• 한국세라믹학회지
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• 제36권4호
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• pp.391-402
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• 1999

Characteristics of composite electrolytes which were prepared by coating a thin film of YSZ (yttria sta-bilized zirconia : (ZrO2)0.92 (Y2O3)0.08) on YDC (yttria doped ceria : Ce0.8Y0.2O1.9) with mixed conductivity have been investigated in order to develop the low-temperature solid oxide fuel cell. The thickness (t) of spin-coated YSZ thin films after the heat-treatment at 600$^{\circ}C$ was increased proportionally to the sol con-centrations (C) while the decrease in its thickness with the spin rate ($\omega$) could be expressed in the e-quation of ln t=9.49-0.53 ln $\omega$(0.99mol//s sol conc.) When the sol concentration and the spin rate being less than 0.99 mol/l and higher than 1000 rpm respectively reliable YSZ/YDC composite electrolytes could be obtained by multi-coating although several micro-cracks were observed in singly coated YSZ film surfaces. The dense YSZ film with a 1$\mu\textrm{m}$ thickness was prepared by coating of 0.99 mol/l YSZ sol five-times at 2000 rpm followed by heat-treatment at 1400$^{\circ}C$ for 2h, The adhesion between YSZ film and YDC substrate was found to be very good. The open circuit voltages of H2/O2 single cell with YSZ/YDC composite electrolytes were 0.79∼0.82 V at 800$^{\circ}C$ and 0.75∼0.77V at 900$^{\circ}C$ The open circuit voltage was inversely proportioned to the thickness ratio of YSZ thin film (1$\mu\textrm{m}$) to YDC substrate(0.28-2.22 mm)

• 한국자기학회지
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• 제11권3호
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• pp.97-103
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• 2001

Water-based 졸겔 증착법을 이용하여 디결정체 La$_{2}$3/Sr$_{1}$3/MnO$_3$(LSMO) 박막을 2000$\AA$ 두께의 열 산화층을 갖는 Si(100) 기판상에 제조하여 상온에서 LSMO박막의 두께변화 따른 저 자장영역(120 Oe)에서의 터널형 자기저항 변화를 연구하였다. XRD 회절분석 결과 단일상의 페롭스카이트 결정구조임을 알 수 있었으며 RBS 스펙트럼 분석결과 박막의 조성비 La:Sr:Mn:O는 0.67:0.33:1.0:3.0임을 알 수 있었다. LSMO 박막의 자성특성 측정결과 두께 증가에 따라 포화자화는 750$\AA$까지 급격한 증가현상을 보이다 150$\AA$을 기점으로 점차 감소하는 경향을 나타내고 있으며, 보자력은 800 $\AA$ 까지 급격한 증가를 보이다 일정해지는 경향을 볼 수 있었다. 저 자장영역에서의 터널형 자기저항 변화비는 약 1500 $\AA$의 두께 영역에서 최대값을 나타냄을 알 수 있었다. 이러한 저 자장 영역에서 LSMO 박막의 터널형 자기저항 변화비의 두께 의존성은 LSMO 박막과 Si 기판의 계면에 존재하는 상호확산 현상에 의한 dead layer의 존재 및 LSMO 박막의 열처리시 발생되는 열 격자 변형 효과로 설명하였다.

• 한국자기학회지
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• 제8권5호
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• pp.288-294
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• 1998

기판/Ta/NiFe/Cu/NiFe/FeMn/Ta 스핀밸브에서 Ta 성막 후에 자유층 NiFe 스퍼터 증착시 가해진 기판 바이어스 전압에 의해 야기된 Ta/NiFe 계면에서의 원자섞임이 자기저항에 미치는 영향에 대해 조사하였다. 최대 자기 저항비 (MR ratio)를 나타내는 자유층의 적정두께는 바이어스 전압이 증가함에 따라 증가하였다. 이러한 현상의 원인은 바이러스 전압이 증가함에 따라 Ta과 NiFe의 원자섞임으로 계면에 있는 NiFe층 일부가 약한 강자성 또는 상자성화되어 스핀 비의존 산란을 하는 원자섞임층의 두께가 증가하였기 때문이다. 원자섞임층의 존재는 전기저항 변화와 자화량 변화로부터 증명하였다. 또 본 실험에서 비록 NiFe 증착시 기판 바이어스 전압이 변화더라도 최대 자기저항비를 갖는 최적 "유효" 자유층 두께는 기판 바이어스 전압에 무관하게 일정하였다.관하게 일정하였다.

• 한국재료학회지
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• 제25권1호
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• pp.54-59
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• 2015

Glancing angle deposition (GLAD) is a powerful technique to control the morphology and microstructure of thin film prepared by physical vapor deposition. Chromium (Cr) thin films were deposited on a polymer substrate by a sputtering technique using GLAD. The change in thickness and Vickers microhardness for the samples was observed with a change in the glancing angle. The adhesion properties of the critical load (Lc) by a scratch tester for the samples were also measured with varying the glancing angle. The critical load, thickness and Vickers microhardness for the samples decreased with an increase in the glancing angle. However, the thickness of the Cr thin film prepared at a $90^{\circ}$ glancing angle showed a relatively large value of 50 % compared to that of the sample prepared at $0^{\circ}$. The results of X-ray diffraction and scanning electron microscopy demonstrated that the effect of GLAD on the microstructure of samples prepared by sputter technique was not as remarkable as the samples prepared by evaporation technique. The relatively small change in thickness and microstructure of the Cr thin film is due to the superior step-coverage properties of the sputter technique.

• Current Photovoltaic Research
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• 제9권4호
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• pp.128-132
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• 2021

Advances in screen printing technology have been led to development of high efficiency silicon solar cells. As a post PERx structure, an n-type wafer-based rear side TOPCon structure has been actively researched for further open-circuit voltage (Voc) improvement. In the case of the metal contact of the TOPCon structure, the poly-Si thickness is very important because the passivation of the substrate will be degraded when the metal paste penetrates until substrate. However, the thin poly-Si layer has advantages in terms of current density due to reduction of parasitic absorption. Therefore, poly-Si thickness and firing temperature must be considered to optimize the metal contact of the TOPCon structure. In this paper, we varied poly-Si thickness and firing peak temperature to evaluate metal induced recombination (Jom) and contact resistivity. Jom was evaluated by using PL imaging technique which does not require both side metal contact. As a results, we realized that the SiN_x deposition conditions can affect the metal contact of the TOPCon structure.

• 대한금속재료학회지
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• 제47권5호
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• 한국세라믹학회지
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• 제37권5호
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• pp.425-431
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• 2000

Cobalt ferrite thin films on Corming glass substrate were fabricated by a sol-gel method. Cobalt ferrite thin films with the grain size of 20-35 nm and thickness of 50nm were obtained. Rapid thermal annealing (RTA) and Annealing processes were adopted for comparison of characteristics of the films. Coercivity values were changed with thermal condition and magnetization values were increased as a function of soaking time. With prolonged soaking time, however, it was decreased because of the diffusion of cations from the glass substrate. The RTA process in preparation of cobalt ferrite thin film was the effective way to prevent and to form a single spinel phase in reduced soaking time. The film heated at 600$^{\circ}C$ for 30 minutes by RTA had coercivity of 2,600 Oe, saturation magnetization 460 emu/㎤, and Mr$.$$\delta$ of 1.43 memu/$\textrm{cm}^2$.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.1664-1667
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• 2003

Aperture-coupled microstrip antenna is one type of microstrip antennas. This type of antenna has bandwidth wider than simple microstrip antenna. Herein, we use two substrates, that have the same dielectric constant 2.47 (PTFE-quartz) in which upper substrate is a rectangular patch. The microstrip patch is fed by a microstrip line which is printed on lower substrate, through an aperture or slot in the common ground plane of patch and microstrip feed. This antenna is analyzed by using Finite Difference Time Domain (FDTD) method the specific design frequency 10 GHz and match impedance is 50 ohms. The simulation results of its characteristics are input impedance, return loss, VSWR and radiation patterns respectively.

• 한국결정성장학회지
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• 제14권5호
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• pp.215-219
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• 2004

ZnO 에피박막을 사파이어 기판의 (0001)면 상에 RF magnetron sputtering 법으로 성장하였다. 박막의 성장속도는 약 0.1~0.2$\mu\textrm{m}$/hr 였으며, 기판온도가 $600^{\circ}C$일 때, 약 400~500nm두께의 단결정상의 박막을 성장할 수 있었다. 성장된 단결정상 박막에 대하여 XRD분석과 TEM을 이용하여 박막의 품질과 미세구조를 평가하였다.

• 한국지능정보시스템학회:학술대회논문집
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• 한국지능정보시스템학회 2001년도 The Pacific Aisan Confrence On Intelligent Systems 2001
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.