• Title/Summary/Keyword: surface layer

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Study on the Analysis of Wear Phenomena of Ion-Nitrided Steel (이온질화 처리강의 마모현상 분석에 관한 연구)

  • Cho, Kyu-Sik
    • Tribology and Lubricants
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    • v.13 no.1
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    • pp.42-52
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    • 1997
  • This paper deals with wear characteristics of ion-nitrided metal theoretically and experimentally in order to analysis of wear phenomena. Wear tests show that compound layer of ion-nitrided metal reduces wear rate when the applied wear load is mall. However, as th load becomes large, the existence of compound layer tends to increase wear rate. The residual stress at the surface of ion-nitrided metal is measured, and the internal stress distribution is calculated when the normal and tangential forces are applied to the surface of metal. Compressive residual stress is largeest at the compound layer, and decreases as the depth from the surface increases. Calculation shows that the maximum stress exists at a certain depth from the surface when normal and tangential force are applied, and that the larger the wear load is the deeper the location of maximum stress becomes. In the analysis, it is found that under small applied wear load the critical depth, where voids and cracks may be created and propagated, is located at the compound layer, as the adhesive wear, where hardness is an important factor, is created the existence of compound layer reduces the amount of wear. When the load becomes large the critical depth is located below the compound layer, and delamination, which may be explained by surface deformation, crack nucleation and propagation, is created, and the existence of compound layer increases wear rate.

Effects of Surface Roughness and Thermal Treatment of Buffer Layer on the Quality of GaN Epitaxial Layers (Buffer layer의 표면 거칠기와 열처리조건이 GaN 에픽층의 품질에 미치는 영향)

  • 유충현;심형관;강문성
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.7
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    • pp.564-569
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    • 2002
  • Heteroepitaxial GaN films were grown on sapphire substrates in order to study the effects of the buffer layer's surface roughness and thermal treatment on the epitaxial layer's quality. For this, GaN buffer layers were grown at $550^{\circ}C$ with various TMGa flow rates and durations of growth, and annealed at $1010^{\circ}C$ for 3 min after the temperature was raised by 23 ~ $92^{\circ}C/min$, and then GaN epitaxial layers were grown at $1000^{\circ}C$. It has been found that the buffer layer's surface roughness and the thermal treatment condition are critical factors on the quality of the epitaxial layer. When a buffer layer was frown with a TMGa flow rate of $24\mu mole/min$ for 30 sec, the surface roughness of the buffer lather was minimum and when the thermal ramping rate was $30.6^{\circ}C/min$ on this layer, the successively grown epitaxial layer's crystalline and optical qualities were optimized with a specular morphology. The minimum full width at half maximum(FWHM) of GaN(0002) x-ray diffraction peak and that of near-band-edge(NBE) peak from a room temperature photoluminescence (PL) were 5 arcmin and 9 nm, respectively.

Formation of Thicker Hard Alloy Layer on Surface of Aluminum Alloy by PTA Overlaying with Metal Powder (알루미늄 합금의 표면경화)

  • Lee, Young-Ho
    • Proceedings of the KWS Conference
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    • 1996.10a
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    • pp.3-15
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    • 1996
  • The formation of a thicker hard alloyed layer have been investigated on the surface of aluminum cast alloy (AC2B) by PTA overlaying process with Cr, Cu and Ni motel powders under the condition of overlaying current 125-200A. overlaying speed 150 mm/min and different powder feeding rate 5-20 g/min. In addition the characteristics of hardening and wear resistance of alloyed layer here been examined in relation to the microstructure of alloyed layer. Main results obtained were summarized as follows: 1) There was an optimum overlaying condition to get a good alloyed layer with smooth surface. This good layer became easy to be formed as increasing overlaying current and decreasing powder feeding rate under a constant overlaying speed. 2) Cu powder was the most superior one in metal powders used due to a wide optimum overlaying condition range, uniform hardness distribution of Hv250-350, good oar resistance and freedom from cracking in alloyed layer with fine hyper-eutectic structure. 3) On the contrary, irregular hardness distribution was usually obtained in Cr ar Ni alloyed layers of which hardness was increased as Cr or Ni contents and reached to maximum hardness of about Hv400-850 at about 60wt%cr or 40wt%Ni in alloyed layer. 4) Cracking occurred in Cr or Ni alloyed layers with higher hardness than Hv250-300 at mere than 20-25wt% of Cr or Ni contents in alloyed layer. Porosity was observed in all alloyed layers but decreased by usage of spherical powder with smooth surface.

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Practical Silicon-Surface-Protection Method using Metal Layer

  • Yi, Kyungsuk;Park, Minsu;Kim, Seungjoo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.4
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    • pp.470-480
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    • 2016
  • The reversal of a silicon chip to find out its security structure is common and possible at the present time. Thanks to reversing, it is possible to use a probing attack to obtain useful information such as personal information or a cryptographic key. For this reason, security-related blocks such as DES (Data Encryption Standard), AES (Advanced Encryption Standard), and RSA (Rivest Shamir Adleman) engines should be located in the lower layer of the chip to guard against a probing attack; in this regard, the addition of a silicon-surface-protection layer onto the chip surface is a crucial protective measure. But, for manufacturers, the implementation of an additional silicon layer is burdensome, because the addition of just one layer to a chip significantly increases the overall production cost; furthermore, the chip size is increased due to the bulk of the secure logic part and routing area of the silicon protection layer. To resolve this issue, this paper proposes a practical silicon-surface-protection method using a metal layer that increases the security level of the chip while minimizing its size and cost. The proposed method uses a shift register for the alternation and variation of the metal-layer data, and the inter-connection area is removed to minimize the size and cost of the chip in a more extensive manner than related methods.

Magnetic field distribution in steel objects with different properties of hardened layer

  • Byzov, A.V.;Ksenofontov, D.G.;Kostin, V.N.;Vasilenko, O.N.
    • Advances in Computational Design
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    • v.7 no.1
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    • pp.57-68
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    • 2022
  • A simulation study of the distribution of magnetic flux induced by a U-shaped electromagnet into a two-layer massive object with variations in the depth and properties of the surface layer has been carried out. It has been established that the hardened surface layer "pushes" the magnetic flux into the bulk of the magnetized object and the magnetic flux penetration depth monotonically increases with increasing thickness of the hardened layer. A change in the thickness and magnetic properties of the surface layer leads to a redistribution of magnetic fluxes passing between the poles of the electromagnet along with the layer and the bulk of the steel object. In this case, the change in the layer thickness significantly affects the magnitude of the tangential component of the field on the surface of the object in the interpolar space, and the change in the properties of the layer affects the magnitude of the magnetic flux in the magnetic "transducer-object" circuit. This difference in magnetic parameters can be used for selective testing of the surface hardening quality. It has been shown that the hardened layer pushes the magnetic flux into the depth of the magnetized object. The nominal depth of penetration of the flow monotonically increases with an increase in the thickness of the hardened layer.

Effect of Changes in Condition of Ammonia Gas Addition on the Surface Layer Microstructure and Porosity during Austenitic Nitriding of Low Carbon Steels (저 탄소강의 오스테나이트 질화 시 암모니아 가스첨가 조건변화가 표면층 조직 및 기공변화에 미치는 영향)

  • Lee, Jewon;Roh, Y.S.;Sung, J.H.;Lim, S.G.
    • Journal of the Korean Society for Heat Treatment
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    • v.32 no.5
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    • pp.201-211
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    • 2019
  • Low carbon steel (S20C steel) and SPCC steel sheet have been austenitic nitrided at $700^{\circ}C$ in a closed pit type furnace by changing the flow rate of ammonia gas and heat treating time. When the flow rate of ammonia gas was low, the concentration of residual ammonia appeared low and the hardness value of transformed surface layer was high. The depth of the surface layer, however, was shallow. With increasing the concentration of residual ammonia by raising up the ammonia gas flow, both the depth of the surface layer and the pore depth increased, while the maximum hardness of the surface layer decreased. By introducing a large amount of ammonia gas in a short time, a deep surface layer with minimal pores on the outermost surface was obtained. In this experiment, while maintaining 10~12% of residual ammonia, the flow rate of inlet ammonia gas, 7 liter/min, was introduced at $700^{\circ}C$ for 1 hour. In this condition, the thickness of the surface layer without pores appeared about $60{\mu}m$ in S20C steel and $30{\mu}m$ in SPCC steel plate. Injecting additional methane gas (carburizing gas) to this condition played a deteriorating effect due to promoting the formation of vertical pores in the surface layer. For $1^{st}$ transformed surface layer for S20C steel, maintaining 10~12% residual ammonia condition via austenitic nitriding process resulted in ${\varepsilon}$ phase with relatively high nitrogen concentration (just below 4.23 wt.%N) among the mixed phases of ${\varepsilon}+{\gamma}$. The ${\varepsilon}$ phase was formed a specific orientation perpendicular to the surface. For $2^{nd}$ transformed layer for S20C steel, ${\gamma}$ phase was rather dominant (just above 2.63 wt.%N). For SPCC steel sheet, there appeared three phases, ${\gamma}$, ${\alpha}(M)$ and weak ${\varepsilon}$ phase. The nitrogen concentration would be approximately 2.6 wt.% in these phases condition.

FORMATION OF IRON SULFIDE BY PLASMA-NITRIDING USING SUBSIDIARY CATHODE

  • Hong, Sung-Pill;Urao, Ryoichi;Takeuchi, Manabu;Kojima, Yoshitaka
    • Journal of the Korean institute of surface engineering
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    • v.29 no.6
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    • pp.615-620
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    • 1996
  • Chromium-Molybdenum steel was plasma-nitrided at 823 K for 10.8 ks in an atmosphere of 30% $N_2$-70% $H_2$ gas under 665 Pa without and with a subsidiary cathode of $MoS_2$ to compare ion-nitriding and plasma-sulfnitriding using subsidiary cathode. When the steel was ion-nitrided without $MoS_2$, iron nitride layer of 4$\mu\textrm{m}$ and nitrogen diffusion layer of 400mm were formed on the steel. A compound layer of 15$\mu\textrm{m}$ and nitrogen diffusion layer of 400$\mu\textrm{m}$ were formed on the surface of the steel plasma-sulfnitrided with subsidiary cathode of $MoS_2$. The compound layer consisted of FeS containing Mo and iron nitrides. The nitrides of $\varepsilon$-$Fe_2$, $_3N$ and $\gamma$-$Fe_4N$ formed under the FeS. The thicker compound layer was formed by plasma-sulfnitriding than ion-nitriding. In plasma-sulfnitriding, the surface hardness was about 730 Hv. The surface hardness of the steel plasma-sulfnitrided with $MoS_2$ was lower than that of ion-nitrided without $MoS_2$. This may be due to the soft FeS layer formed on the surface of the plasma-sulfnitrided steel.

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Transmission Line Analysis of Accumulation Layer in IEGT

  • Moon, Jin-Woo;Chung, Sang-Koo
    • Journal of Electrical Engineering and Technology
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    • v.6 no.6
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    • pp.824-828
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    • 2011
  • Transmission line analysis of the surface a cumulation layer in injection-enhanced gate transistor (IEGT) is presented for the first time, based on per-unit-length resistance and conductance of the surface layer beneath the gate of IEGT. Lateral electric field on the accumulation layer surface, as well as the electron current injected into the accumulation layer, is governed by the well-known wave equation, and decreases as an exponential function of the lateral distance from the cathode. Unit-length resistance and conductance of the layer are expressed in terms of the device parameters and the applied gate voltage. Results obtained from the experiments are consistent with the numerical simulations.

Sensitivity Evaluation of Wind Fields in Surface Layer by WRF-PBL and LSM Parameterizations (WRF 모델을 이용한 지표층 바람장의 대기경계층 모수화와 지면모델 민감도 평가)

  • Seo, Beom-Keun;Byon, Jae-Young;Choi, Young-Jean
    • Atmosphere
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    • v.20 no.3
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    • pp.319-332
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    • 2010
  • Sensitivity experiments of WRF model using different planetary boundary layer (PBL) and land surface model (LSM) parameterizations are evaluated for prediction of wind fields within the surface layer. The experiments were performed with three PBL schemes (YSU, Pleim, MYJ) in combination with three land surface models (Noah, RUC, Pleim). The WRF model was conducted on a nested grid from 27-km to 1-km horizontal resolution. The simulations validated wind speed and direction at 10 m and 80 m above ground level at a 1-km spatial resolution over the South Korea. Statistical verification results indicate that Pleim and YSU PBL schemes are in good agreement with observations at 10 m above ground level, while the MYJ scheme produced predictions similar to the observed wind speed at 80 m above ground level. LSM comparisons indicate that the RUC model performs best in predicting 10-m and 80-m wind speed. It is found that MYJ (PBL) - RUC (LSM) simulations yielded the best results for wind field in the surface layer. The choice of PBL and LSM parameterization will contribute to more accurate wind predictions for air quality studies and wind power using WRF.

Effect of Zincate Treatment of As-Cast AZ91 Mg Alloy on Electrodeposition of Copper in a Copper Pyrophosphate Bath

  • Nguyen, Van Phuong;Park, Min-Sik;Yim, Chang Dong;You, Bong Sun;Moon, Sungmo
    • Journal of the Korean institute of surface engineering
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    • v.49 no.5
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    • pp.401-407
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    • 2016
  • In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.