A Study of Intermetallic Compound Growth in the Sn/Cu and Sn/Ni Couples (II) : Sheet Resistance and Solderability Changes (Sn/Cu 및 Sn/Ni 계면에서 금속간화합물 형성 및 성장에 관한 연구(II))
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- Journal of Surface Science and Engineering
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- v.22 no.2
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- pp.47-54
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- 1989