• Title/Summary/Keyword: testability

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Specification-based Analog and Mixed-signal Circuits Test with Minimal Built-In Hardware Overhead (내장 하드웨어 오버헤드를 최소화한 Specification 기반의 아날로그 및 혼합신호 회로 테스트)

  • Lee, Jae-Min
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.633-634
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    • 2006
  • A new specification-based analog and mixed-signal test technique using high performance current sensors is proposed. The proposed technique using current sensors built in external ATE has little hardware overhead in circuit under test and high testability without time consuming operation of test point placement algorithm.

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The design of test sensitizer for high testability of hook classes in an object-oriented framework (객체지향 프레임웍 후크 클래스의 시험성 강화를 위한 테스트 센서타이 저 설계)

  • 정문호;전태웅
    • Proceedings of the Korean Information Science Society Conference
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    • 2001.10a
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    • pp.475-477
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    • 2001
  • 프레임웍의 결함들을 효과적으로 발견하기 위해서는 테스트 실행 과정 중에서 결함들이 민감하게 감응하여 결함으로 인한 오동작의 흔적이 남겨질 수 있어야 한다 그런데 프레임웍은 개조, 합성된 확장 부위에 결합되는 후크 클래스(hook class)들의 시험에 대한 제어와 관찰이 어려운 성실을 가지고 있다. 이를 해결하기 위해 프레임웍의 정상동작 여부를 판단하는데 단서가 되는 자료(clue data)를 포착하여 외부로 드러내는 기능을 수행하는 테스트 센서타이저를 설계하였다.

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An Efficient Non-Scan DFT Scheme for Controller Circuits (제어 회로를 위한 효율적인 비주사 DFT 기법)

  • Shim, Jae-Hun;Kim, Moon-Joon;Park, Jae-Heung;Yang, Sun-Woong;Chang, Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.11
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    • pp.54-61
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    • 2003
  • In this paper, an efficient non-scan design-for-testability (DFT) method for controller circuits is proposed. The proposed method always guarantees a short test pattern generation time and complete fault efficiency. It has a lower area overhead than full-scan and other non-scan DFT methods and enables to apply test patterns at-speed. The proposed method also shortens the test application time through a test pattern re-ordering procedure. The efficiency of the proposed method is demonstrated using well known MCNC'91 FSM benchmark circuits.

Embedding Built-in Tests in Hot Spots of an Object-Oriented Framework (객체지향 프레임웍의 Hot Spot에 Built-in Tests를 내장하는 방법)

  • Shin, Dong-Ik;Jeon, Tae-Woong;Lee, Syung-Young
    • Journal of KIISE:Software and Applications
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    • v.29 no.1_2
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    • pp.65-79
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    • 2002
  • Object-oriented frameworks need to be systematically tested because they are reused in developing many applications software. They also need additional testing whenever they are extended for reuse. Frameworks, however, have properties that make it difficult to control and observe the testing of the parts that were modified and extended. In this paper, we describe the method of embedding test components as BIT(Built-In Test) into the framework's hot spots in order to efficiently detect the faults through testing that occurred while implementing application programs by modifying and extending the framework. The test components embedded into a framework make it easy to control and observe testing the framework, and thereby improve the testability of frameworks. Test components designed by the method proposed in this paper can be dynamically attached and detached to/from hot spots of a framework without changes or intervention to the framework code.

A Programmable Compensation Circuit for System-on-Chip Application

  • Choi, Woo-Chang;Ryu, Jee-Youl
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.11 no.3
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    • pp.198-206
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    • 2011
  • This paper presents a new programmable compensation circuit (PCC) for a System-on-Chip (SoC). The PCC is integrated with $0.18-{\mu}m$ BiCMOS SiGe technology. It consists of RF Design-for-Testability (DFT) circuit, Resistor Array Bank (RAB) and digital signal processor (DSP). To verify performance of the PCC we built a 5-GHz low noise amplifier (LNA) with an on-chip RAB using the same technology. Proposed circuit helps it to provide DC output voltages, hence, making the RF system chain automatic. It automatically adjusts performance of an LNA with the processor in the SoC when it goes out of the normal range of operation. The PCC also compensates abnormal operation due to the unusual PVT (Process, Voltage and Thermal) variations in RF circuits.

Evaluation of fault coverage of digital circutis using initializability of flipflops (플립플롭의 초기화 가능성을 고려한 디지탈 회로에 대한 고장 검출율의 평가 기법)

  • 민형복;김신택;이재훈
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.35C no.4
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    • pp.11-20
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    • 1998
  • Fault simulatior has been used to compute exact fault coverages of test vectors for digial circuits. But it is time consuming because execution time is proportional to square of circuit size. Recently, several algorithms for testability analysis have been published to cope with these problems. COP is very fast and accurate but cannot be used for sequential circuits, while STAFAN can be used for sequential circuits but needs vast amount of execution time due to good circuit simulation. We proposed EXTASEC which gave fast and accurate fault coverage. But it shows noticeable errors for a few sequential circuits. In this paper, it is shown that the inaccuracy is due to uninitializble flipflops, and we propose ITEM to improve the EXTASEC algorithm. ITEM is an improved evaluation method of fault coverage by analysis of backward lines and uninitializable flipflops. It is expected to perform efficiently for very large circuits where execution time is critical.

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A LSI/VLSI Logic Design Structure for Testability and its Application to Programmable Logic Array Design (Test 용역성을 고려한 LSI/VLSI 논리설계방식과 Programmable Logic Array에의 응용)

  • Han, Seok-Bung;Jo, Sang-Bok;Im, In-Chil
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.21 no.3
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    • pp.26-33
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    • 1984
  • This paper proposes a new LSI/VLSI logic design structure which improves shift register latches in conventional LSSD. Test patterns are easily generated and fault coverage is enhanced by using the design structure. The new parallel shift register latch can be applied to the design of easily testable PLA's. In this case, the number of test patterns is decreased and decoders which are added to the feedback inputs in conventional PLA's using LSSD are not necessary.

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Interconnect Delay Fault Test on Boards and SoCs with Multiple Clock Domains

  • Yi, Hyun-Bean;Song, Jae-Hoon;Park, Sung-Ju
    • ETRI Journal
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    • v.30 no.3
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    • pp.403-411
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    • 2008
  • This paper introduces an interconnect delay fault test (IDFT) controller on boards and system-on-chips (SoCs) with IEEE 1149.1 and IEEE 1500 wrappers. By capturing the transition signals launched during one system clock, interconnect delay faults operated by different system clocks can be simultaneously tested with our technique. The proposed IDFT technique does not require any modification on boundary scan cells. Instead, a small number of logic gates needs to be plugged around the test access port controller. The IDFT controller is compatible with the IEEE 1149.1 and IEEE 1500 standards. The superiority of our approach is verified by implementation of the controller with benchmark SoCs with IEEE 1500 wrapped cores.

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Test Generation Algorithm for CMOS Circuits considering Time - skews (Time-stews를 고려한 CMOS회로의 테스트 생성 알고리즘)

  • Lee, C.W.;Han, S.B.;Kim, Y.H.;Jung, J.M.;Sun, S.K.;Lim, I.C.
    • Proceedings of the KIEE Conference
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    • 1987.07b
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    • pp.1551-1555
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    • 1987
  • This paper proposes a new test generation algorithm to detect stuck-open faults regardless of tine-skews in CMOS circuits. For testing for stuck-open faults regardless of time-skews, in this method, Hamming distance between the initialization pattern and the test pattern is made 1 by considering the responses of the internal gates. Therefore, procedure of the algorithm is simpler than that of the conventional methods because the line justification is unnecessary. Also, this method needs no extra hardware for testability and can be applied to random CMOS circuits in addition to two-level NAND - NAND CMOS circuits.

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Scan Design Techniques for Chip and Board Level Testability (디지탈 IC 및 보드의 시험을 위한 스캔 설계기술)

  • 민형복
    • The Magazine of the IEIE
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    • v.22 no.12
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    • pp.93-104
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    • 1995
  • 디지탈 회로를 구현한 칩 및 보드의 시험 비용을 줄이기 위하여 사용되는 스캔 설계 기술 동향에 대하여 기술하였다. 스캔 설계 기술은 칩 수준에서 먼저 적용되기 시작하였다. 회로의 모든 플립플롭을 스캔할 수 있도록 하는 완전 스캔이 먼저 개발되었고, 최근에는 플립플롭의 일부분만 스캔할 수 있도록 하는 부분 스캔 기술이 활발하게 논의되고 있다. 한편 보드의 시험에 있어서도 보드에 실장되는 칩의 밀도가 증가되고, 표면 실장 기술이 일반화됨에 따라 종래의 시험 기술로는 충분한 시험을 거치는 것이 불가능하게 되었다. 따라서, 칩에 적용되던 기법과 유사한 스캔 설계 기술이 적용되기 시작하였다. 이를 경계 스캔(Boundary Scan)이라고 하는데, 이 기술은 80년대 후반부터 본격적으로 논의되기 시작하였다. 1990년에는 이 기술과 관련된 IEEE의 표준이 제정되어 더욱 많이 적용되는 추세에 있다. 이 논문에서는 이러한 칩 및 보드의 시험을 쉽게하기 위한 스캔 설계 기법의 배경, 발전 과정 및 기술의 내용을 소개한다.

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