electrode. Textured Si surface was etched by the pyramid formation. The efficiency and the fill factor was increased in the Si-cell with a large size of pyramids, because of the series resistances decrease depending on the increasing of the photon absorbance. Increasing of the absorbance occurred the induction of the short current and open voltage, and then the efficiency was increased.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.5
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• pp.69-76
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• 1995

This paper describes characteristics of EDT(Electro Discharge Texturing) and that the strip surface has influence on the paintability. The pulse mode and the capacitor mode of recently developed EDT method were investigated about the peak shape and the roughness of strip surface. And EDT method compared the above-mentioned contents with the SBT(Shot Blast Texturing) method. The peak count of the pulse mode is more than that of the capacitor mode. But the lower roughness below the Ra 3.2 .mu. m of the strip surface, the texturing time of the pulse mode is longer than the capacitor mode. In SBT method, the peak shape is similar to capacitor mode. But the EDT roll has more uniformity than the SBT roll and has more peak count than that of SBT roll. Therefore, in the painted steel sheet, EDT roll gives better surface of clarity image than the SBT roll.

• Textile Coloration and Finishing
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• v.12 no.2
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• pp.79-88
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• 2000

Draw textured yarns have many differences with yarn quality as well as wearing, due to the bulkiness, thermal and physical properties according to the false twist texturing system. In order to improve such property, many studies have been accomplished for developing good textured yarns and their fabrics, but these have been essentially obtained by experimental data or mathematical analysis. This study surveyed various properties of DTY produced by false twist texturing system, namely pin and crossed-belt false twist insertion systems. And 6 yarn specimens of 2 group(pin twisting type, belt twisting type) were measured and analysed.